A horn disclosed herein is a horn that transmits ultrasonic vibration to workpiece to be joined and includes a base portion and a tip end portion that protrudes from the base portion and is pressed against the workpiece. At least a portion of the tip end portion is a frame-like raised portion formed into substantially a frame shape. The frame-like raised portion may be formed into a rectangular shape. As a portion of the tip end portion, an inner raised portion may be provided inside the frame-like raised portion.

A horn disclosed herein is a horn that transmits ultrasonic vibration to workpiece to be joined and includes a base portion and a tip end portion that protrudes from the base portion and is pressed against the workpiece. At least a portion of the tip end portion is a frame-like raised portion formed into substantially a frame shape. The frame-like raised portion may be formed into a rectangular shape. As a portion of the tip end portion, an inner raised portion may be provided inside the frame-like raised portion.

A method of fabricating and controlling a thick-film transducer array for steering and focusing ultrasonic waves within a substrate volume is provided. A ceramic film composition can be coated on a substrate volume in one or more layers. The ceramic film can be masked with a plastic sheet out of which an electrode pattern is cut. Conductive electrode material can be applied to the pattern to create a transducer array that can be polarized with an applied electric field. A method of controlling a thick-film transducer array comprises exciting one or more array elements to generate a wavefield in a substrate volume, the wavefield can be reflected by features within the substrate volume, one or more array elements can receive reflected wavefield signals, and images of the insonified substrate volume can be generated.

A brush cleaner control device includes a housing disposed with an adapter. The adapter is disposed with a brush. A control circuit is disposed in the housing, and the control circuit includes a power supply, a MCU based controller, a switch control circuit, a driving circuit, a speed adjustment circuit, a vibration control circuit and a vibration motor. The power supply is used to supply the MCU based controller with power, the MCU based controller is used to control the driving circuit through the switch control circuit, the driving circuit is used to drive the vibration control circuit through the speed adjustment circuit, and the vibration control circuit is used to control the vibration motor. Therefore, the brush cleaner control device is with high intelligence, diverse functions, flexible control, easy to use and can be controlled wirelessly.

In one embodiment, a transducer comprises a first piezoelectric stack comprising a piezoelectric material; a first layer in contact with the piezoelectric stack; and a base structure beneath the first layer. The first layer has a first displacement between a first portion of the base structure and the first layer, and the first displacement is configurable by a first bias voltage received by the transducer.

An ultrasonic surgical tool system with a tip capable of simultaneously vibrating in plural modes. The system includes a console capable of supplying a drive signal to the tip that includes plural components. Each component has a frequency characteristic that is based in part on the equivalent of current through the mechanical components of the tip. The frequency components are different from each other. Based on the application of drive signal the tip undergoes non-linear vibrations.

A method for controlling at least two mechanical oscillators, more particularly in a motor vehicle, where each oscillator oscillates at a frequency during operation and where the frequency can be controlled by the power applied to the oscillators, includes arranging a single sound transducer at a distance from the oscillators and capturing an electrical signal, where the electrical signal is subjected to a Fourier transform and thus a Fourier spectrum is determined. The frequency of each oscillator is determined from extreme values of the Fourier spectrum.

Multifunctional ultrasound systems and methods for body section registration and mapping of microbubble dynamics. A system is provided that includes one or more micromachined ultrasonic transducer arrays (MUTAs) configured to capture a high-resolution image of at least a portion of a body section using ultrasound and monitor microbubble activity during ultrasound treatment. The system includes an image registration module configured to spatially register the high-resolution image with a reference image. The system includes electronics configured to control one or more of drive signal amplitude, frequency filtering, multiplexing, and DC bias voltage. The system can be configured to control ultrasound treatment based on the monitoring of the microbubble activity during treatment.

A multi-frequency ultrasound therapy apparatus is configured to operate at its center frequency and at the higher harmonic of its center frequency. The center frequency can be for the entire apparatus or for each ultrasound source element. At least one source element can generate ultrasound energy at its center frequency while, simultaneously, at least another source element can generate ultrasound energy at the higher harmonic of its center frequency. In addition, the same source element can generate ultrasound energy at its center frequency and the higher harmonic of its center frequency, respectively, but at different times. A data storage unit that stores encrypted and encoded data is disposed on the apparatus. The encoded data includes a unique identification code of the apparatus, the condition of use of the apparatus, the center frequency of each source element, the ultrasound efficiency of each source element, and/or other parameters relating to the apparatus.

Disclosed is a multi-silicon on insulator (SOI) micromachined ultrasonic transducer (MUT) device. The device comprises a multi-SOI substrate and a MUT. The MUT is affixed to a surface of the multi-SOI substrate. The multi-SOI substrate has a first SOI layer and at least a second SOI layer disposed above the first SOI layer. The first SOI layer and the second SOI layer each comprise an insulating layer and a semiconducting layer. The first SOI layer further defines a cavity located under a membrane of a MUT and one or more trenches at least partially around a perimeter of the cavity.