A modular some vibration buffer system includes an adapter assembly that can be attached to a sonic vibration device. The adapter assembly includes a body with apertures and a plate with arms that are received in the apertures of the body to couple the plate to the body. A cleaning tool is secured between the body and the plate to couple the cleaning tool to the adapter assembly. The sonic vibration device is operable to vibrate the cleaning tool via the adapter assembly. The system also includes additional adapter assemblies and cleaning tools with different characteristics that are attachable to the sonic vibration device in a modular nature for different cleaning or buffering applications.

A modular some vibration buffer system includes an adapter assembly that can be attached to a sonic vibration device. The adapter assembly includes a body with apertures and a plate with arms that are received in the apertures of the body to couple the plate to the body. A cleaning tool is secured between the body and the plate to couple the cleaning tool to the adapter assembly. The sonic vibration device is operable to vibrate the cleaning tool via the adapter assembly. The system also includes additional adapter assemblies and cleaning tools with different characteristics that are attachable to the sonic vibration device in a modular nature for different cleaning or buffering applications.

The invention provides devices and methods for adjusting particle size in nanoemulsions of fluorocarbons and perfluorocarbons (e.g., perfluoropentane and perfluorohexane) via sonication (e.g., ultrasonication).

The invention provides devices and methods for adjusting particle size in nanoemulsions of fluorocarbons and perfluorocarbons (e.g., perfluoropentane and perfluorohexane) via sonication (e.g., ultrasonication).

A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking the photoresist material, exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.

An object of the present invention is to provide an actuator capable of reducing a shock in acceleration at the time of a turn caused by a load in a lateral direction orthogonal to an axis of the actuator even when the load is excessive while reducing manufacturing cost and manufacturing man-hours, and a tripod structure including the actuator. An actuator according to the present invention includes: a pipe; a ball screw used as a feed screw; a conversion nut used as a feed nut and screwed with the ball screw; a piston fixed integrally to the conversion nut and driven to expand and contract from a free end which is one end of the pipe; and a rolling bearing unit being provided on a tip of the free end of the pipe and including a plurality of roller followers holding the piston movably.

A tactile vibration generator includes a supporting block, a vibration plate, and a vibration actuator. The vibration plate includes two parts. The vibration actuator is attached to a surface of the first part and the first part is not in contact with the supporting block to reduce transferring vibration to the supporting block. The second part is fixed to the supporting block.

A modular sonic vibration buffer system includes an adapter assembly that can be attached to a sonic vibration device. The adapter assembly includes a body with apertures and a plate with arms that are received in the apertures of the body to couple the plate to the body. A cleaning tool is secured between the body and the plate to couple the cleaning tool to the adapter assembly. The sonic vibration device is operable to vibrate the cleaning tool via the adapter assembly. The system also includes additional adapter assemblies and cleaning tools with different characteristics that are attachable to the sonic vibration device in a modular nature for different cleaning or buffering applications.

A modular sonic vibration buffer system includes an adapter assembly that can be attached to a sonic vibration device. The adapter assembly includes a body with apertures and a plate with arms that are received in the apertures of the body to couple the plate to the body. A cleaning tool is secured between the body and the plate to couple the cleaning tool to the adapter assembly. The sonic vibration device is operable to vibrate the cleaning tool via the adapter assembly. The system also includes additional adapter assemblies and cleaning tools with different characteristics that are attachable to the sonic vibration device in a modular nature for different cleaning or buffering applications.

Disclosed are various techniques operating a linear resonant actuator (LRA). In some aspects, a method for operating an LRA includes generating an LRA control signal having a period, the period having an active portion and a high-Z portion according to a duty cycle; detecting, during the high-Z portion of the period, a back electromotive force (BEMF) threshold voltage crossing time and zero voltage crossing time; calculating a period; calculating a BEMF measurement window; calculating a target duty cycle based on the period, the BEMF measurement window, and a margin time; and adjusting the duty cycle of the LRA control signal towards the target duty cycle.