Provided is a method for producing a heat sink that can easily and effectively form a heat radiating film on the surface of a substrate without requiring enormous heat energy for increasing the temperature of the substrate. The method is a method for producing a heat sink having a substrate and a heat radiating film formed on the surface of the substrate, including a first step of casting a substrate by injecting molten metal into a cavity of molding dies; and a second step of applying a heat radiating coating to the substrate through spraying or dropping in the period from when the molding dies are opened after the casting until when the temperature of the substrate that has been cast becomes lower than the deposition temperature that is a temperature necessary to deposit the heat radiating coating on the substrate.

Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.

The disclosure provides a polymer used for orientation film material and a method for preparing an orientation film. The polymer is formed by siloxane connecting with polyimide. The pre-tilt angle of liquid crystal molecules can be controlled within a wide range by controlling the content of siloxane in polymer, and the polymer has great heat resistance and mechanical properties. The method for preparing an orientation film of the disclosure comprises forming a precursor of orientation film by dissolving siloxane and precursor of polyimide (diamine monomer, dianhydride monomer) in a solvent, coating the precursor of orientation film on a substrate, and obtaining the orientation film after pre-solidifying and main-solidifying, the steps are simple and the prepared orientation film has a wide range of pre-tilt angle, such that the pre-tilt angle of liquid crystal molecules in the liquid crystal panels of the orientation film can be controlled within a wide range.

This disclosure relates to a dielectric film-forming composition that includes (a) at least one resin selected from the group consisting of: i) a fully imidized polyimide polymer; ii) a polyamic acid ester; iii) a cyclized polydiene resin; and iv) a mixture of a cyclized polydiene resin and a cyanate ester compound; and (b) at least one additive selected from a group consisting of: i) a polybenzoxazole (PBO) precursor; ii) PBO particles; iii) a mixture of PBO and silica particles; and iv) a PBO resin containing at least two reactive functional groups.

Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.

A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.

A method for curing photosensitive polyimide (PSPI) films includes the steps of: depositing a PSPI film on a selected substrate, and curing the film by microwave heating at a selected temperature from about 200 to 340 C. in a selected atmosphere containing an oxygen concentration from about 20 to 200,000 ppm. The process atmosphere may be static or flowing. The addition of oxygen improves the removal of acrylate residue and improves the T.sub.g of the cured film, while the low processing temperature characteristic of the microwave process prevents the oxygen from damaging the polyimide backbone. The method may further include the steps of photopatterning and developing the PSPI film prior to curing. The process is particularly suitable for dielectric films on silicon for electronic applications.

Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

Provided is an aqueous composition including a polyimide or a polyamide-imide or a polyamide-amidic acid, as well as a Lewis base, a polar aprotic solvent, and at least 15% water compared to the total weight of said composition, wherein the Lewis base is an aminosilane or a silazane.

A coating composition that can form a coating film excellent in sliding properties and abrasion resistance. The coating composition includes a particle of tetrafluoroethylene/hexafluoropropylene copolymer, a binder resin and a liquid medium, where the above binder resin is at least one selected from the group consisting of a polyamide-imide resin, a polyetherimide resin, a polyimide resin, and a polyaryl ether ketone resin; and the above particle of the tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate of 10 to 25 (g/10 min), a melting point of 270 C. or lower, and a median diameter (D50) of 0.1 to less than 10 m, and a mass ratio of the above particle of the tetrafluoroethylene/hexafluoropropylene copolymer to the above binder resin is 55/45 to 94/6.