A system and method for ultrasonic sensing, wherein an ultrasonic receiver array includes multiple ultrasonic sensor pixels, and each sensor pixel includes an ultrasonic receiver configured to read an ultrasonic signal. An ultrasonic transmitter array, composed of multiple elements, transmits ultrasonic signals which may be reflected from an object and received at the ultrasonic receivers, wherein a sensor controller applies excitation signals to the transmitter array with a temporal delay between excitation signals.

In a method of segmented image acquisition at a sensor, a plurality of segments of an image are concurrently captured, wherein pixels of each segment of the plurality of segments are captured according to a pixel capture sequence. The pixel capture sequence for at least one segment of the plurality of segments is a non-progressive sequence for controlling a timing difference between pixel capture for proximate pixels of adjacent segments. The image including the plurality of segments is generated.

An intraluminal imaging device is provided that includes a flexible elongate member (115) configured for positioning within a body lumen of a patient, a support member (300) coupled to the flexible elongate member, and an imaging assembly (110) coupled to the support member. The support member can include a proximal section (310) configured to interface with a distal portion of the flexible elongate member and a distal section (320) configured to interface with a proximal end of the imaging assembly, wherein the proximal section has a first diameter and the distal section has a second diameter less than the first diameter.

An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector. The wiring area is formed by etching and filling with metal material.

A system and method for enhancing sensory function of an individual are disclosed. The system comprises a generalized brain-skin interface (GBSI), configured to enable the individual to experience senses. The system further comprises a sensor, a processor, and an epidermal neuro-oscillating patch (ENOP). The sensor is configured to receive environmental data surrounding the individual. The processor in communication with the sensor is configured to receive environmental data from the sensor and convert it into an analog vibration pattern. The epidermal neuro-oscillating patch (ENOP) is removably fastened to the skin of the individual, configured to produce a sequence of vibrations based on the analog vibration pattern received from the processor and directly transmit it to the skin for stimulating the nerves of the individual, thereby effectively training the brain of the individual to learn and equate the sequence of vibrations for experiencing senses of the physical environment of the individual.

The present approach relates to an interconnect structure (e.g., an electrical standoff) for use between two electrical components, such as a matrix transducer array and ASIC of an ultrasound probe and to the manufacture of such a structure. In accordance with certain embodiments, the interconnect structure provides electrical interconnection between electrical components and provides improved acoustic attenuation.

An ultrasonic measurement apparatus has an ultrasonic transducer device including an ultrasonic element array, a first through n-th first end-side terminal XA1 to XAn provided to a first end side, and a first through n-th second end-side terminal XB1 to XBn provided to a second end side opposing the first end side; a first transmission circuit outputting first drive signals VTA1 to VTAn to the first through n-th first end-side terminals XA1 to XAn; and a second transmission circuit outputting second drive signals VTB1 to VTBn to the first through n-th second end-side terminals XB1 to XBn.

Capacitors, each of which is electrically connected to a capacitor which is the cell of the CMUT mounted in a chip and is used as a DC block capacitor for protecting an amplifying circuit, are formed as many as plural aligned channels in the chip. The capacitor is an electrostatic capacitance element which is not vibrated acoustically.

An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.

The invention related to an ultrasound system comprising: an ultrasound array including at least one capacitive micromachined ultrasonic transducer device comprising a membrane coupled to a first electrode, a substrate opposing the membrane with a gas or vacuum cavity there between and coupled to a second and a third electrodes, wherein the second electrode opposes the first electrode in a peripheral region and the third electrode opposes the first electrode in a central region; at least one drive circuit coupled to the array. The system further comprises a high impedance resistor, which electrically couples to the second electrode and the third electrode and has an impedance value higher than an AC impedance between the first and the second electrodes, when the membrane of the CMUT device is in the collapsed state and the CMUT devices is activated at operating frequency.