Ultrasonic sensing approaches are described with integrated MEMS-CMOS implementations. Embodiments include ultrasonic sensor arrays for which PMUT structures of individual detector elements are at least partially integrated into the CMOS ASIC wafer. MEMS heating elements are integrated with the PMUT structures by integrating under the PMUT structures in the CMOS wafer and/or over the PMUT structures (e.g., in the protective layer). For example, embodiments can avoid wafer bonding and can reduce other post processing involved with conventional manufacturing of PMUT ultrasonic sensors, while also improving thermal response.

An ultrasonic fingerprint recognition assembly is provided. The ultrasonic fingerprint recognition assembly includes a cover plate, a display panel, and an ultrasonic sensor disposed between the cover plate and the display panel. The ultrasonic sensor includes a thin film transistor (TFT) substrate which is close to the display panel, and a piezoelectric layer and a conductive layer which are disposed on the TFT substrate sequentially. The piezoelectric layer is obtained by mixing a piezoelectric material with an organic solvent, coating a mixture of the piezoelectric material and the organic solvent on a substrate, and conducting crystallization and polarization treatment. The organic solvent includes at least one of: butanone, propylene glycol monomethyl ether acetate, and dimethylacetamide.

A piezoelectric polyvinylidene fluoride (PVDF) material, a method for manufacturing the same, and a fingerprint recognition module are provided. The polyvinylidene PVDF material includes PVDF, a first solvent, a second solvent, a fluorosurfactant, and an inducing material. Material of the inducing material is one of carbon nanotubes, carbon black, and gold nanorods. Because of the high anisotropy of the inducing material, molecular orientation of the PVDF material is induced, thereby improving piezoelectric performance of the piezoelectric PVDF material. Problems of conventional piezoelectric PVDF materials, which are used in ultrasonic fingerprint recognition modules, such as poor piezoelectric performance and high-energy loss are improved.

This application provides an ultrasonic fingerprint recognition module including: a base substrate; at least one ultrasonic wave signal receiver and at least one ultrasonic wave signal transmitter on the base substrate, which are on a same side of the base substrate and spaced apart from each other in a first direction parallel to the base substrate; a piezoelectric sensing layer on a side of the at least one ultrasonic wave signal transmitter and the at least one ultrasonic wave signal receiver distal to the base substrate; and an electrode layer on a side of the piezoelectric sensing layer distal to the base substrate.

A system for processing biological or other samples includes an array of transducer elements that are positioned to align with sample wells in a microplate. Each transducer element produces ultrasound energy that is focused towards a well of the microplate with sufficient acoustic pressure to cause inertial cavitation. In one embodiment, the transducers are configured to direct ultrasound energy into cylindrical wells. In other embodiments, the transducer elements are configured to direct ultrasound energy into non-cylindrical wells of a microplate.

A suspension aligning machine includes a bottom board, an intermediate board, a top board, actuation modules, a jig, and a control device. The intermediate board is mounted on a top of the bottom board by first supporting elements and has through holes. The top board is arranged above the intermediate board with supporting elements provided therebetween to have the top board floating and suspending above the intermediate board. The actuation modules are mounted under the top board and respectively extend through the through holes of the intermediate board and form a gap with respect to the bottom board. The operation of the actuation modules causes the top board to vibrate and incline and workpieces deposited in the jig mounted on the top board are caused to move in the jig and fall into the cavities of the jig to line up with each other and thus orderly arranged.

The present disclosure provides an ultrasonic module, an ultrasonic sensor and a display screen, and belongs to a display technical field, and may at least partly solve the problem that the current ultrasonic module has a low conversion rate of the ultrasonic wave. The present disclosure discloses an ultrasonic module including: a piezoelectric material layer; a first electrode unit arranged at a side of the piezoelectric material layer; and a second electrode unit arranged on a side of the piezoelectric material layer distal to the first electrode unit, wherein the second electrode unit includes a plurality of first sub-electrode layers and a plurality of first conductive elastic material blocks arranged at intervals along a direction parallel to an extending direction of the piezoelectric material layer, the plurality of first conductive elastic material blocks are arranged between the plurality of first sub-electrode layers and the piezoelectric material layer, and each of the plurality of first sub-electrode layers corresponds to a corresponding one of the plurality of first conductive elastic material blocks.

The present invention relates to a haptic feedback system and, particularly, to a device and a method for controlling an actuator for haptic feedback, the method comprising: a first step of controlling the output of an oscillator such that a clock necessary in the generation of a driving signal for driving an actuator is oscillated at a reference clock frequency; a second step of calculating the resonance frequency of the actuator from a cycle of a BEMF signal according to the driving of the actuator; and a third step of calculating a clock frequency for following the calculated resonance frequency of the actuator so as to newly change and set same to the reference clock frequency, thereby controlling the output of the oscillator.

The present disclosure provides an ultrasonic sensor pixel circuit, a driving method thereof and a display panel. The ultrasonic sensor pixel circuit includes a detection module, of which a first terminal is connected with an ultrasonic sensing unit and a second terminal is connected with a first signal terminal, and the detection module is configured to generate a detection voltage according to an electric signal output from the ultrasonic sensing unit under control of the first signal terminal; an output module, of which a first terminal is connected with a third terminal of the detection module and a second terminal is connected with a read line, and the output module is configured to generate an output signal according to the detection voltage and provide the output signal to the read line.

A vibration presentation apparatus (100) including: a connection plate (120); and a plurality of cells (110) spaced apart from each other on the connection plate (120), in which the cells (110) each include: a vibration device (112); a first elastic body (113); a vibration presentation plate (111) on which the vibration device (112) and the first elastic body (113) are disposed; and a support member (114) that is interposed between the first elastic body (113) and the connection plate (120), and supports the vibration presentation plate (111) through the first elastic body (113).