An apparatus includes an ultrasonic sensor array and a sensor controller. The sensor array includes a plurality of ultrasonic sensor pixels, each sensor pixel including an ultrasonic receiver and a receiver bias electrode and being operable in one or both of a transmit mode of operation or a read mode of operation. The sensor controller is electrically coupled with the receiver bias electrodes. The sensor controller is configured to set, at each sensor pixel, a range gate window (RGW) by modulating a bias voltage applied to the receiver bias electrode and to set, for a first portion of the ultrasonic sensor pixels, a first RGW. The sensor controller is configured to set, for a second portion of the ultrasonic sensor pixels, a second RGW, and establish a first temporal delay between the first RGW and the second RGW.

A method for identifying a mechanical impedance of an electromagnetic load may include generating a waveform signal for driving an electromagnetic load, the waveform signal comprising a first tone at a first driving frequency and a second tone at a second driving frequency. The method may also include during driving of the electromagnetic load by the waveform signal or a signal derived therefrom, receiving a current signal representative of a current associated with the electromagnetic load and a back electromotive force signal representative of a back electromotive force associated with the electromagnetic load. The method may further include determining amplitude and phase information of the current signal responsive to the first tone and second tone, determining amplitude and phase information of the back electromotive force signal responsive to the first tone and second tone, and identifying parameters of the mechanical impedance of the electromagnetic load based on the amplitude and phase information of the current signal and the amplitude and phase information of the back electromotive force signal.

A system and method for ultrasonic sensing, wherein an ultrasonic receiver array includes multiple ultrasonic sensor pixels, and each sensor pixel includes an ultrasonic receiver configured to read an ultrasonic signal. An ultrasonic transmitter array, composed of multiple elements, transmits ultrasonic signals which may be reflected from an object and received at the ultrasonic receivers, wherein a sensor controller applies excitation signals to the transmitter array with a temporal delay between excitation signals.

Disclosed embodiments include illustrative piezoelectric element array assemblies, methods of fabricating a piezoelectric element array assembly, and systems and methods for shearing cellular material. Given by way of non-limiting example, an illustrative piezoelectric element array assembly includes at least one piezoelectric element configured to produce ultrasound energy responsive to amplified driving pulses. A lens layer is bonded to the at least one piezoelectric element. The lens layer has a plurality of lenses formed therein that are configured to focus ultrasound energy created by single ones of the at least one piezoelectric element into a plurality of wells of a microplate disposable in ultrasonic communication with the lens layer, wherein more than one of the plurality of lenses overlie single ones of the at least one piezoelectric element.

In a method of segmented image acquisition at a sensor, a plurality of segments of an image are concurrently captured, wherein pixels of each segment of the plurality of segments are captured according to a pixel capture sequence. The pixel capture sequence for at least one segment of the plurality of segments is a non-progressive sequence for controlling a timing difference between pixel capture for proximate pixels of adjacent segments. The image including the plurality of segments is generated.

The invention concerns: a method including a step of defining an acoustic transmission frequency according to the admittance of an acoustic generator; an acoustic transmitter including the acoustic generator, configured to define said acoustic transmission frequency according to the admittance of the generator; and an acoustic receiver configured to receive an acoustic transmission signal having said transmission frequency.

A wafer scale ultrasonic sensor assembly includes a wafer substrate, an ultrasonic element, first and second protective layers, conductive wires, a transmitting material, an ASIC, a conductive bump, and a soldering portion. The wafer substrate includes a via. The ultrasonic element is exposed to the via. The conductive wires are on the first protective layer and connected to the ultrasonic element. The second protective layer covers the conductive wires, and the second protective layer has an opening corresponding to the ultrasonic element. The transmitting material contacts the ultrasonic element. The ASIC is connected to the wafer substrate, so that the via forms a space between the ASIC and the ultrasonic element. The conductive pillar is in a via defined through the ASIC, the wafer substrate, and the first protective layer, and the conducive pillar is respectively connected to the conductive wires and the soldering portion.

Aspects of the technology described herein relate to sensing a fingerprint of a subject via an ultrasound fingerprint sensor. Certain aspects relate to transmitting and receiving ultrasound data at multiple different frequencies to provide sensing data from different depths within the skin of the subject. Since different ultrasound frequencies are expected to penetrate a subject's skin to different degrees, sensing a finger at multiple ultrasound frequencies may provide information on different physical aspects of the finger. For instance, sound ultrasound frequencies may sense a surface of the skin, whereas other ultrasound frequencies may penetrate through one or more of the epidermal, dermal or subcutaneous layers. The ultrasound fingerprint apparatus may have utility in various applications, including but not limited to mobile electronic devices, such as mobile phones or tablet computers, a laptop computer or biometric access equipment.

An ultrasonic signal detecting circuit, an ultrasonic signal detecting method, and a display panel. The ultrasonic signal detecting circuit includes a control sub-circuit and a sensing sub-circuit. The sensing sub-circuit detects an ultrasonic echo signal, and generates a piezoelectric signal, which includes a first sub-signal and a second sub-signal, according to the ultrasonic echo signal, the voltage value of one of the first and second sub-signals are higher than the value of a reference voltage signal, and that of the other one of the first and second sub signals are lower than the reference voltage signal. The control sub-circuit is electrically connected to the sensing sub-circuit. Under control of the first sub-signal a first power supply end and an output end of the control sub-circuit are fumed on; and under control of the second sub-signal, the first power supply end and the output end of the control sub-circuit are turned on.

An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.