A substrate treating apparatus and a substrate transporting method wherein a platform is disposed on a first ID block, and a platform is placed on a second ID block. A currently-used carrier platform is provided only on the first ID block. Accordingly, a substrate is transported in both a forward path and a return path between the first ID block and a second treating block. The substrate is returned not to the first ID block but to the second ID block disposed between the two treating blocks in the return path.

A treatment liquid supply device and a wet treatment device with which an extremely small quantity of the treatment liquid can be accurately supplied, as a method for supplying a treatment liquid to an extremely small wafer of half inch size, including: a syringe that sucks and discharges the treatment liquid; a treatment liquid bottle that is filled with the treatment liquid; a suction hose that has one end connected to the treatment liquid bottle and the other end connected to the syringe, and sucks the treatment liquid inside the treatment liquid bottle to the syringe; a supply hose that has one end connected to an intermediate section of the suction hose and serves to supply, to the surface of the wafer, the treatment liquid discharged by the syringe; and a three-way solenoid valve that controls opening/closing of each of the suction and supply hoses.

An embodiment comprises: a guide moving in the vertical direction or the horizontal direction; a transfer arm provided on the guide and loading spaced apart wafers; a laser emission unit disposed on the guide and emitting first laser beams at the spaced apart wafers loaded on the transfer arm; and a laser detection unit disposed below the transfer arm and collecting, from among the first laser beams, second laser beams having passed through gaps between the spaced apart wafers.

An embodiment comprises: a guide moving in the vertical direction or the horizontal direction; a transfer arm provided on the guide and loading spaced apart wafers; a laser emission unit disposed on the guide and emitting first laser beams at the spaced apart wafers loaded on the transfer arm; and a laser detection unit disposed below the transfer arm and collecting, from among the first laser beams, second laser beams having passed through gaps between the spaced apart wafers.

A cleaning device is configured to include a first cleaning tank that holds water to which a small amount of an additive is added as a first cleaning fluid, a second cleaning tank that holds water, a water-based cleaning agent, an alkaline cleaning fluid, or a hydrophilic organic solvent as a second cleaning fluid, a first microscopic air bubble generation device, a first circulating pump, an ultrasonic wave emitting device, and a carrier device. Hydrophobic oil is removed by a cleaning target being exposed to the first cleaning fluid including microscopic air bubbles sprayed from a nozzle in an interior of the first cleaning tank, after which hydrophilic oil is removed by ultrasonic cleaning in the second cleaning tank.

Methods and systems for an integrated acid regeneration of ion exchange resins are disclosed for use in cleaning applications. Acid resins designed for use in a variety of cleaning application using a treated, softened, acidic water source are disclosed. Various methods of using the softened acidic water generated by acid regenerate-able ion exchange resins within a cleaning application, e.g. ware wash machine, are disclosed to beneficially reduce spotting, filming and scale buildup on treated surfaces, reduce and/or eliminate the need for polymers, threshold reagents and/or rinse aids, and using protons generated in the acidic water effluent for triggering events useful in various cleaning applications.

Methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (IC) processing system and/or determine a thickness of a material layer of the wafer during IC processing implemented by the IC processing system. An exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. The substrate is positioned within an IC processing system. The method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. The electrical signals indicate a thickness of the material layer.

Methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (IC) processing system and/or determine a thickness of a material layer of the wafer during IC processing implemented by the IC processing system. An exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. The substrate is positioned within an IC processing system. The method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. The electrical signals indicate a thickness of the material layer.

A pickling production line comprises a material-holding apparatus, a pickling zone, and a water wash zone; the pickling zone and the water wash zone are independently arranged; the material-holding apparatus is filled with magnesium alloy waste, and self-rotates successively in the pickling zone and the water wash zone for pickling and water washing respectively. In the pickling production line for magnesium alloy waste material, the magnesium alloy waste material is pickled and washed more thoroughly; coatings and impurities on the surface of the magnesium alloy waste material are removed, the efficiency of the cleaning and the consistency of the cleaning are high, and each piece of equipment in the entire production line is connected in a compact manner; the invention has a high degree of automation, low environmental pollution, conserves resources, is highly efficient in production, and is suitable for the bulk pickling and cleaning of magnesium alloy waste material.

An apparatus for cleaning a felt in a system for producing a paper web has a device for introducing a cleaning liquid into the felt and at least one following suction device in the direction of movement of the felt and having a vacuum duct, through which the cleaning liquid is suctioned out of the felt. The suction device between the vacuum duct and the felt is formed with suction ducts, through which the cleaning liquid in the felt is suctioned away. At least one of the suction ducts is assigned an inflatable valve element. In the inflated state of the valve element the suction duct is closed and in its ventilated state the suction duct is opened.