Patent classifications
B08B3/02
Brushless car wash system including a traveling module for washing side surfaces of vehicles
A brushless car wash system includes a variable width. The width of the brushless car wash system is adjusted according to a width of a vehicle being washed. By adjusting the width of the brushless car wash system, wash performance of the brushless car wash system is increased.
DEVICE FOR CLEANING A DRIVER ASSISTANCE CAMERA OF A MOTOR VEHICLE
A device for cleaning a camera lens (6), by means of a cleaning head, comprises a fixed cleaning head and a camera that is made mobile by means of drive means (10), the head being accommodated in a structural element (2) of the vehicle. The drive means are suitable for generating a relative movement of the camera in relation to the cleaning head, between a passive image capture position in which the camera is disposed accommodated in said structural element of the vehicle facing the cleaning head, and an active position in which the camera is deployed at a distance from the structural element of the vehicle to allow image capture. The device is particularly effective when applied to the cleaning of a reversing camera implanted in motor vehicles.
DEVICE FOR CLEANING A DRIVER ASSISTANCE CAMERA OF A MOTOR VEHICLE
A device for cleaning a camera lens (6), by means of a cleaning head, comprises a fixed cleaning head and a camera that is made mobile by means of drive means (10), the head being accommodated in a structural element (2) of the vehicle. The drive means are suitable for generating a relative movement of the camera in relation to the cleaning head, between a passive image capture position in which the camera is disposed accommodated in said structural element of the vehicle facing the cleaning head, and an active position in which the camera is deployed at a distance from the structural element of the vehicle to allow image capture. The device is particularly effective when applied to the cleaning of a reversing camera implanted in motor vehicles.
CLEANING DEVICE
A cleaning device is configured to include a first cleaning tank that holds water to which a small amount of an additive is added as a first cleaning fluid, a second cleaning tank that holds water, a water-based cleaning agent, an alkaline cleaning fluid, or a hydrophilic organic solvent as a second cleaning fluid, a first microscopic air bubble generation device, a first circulating pump, an ultrasonic wave emitting device, and a carrier device. Hydrophobic oil is removed by a cleaning target being exposed to the first cleaning fluid including microscopic air bubbles sprayed from a nozzle in an interior of the first cleaning tank, after which hydrophilic oil is removed by ultrasonic cleaning in the second cleaning tank.
Pump unit and handheld high pressure washer
The present invention relates to a pump unit applied to a high-pressure cleaning machine, including: a water inlet chamber, a water outlet chamber, and a central chamber connected to the water inlet chamber and the water outlet chamber. The pump unit further includes a plunger disposed in the central chamber and an eccentric mechanism connected to the plunger. The eccentric mechanism drives the plunger to perform reciprocating motion in the central chamber.
Pressure control strategies to provide uniform treatment streams in the manufacture of microelectronic devices
The present invention provides techniques to more accurately control the process performance of treatments in which microelectronic substrates are treated by pressurized fluids that are sprayed onto the substrates in a vacuum process chamber control strategies are used that adjust mass flow rate responsive to pressure readings in order to hold the pressure of a pressurized feed constant. In these embodiments, the mass flow rate will tend to vary in order to maintain pressure uniformity.
Pressure control strategies to provide uniform treatment streams in the manufacture of microelectronic devices
The present invention provides techniques to more accurately control the process performance of treatments in which microelectronic substrates are treated by pressurized fluids that are sprayed onto the substrates in a vacuum process chamber control strategies are used that adjust mass flow rate responsive to pressure readings in order to hold the pressure of a pressurized feed constant. In these embodiments, the mass flow rate will tend to vary in order to maintain pressure uniformity.
SUBSTRATE PROCESSING APPARATUS
In a substrate processing apparatus, a cup part is moved in an up-down direction to cause a cup exhaust port to selectively overlap a first chamber exhaust port or a second chamber exhaust port. In the state in which the cup exhaust port overlaps the first chamber exhaust port, gas in the cup part is discharged through the cup exhaust port and the first chamber exhaust port by a first exhaust mechanism. In the state in which the cup exhaust port overlaps the second chamber exhaust port, the gas in the cup part is discharged through the cup exhaust port and the second chamber exhaust port by a second exhaust mechanism. In this way, an exhaust mechanism for exhausting gas from the cup part can be easily switched between the first exhaust mechanism and the second exhaust mechanism.
SUBSTRATE PROCESSING APPARATUS
In a substrate processing apparatus, a cup part is moved in an up-down direction to cause a cup exhaust port to selectively overlap a first chamber exhaust port or a second chamber exhaust port. In the state in which the cup exhaust port overlaps the first chamber exhaust port, gas in the cup part is discharged through the cup exhaust port and the first chamber exhaust port by a first exhaust mechanism. In the state in which the cup exhaust port overlaps the second chamber exhaust port, the gas in the cup part is discharged through the cup exhaust port and the second chamber exhaust port by a second exhaust mechanism. In this way, an exhaust mechanism for exhausting gas from the cup part can be easily switched between the first exhaust mechanism and the second exhaust mechanism.
Hyperbaric clean method and apparatus for cleaning semiconductor chamber components
Embodiments of a methods and cleaning systems for cleaning components for use in substrate processing equipment are provided herein. In some embodiments, a cleaning system includes a boiler having a heater configured to heat a fluid; a clean chamber fluidly coupled to the boiler via at least one of a gas line and a liquid line, wherein the clean chamber includes one or more fixtures in an interior volume therein for holding at least one component to be cleaned, and wherein the clean chamber includes a heater for heating the interior volume; and an expansion chamber fluidly coupled to the clean chamber via a release line for evacuating the clean chamber, wherein the release line includes a release valve to selectively open or close a flow path between the expansion chamber and the clean chamber, and wherein the expansion chamber includes a chiller and a vacuum port.