Provided is a waterborne resin crosslinking agent and the like capable of inhibiting lowering of gloss (relative specular glossiness) of cured films (waterborne resin coating films) after heating. The waterborne resin crosslinking agent includes a polycarbodiimide compound (A) and a polycarbodiimide compound (B); the polycarbodiimide compound (A) has a structure in which isocyanate groups at both terminals are each capped with a hydrophilic organic compound, and at least one of the hydrophilic organic compounds has a molecular weight of 340 or more; the polycarbodiimide compound (B) has a structure in which isocyanate groups at both terminals are each capped with a monool compound having 3 to 18 carbon atoms; when the monool compound has 3 to 17 carbon atoms, the polycarbodiimide compound (A) is in an amount of 5 to 95 parts by mass per 100 parts by mass in total of the polycarbodiimide compound (A) and the polycarbodiimide compound (B); and when the monool compound has 18 carbon atoms, the polycarbodiimide compound (A) is in an amount of 30 to 70 parts by mass per 100 parts by mass in total of the polycarbodiimide compound (A) and the polycarbodiimide compound (B).

An alignment coating method for a substrate includes providing at least one substrate and at least one alignment plate, covering the alignment plate on to the substrate, coating polyimide liquid on the alignment plate, and transferring a polyimide liquid on the alignment plate to a region out of a blind via on the substrate according to a preset printing direction through a printing mechanism. Each of the substrates has the blind via. The alignment plate has at least one opening. The opening corresponds to the blind via.

Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.

The present disclosure provides an apparatus for removing bubbles in a flexible substrate. The flexible substrate includes a baseplate and a polyimide layer coated on the baseplate. The apparatus includes a chamber including a top wall, a sidewall, and a bottom wall, wherein the top wall, the sidewall, and the bottom wall define an accommodation space; a heating plate disposed in the accommodation space; and a cooling conduit embedded in at least one of the top wall and the sidewall of the chamber.

Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.

A method of forming a functionalized device substrate is provided that includes the steps of: forming a conductive layer on a growth substrate; applying a polymeric layer to a device substrate, wherein a coupling agent couples the polymeric layer to the device substrate; coupling the polymeric layer to the conductive layer on the growth substrate; and peeling the growth substrate from the conductive layer.

The present invention addresses the problem of providing a flexible electronic element substrate comprising a polyimide layer that has both low ultraviolet transmittance and high visible light transmittance and that is capable of suppressing ultraviolet degradation without any reduction in the performance of an electronic element. In order to solve this problem, the flexible electronic element substrate comprises a polyimide layer that satisfies all of (1) through (3) below: (1) maximum transmittance at a wavelength of 400±5 nm is 70% or higher at a thickness of 5 μm; (2) the b* value in an L*a*b* color system is 5 or less at a thickness of 5 μm; and (3) transmittance of light at a wavelength of 350 nm is 10% or less at a thickness of 5 μm.

Provided are a mixed water-based dispersion of polyimide-fluororesin-polar crystal particulates with excellent handleability (e.g. safety, environmental burden, equipment cost) as well as excellent adhesion performance and heat resistance performance without the use of an organic solvent, and a method of producing the same, and a new method of coating. A mixed aqueous dispersion of polyimide-fluororesin-polar crystal particulates according to the present invention comprises a polyimide, fluororesin, polar crystal particulates, and water.

A method for avoiding warping of a substrate, a method for manufacturing a display panel, and a display panel. The method for avoiding warping of a substrate includes: providing a substrate, forming an amphiphilic material layer on the substrate, and forming a polyimide layer on the amphiphilic material layer, the amphiphilic material layer being at least located below an edge portion of the polyimide layer, and a curing temperature of the polyimide layer being higher than a critical solution temperature of the amphiphilic material layer.

A laminated film has a resin layer on at least one surface of a polyester film, in which the resin layer is on at least one surface layer, the water contact angle of the resin layer is 85°-100°, inclusive, and |H2−H1|≤1.0 (%) is satisfied, H1 (%) being the haze of the laminated film and H2 (%) being the haze of the laminated film after being immersed in a solvent and subjected to a rub test. This laminated film has excellent coating and releasability properties with respect to ceramic slurry.