B06B3/02

Ultrasonic torsional tissue dissection utilizing subaltern modes of longitudinal-torsional resonators
09962183 · 2018-05-08 ·

A TL/T tip is made by scaling down the dimensions of an L/T tip by the ratio of the TL/T frequency to the L/T frequency so that the TL/T tip can operate by excitement from a transducer at the same frequency that would have produced L/T motion in the L/T tip. A reductive resonator may be included between the transducer and the TL/T tip.

VIBRATION DEVICE AND CAMERA

A vibration device that is used in a camera body including a lens includes a cylindrical vibrating body including a piezoelectric vibrator, a cylindrical mode converting connected member connected to one end of the cylindrical vibrating body, and a light transmitting body attached to the mode converting connected member. The light transmitting body includes a light transmitting portion disposed on a front side of the lens. The mode converting connected member includes a thin portion having a thickness smaller than a thickness of the cylindrical vibrating body.

LIGHTWEIGHT SOLAR MODULE BUILDING MATERIALS SET AND SOUND INSULATION WALL USING THE SET

A lightweight solar module building materials set includes a solar module, a perforated plate defining multiple perforations, and a support assembly which is essentially composed of a supportive plate and a honeycomb structure and can support the solar module and the perforated plate. The perforated plate, the honeycomb structure, and the supportive plate define multiple sound absorption compartments. Sound waves can enter the sound absorption compartments via the perforations of the perforated plate. The solar module includes a solar cell body, which is protected by a flexible transparent protective layer and supported by the support assembly, to conduct photoelectric conversion. The solar module building materials set can be mounted on an affixing means to construct a sound insulation wall, which can generate solar power and absorb sound waves. As such, the ratio of green energy supply and the comfort of life can be increased.

LIGHTWEIGHT SOLAR MODULE BUILDING MATERIALS SET AND SOUND INSULATION WALL USING THE SET

A lightweight solar module building materials set includes a solar module, a perforated plate defining multiple perforations, and a support assembly which is essentially composed of a supportive plate and a honeycomb structure and can support the solar module and the perforated plate. The perforated plate, the honeycomb structure, and the supportive plate define multiple sound absorption compartments. Sound waves can enter the sound absorption compartments via the perforations of the perforated plate. The solar module includes a solar cell body, which is protected by a flexible transparent protective layer and supported by the support assembly, to conduct photoelectric conversion. The solar module building materials set can be mounted on an affixing means to construct a sound insulation wall, which can generate solar power and absorb sound waves. As such, the ratio of green energy supply and the comfort of life can be increased.

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

METHOD FOR CLEANING SEMICONDUCTOR WAFERS

A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

DEVICE FOR MEASURING THE VIBRATIONAL AMPLITUDE OF A CAPILLARY TUBE OF A WIRE BONDER
20170016760 · 2017-01-19 ·

In a device for measuring the vibrational amplitude of a capillary tube of a wire bonder, the capillary tube is placed between a light source and a detector system, so that the vibrational amplitude is able to be ascertained from the shading of a beam of light by the capillary tube. The beam of light emitted by the light source is split into a measuring beam of light and a reference beam of light, an edge of the capillary tube at least partially shading the measuring beam of light in the vibrating state, while the reference beam of light is not shaded. The detector system includes a measuring detector assigned to the measuring beam of light as well as at least one reference detector assigned to the reference beam of light, and the vibrational amplitude of the capillary tube is ascertainable from the interconnected output signals of the measuring detector and the reference detector.