The present invention relates to a method for intermittent ultrasonic processing of a length of material, wherein a length of material is moved through between a sonotrode and a counter-tool and the length of material is processed intermittently. In order to specify a method for intermittent ultrasonic processing of a length of material by which the disadvantages of the prior art can be avoided or at least reduced, according to the invention it is suggested that in a processing interval the sonotrode is stimulated by an ultrasonic oscillation with an oscillation amplitude A and in a movement interval the sonotrode is stimulated with an oscillation amplitude B, wherein B<A and during the processing interval and during the movement interval the length of material touches both the sonotrode and also the counter-tool.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Methods for creating undulating structures are disclosed in which an elastic sheet and a rigid restraining member having different curvatures are joined. The structures incorporate stopping members, such as stopped grooves, to manage the transverse deformations of the elastic sheet. The joint is such that the transverse deformations may migrate along the undulating structure in a coordinated, wave, either to gather kinetic energy, or to propel the structure relative to a fluid. To facilitate such a wave, the elastic sheet can be joined to the retaining member via passive stopping members that oscillate about their points of attachment to the retaining member. These are also constructed to limit the elastic sheet from reverting to its original configuration. The retaining member can be annular structures, and the elastic sheet members can be tubular. Stopping members can be actuated to power the transverse deformations of the elastic sheet to oscillate.

A structure 100 according to an embodiment of the present disclosure includes: a vibration part 110 configured to hold a vibrating member; a housing 120 configured to at least partially house the vibration part 110; and supporting parts 130SR, 130SL configured to support the vibration part 110 by coupling the vibration part 110 and the housing 120, wherein the supporting parts 130SR, 130SL are each configured to have a dynamic stiffness that amplifies or attenuates transmission of a vibration of at least a predetermined frequency in vibrations generated in at least one direction by the vibration part 110 in a state of holding the vibrating member, and a static stiffness required for supporting the vibration part 110 in the state of holding the vibrating member. A system including the structure 100 and the vibrating member has characteristics in which a vibration transmittance gradually decreases, as a vibration frequency of the vibration in the at least one direction increases, after exhibiting an excited vibration mode in which the vibration transmittance is increased. The supporting parts 130SR, 130SL have the dynamic stiffness that exhibits the excited vibration mode such that the vibration transmittance at the predetermined frequency is greater or smaller than 1.

A structure 100 according to an embodiment of the present disclosure includes: a vibration part 110 configured to hold a vibrating member; a housing 120 configured to at least partially house the vibration part 110; and supporting parts 130SR, 130SL configured to support the vibration part 110 by coupling the vibration part 110 and the housing 120, wherein the supporting parts 130SR, 130SL are each configured to have a dynamic stiffness that amplifies or attenuates transmission of a vibration of at least a predetermined frequency in vibrations generated in at least one direction by the vibration part 110 in a state of holding the vibrating member, and a static stiffness required for supporting the vibration part 110 in the state of holding the vibrating member. A system including the structure 100 and the vibrating member has characteristics in which a vibration transmittance gradually decreases, as a vibration frequency of the vibration in the at least one direction increases, after exhibiting an excited vibration mode in which the vibration transmittance is increased. The supporting parts 130SR, 130SL have the dynamic stiffness that exhibits the excited vibration mode such that the vibration transmittance at the predetermined frequency is greater or smaller than 1.

Disclosed is an ultrasonic wave transmission structure which is provided on a path of ultrasonic waves to amplify incident ultrasonic waves. The ultrasonic wave transmission structure includes: multiple rings each provided with a body portion having a different radius from other body portions and spaced apart from another body portion adjacent thereto and a slit disposed between adjacent body portions; and a membrane disposed in the multiple rings, wherein the mass of the membrane is adjusted to vary a resonant frequency in multiple sub-membrane regions.

Disclosed is an ultrasonic wave transmission structure which is provided on a path of ultrasonic waves to amplify incident ultrasonic waves. The ultrasonic wave transmission structure includes: multiple rings each provided with a body portion having a different radius from other body portions and spaced apart from another body portion adjacent thereto and a slit disposed between adjacent body portions; and a membrane disposed in the multiple rings, wherein the mass of the membrane is adjusted to vary a resonant frequency in multiple sub-membrane regions.

The present invention concerns an ultrasonic vibration system comprising a sonotrode which has two sonotrode end faces and a circumferentially extending lateral surface connecting the two sonotrode end faces together, wherein the sonotrode has an elongate core element and at least one wing element, wherein core element and wing element respectively extend from the one sonotrode end face to the other sonotrode end face in a longitudinal direction, wherein the wing element has a sealing surface which is provided to come into contact with a material for processing thereof and is connected to the core element by way of a plurality of webs spaced from each other in the longitudinal direction of the core element, and a converter which is optionally connected to the sonotrode by way of an amplitude transformer. According to the invention it is proposed that the ultrasonic vibration system is connected to a machine stand by way of a mounting connected to the lateral surface.

The present invention concerns an ultrasonic vibration system comprising a sonotrode which has two sonotrode end faces and a circumferentially extending lateral surface connecting the two sonotrode end faces together, wherein the sonotrode has an elongate core element and at least one wing element, wherein core element and wing element respectively extend from the one sonotrode end face to the other sonotrode end face in a longitudinal direction, wherein the wing element has a sealing surface which is provided to come into contact with a material for processing thereof and is connected to the core element by way of a plurality of webs spaced from each other in the longitudinal direction of the core element, and a converter which is optionally connected to the sonotrode by way of an amplitude transformer. According to the invention it is proposed that the ultrasonic vibration system is connected to a machine stand by way of a mounting connected to the lateral surface.