The present application discloses a display panel manufacturing device and a cleaning method. The display panel manufacturing device includes: a machine table, a working pipeline, a gas supply means and a liquid supply means; a detection means is provided on the machine table; a first automatic valve is provided on a gas supply pipeline; and a second automatic valve is provided on a liquid supply pipeline.

A cleaning apparatus that cleans a detection surface of a detection element includes a first cleaning member, a second cleaning member, a driving device, to which the first cleaning member and the second cleaning member are attached, configured to drive the first and second cleaning members to approach and recede from the detection surface, and a control unit configured to control the first and second cleaning members and the driving device.

A cleaning apparatus that cleans a detection surface of a detection element includes a first cleaning member, a second cleaning member, a driving device, to which the first cleaning member and the second cleaning member are attached, configured to drive the first and second cleaning members to approach and recede from the detection surface, and a control unit configured to control the first and second cleaning members and the driving device.

A dust hood, useful for use in the compressed air and vacuum cleaning of a dusty apparatus placed therein, which is in the form of a flexible bag having a portion of its front face transparent with that front face also containing holes for a hose supplying compressed air and a hose supplying vacuum, respectively, for such cleaning.

A dust hood, useful for use in the compressed air and vacuum cleaning of a dusty apparatus placed therein, which is in the form of a flexible bag having a portion of its front face transparent with that front face also containing holes for a hose supplying compressed air and a hose supplying vacuum, respectively, for such cleaning.

A method for controlling a sensor assembly cleaning apparatus includes receiving sensor data from various vehicle sensors, determining a level of obscurement of the transparent surface, and determining whether the level of obscurement exceeds a threshold level. If the transparent surface is obscured beyond the threshold level, a control signal may be sent to the apparatus to initiate the ejection of pressurized air onto the transparent surface. Optionally, the method may further evaluate other parameters such as the vehicle velocity in relation to a threshold vehicle velocity prior to sending the control signal to ensure that the cleaning operation using pressurized air would not be superfluous in light of the vehicle velocity. In addition, a method for selectively activating the sensor assembly cleaning apparatus includes determining an activation schedule for the apparatus based on an arrangement of transparent surfaces and controlling the apparatus to operate based on the activation schedule.

A method for controlling a sensor assembly cleaning apparatus includes receiving sensor data from various vehicle sensors, determining a level of obscurement of the transparent surface, and determining whether the level of obscurement exceeds a threshold level. If the transparent surface is obscured beyond the threshold level, a control signal may be sent to the apparatus to initiate the ejection of pressurized air onto the transparent surface. Optionally, the method may further evaluate other parameters such as the vehicle velocity in relation to a threshold vehicle velocity prior to sending the control signal to ensure that the cleaning operation using pressurized air would not be superfluous in light of the vehicle velocity. In addition, a method for selectively activating the sensor assembly cleaning apparatus includes determining an activation schedule for the apparatus based on an arrangement of transparent surfaces and controlling the apparatus to operate based on the activation schedule.

Methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (IC) processing system and/or determine a thickness of a material layer of the wafer during IC processing implemented by the IC processing system. An exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. The substrate is positioned within an IC processing system. The method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. The electrical signals indicate a thickness of the material layer.

Methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (IC) processing system and/or determine a thickness of a material layer of the wafer during IC processing implemented by the IC processing system. An exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. The substrate is positioned within an IC processing system. The method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. The electrical signals indicate a thickness of the material layer.

A product system for an agricultural sprayer includes a product tank configured to store a volume of an agricultural product. A fill station is configured to accept the agricultural product from an off-board source. A flow assembly is fluidly coupled with the fill station and is configured to direct the agricultural product into a product tank from the conduit. A reclaim system is configured to provide the agricultural product within the flow assembly to the product tank. A computing system is communicatively coupled to the reclaim system. The computing system is configured to receive inputs indicative of activation of a fill mode, detect termination of the fill mode, and activate a reclaim mode to move the agricultural product from at least the conduit to the product tank through activation of the reclaim system.