An ultrasonic vibrator driving apparatus performs driving by applying an alternating voltage as a drive voltage to an ultrasonic vibrator that includes a piezoelectric element and has a unique resonance frequency. The drive voltage is generated with a variable frequency in a frequency range including the resonance frequency of the ultrasonic vibrator. The frequency of the drive voltage is repeatedly swept with a predetermined sweep width and a predetermined sweep period so as to include the resonance frequency, based on a reference frequency set according to the resonance frequency of the ultrasonic vibrator. The sweep period and the sweep width are restricted by being associated so as to fall within a predetermined allowed range on a two-dimensional map divided by the sweep period and the sweep width.

The present invention concerns an ultrasonic vibration unit having a converter (1) for converting an electric ac voltage into a mechanical ultrasonic vibration and a sonotrode which is vibrationally coupled to the converter (1), wherein the sonotrode and the converter (1) are matched to each other in such a way that the ultrasonic vibration unit can vibrate with a natural frequency f, in which a standing longitudinal wave having at least one vibration node and at least two vibration antinodes is formed within the ultrasonic vibration unit. To provide an ultrasonic vibration unit in which the parasitic vibrations which usually occur in operation with a working frequency are slight or do not occur, wherein at the same time the actual working frequency is not attenuated, it is proposed according to the invention that there is provided a damp vibration absorber unit (2) connected to the ultrasonic vibration unit by way of a coupling element (3), wherein the coupling element (3) is connected to the ultrasonic vibration unit at a vibration node, wherein the vibration absorber unit (2) is connected to a damping element (4) which is so adapted that it damps a vibration of the vibration absorber unit (2).

The present invention concerns an ultrasonic vibration unit having a converter (1) for converting an electric ac voltage into a mechanical ultrasonic vibration and a sonotrode which is vibrationally coupled to the converter (1), wherein the sonotrode and the converter (1) are matched to each other in such a way that the ultrasonic vibration unit can vibrate with a natural frequency f, in which a standing longitudinal wave having at least one vibration node and at least two vibration antinodes is formed within the ultrasonic vibration unit. To provide an ultrasonic vibration unit in which the parasitic vibrations which usually occur in operation with a working frequency are slight or do not occur, wherein at the same time the actual working frequency is not attenuated, it is proposed according to the invention that there is provided a damp vibration absorber unit (2) connected to the ultrasonic vibration unit by way of a coupling element (3), wherein the coupling element (3) is connected to the ultrasonic vibration unit at a vibration node, wherein the vibration absorber unit (2) is connected to a damping element (4) which is so adapted that it damps a vibration of the vibration absorber unit (2).

A cutting device of cutting a soft honeycomb mold body in a cutting direction perpendicular to an axial direction of the honeycomb mold body. A cutting device has a wire, a tension supply part and a pair of ultrasonic generators. The wire has a contact part which is stretched and in contact with the honeycomb mold body when the honeycomb mold body is cut. The tension supply part supplies tensile to the contact part when the honeycomb mold body is cut. The pair of ultrasonic generators have respective vibrator terminals arranged in contact with the contact part of the wire. The ultrasonic generators generate ultrasonic vibration in the cutting direction and supply the generated ultrasonic vibration directly to the wire.

The present invention relates to a method for intermittent ultrasonic processing of a length of material, wherein a length of material is moved through between a sonotrode and a counter-tool and the length of material is processed intermittently. In order to specify a method for intermittent ultrasonic processing of a length of material by which the disadvantages of the prior art can be avoided or at least reduced, according to the invention it is suggested that in a processing interval the sonotrode is stimulated by an ultrasonic oscillation with an oscillation amplitude A and in a movement interval the sonotrode is stimulated with an oscillation amplitude B, wherein B<A and during the processing interval and during the movement interval the length of material touches both the sonotrode and also the counter-tool.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

A floating non-contact ultrasonic enhanced flexible sub-aperture polishing device and method are disclosed, an X-axis moving platform, a Y-axis moving platform, a Z-axis moving platform and a workpiece swinging platform in linkage control ensure normal lines of a tool and a workpiece are kept at an identical angle to realize sub-aperture processing; the ventilation main shaft acts air pressure on the ball spline's end portion to form an axial thrust to let the tool axially float; a dynamic balance among hydrodynamic pressure, air pressure and dynamic pressure is performed on the polishing liquid by rotation of the flexible tool; a tiny gap between the tool and workpiece is formed by elastic deformation of the flexible tool due to the dynamic pressure; a shearing force for removing materials is generated when the polishing liquid flows through the gap; a cavitation effect in the gap is formed by ultrasonic waves.

A floating non-contact ultrasonic enhanced flexible sub-aperture polishing device and method are disclosed, an X-axis moving platform, a Y-axis moving platform, a Z-axis moving platform and a workpiece swinging platform in linkage control ensure normal lines of a tool and a workpiece are kept at an identical angle to realize sub-aperture processing; the ventilation main shaft acts air pressure on the ball spline's end portion to form an axial thrust to let the tool axially float; a dynamic balance among hydrodynamic pressure, air pressure and dynamic pressure is performed on the polishing liquid by rotation of the flexible tool; a tiny gap between the tool and workpiece is formed by elastic deformation of the flexible tool due to the dynamic pressure; a shearing force for removing materials is generated when the polishing liquid flows through the gap; a cavitation effect in the gap is formed by ultrasonic waves.

An embodiment of the present invention provides an ultrasonic wave amplifying unit which can improve ultrasonic power in air, wherein the ultrasonic wave amplifying unit includes multiple rings having a concentric axis and each having a first width, and a slit having a second width is formed between the rings and an air layer is formed between the multiple rings and an ultrasonic wave generator generating ultrasonic waves or a transfer medium transferring the ultrasonic waves.