Automatic emitter point cleaners are disclosed. An automatic emitter point cleaning system includes: a fan configured to direct a stream of air through an air path; a point emitter configured to produce at least one of positive ions or negative ions within or proximate to the air path; a brush; a first gear coupled to the brush and configured to move the brush into contact with the point emitter; a second gear to engage the first gear; and a motor to actuate the second gear such that the second gear actuates the first gear to move the brush past the point emitter.

Automatic emitter point cleaners are disclosed. An automatic emitter point cleaning system includes: a fan configured to direct a stream of air through an air path; a point emitter configured to produce at least one of positive ions or negative ions within or proximate to the air path; a brush; a first gear coupled to the brush and configured to move the brush into contact with the point emitter; a second gear to engage the first gear; and a motor to actuate the second gear such that the second gear actuates the first gear to move the brush past the point emitter.

A semiconductor manufacturing equipment has a support platform and a substrate disposed over the support platform. A first electrical component is disposed over a first surface of the substrate. A second electrical component is disposed over a second surface of the substrate opposite the first surface of the substrate. A suction hood is disposed over the substrate. A gas is introduced over the substrate to circulate residue while drawing the residue vertically into the suction hood. The gas can be introduced with a gas nozzle or air knife. The gas can be introduced from a gas conduit disposed at least partially around the substrate. The gas conduit can extend completely around the substrate. The gas nozzles are sequentially placed around the gas conduit. The gas can be a stable or inert gas. The residue is displaced away from the second electrical component.

A semiconductor manufacturing equipment has a support platform and a substrate disposed over the support platform. A first electrical component is disposed over a first surface of the substrate. A second electrical component is disposed over a second surface of the substrate opposite the first surface of the substrate. A suction hood is disposed over the substrate. A gas is introduced over the substrate to circulate residue while drawing the residue vertically into the suction hood. The gas can be introduced with a gas nozzle or air knife. The gas can be introduced from a gas conduit disposed at least partially around the substrate. The gas conduit can extend completely around the substrate. The gas nozzles are sequentially placed around the gas conduit. The gas can be a stable or inert gas. The residue is displaced away from the second electrical component.

Described herein are sensor assembly cleaning apparatuses and methods of operation thereof that utilize a fluid such as pressurized air to cause dispersion of debris, rain droplets/water droplets from other sources, condensation, or any other environmental contaminant that may obscure a transparent surface such as a glass window of a camera housing from the glass window. In this manner, the pressurized air acts to clean the transparent surface, and as a result, improve the clarity of the field-of-view provided through that transparent surface to a camera housed in the camera housing. In addition, sensor assembly cleaning apparatuses described herein can include a water nozzle that is adapted to eject high pressure water onto the transparent surface as well as towards an air nozzle or an air vent that is adapted to eject the pressurized air. The water nozzle can thus be used to remove debris form the air nozzle.

Described herein are sensor assembly cleaning apparatuses and methods of operation thereof that utilize a fluid such as pressurized air to cause dispersion of debris, rain droplets/water droplets from other sources, condensation, or any other environmental contaminant that may obscure a transparent surface such as a glass window of a camera housing from the glass window. In this manner, the pressurized air acts to clean the transparent surface, and as a result, improve the clarity of the field-of-view provided through that transparent surface to a camera housed in the camera housing. In addition, sensor assembly cleaning apparatuses described herein can include a water nozzle that is adapted to eject high pressure water onto the transparent surface as well as towards an air nozzle or an air vent that is adapted to eject the pressurized air. The water nozzle can thus be used to remove debris form the air nozzle.

A sensor lens cleaning system for a cylindrical sensor having a sensor lens surface includes an extended member having a first end coupled to the cylindrical sensor and a second end opposite the first end, a nozzle coupled to the second end of the extended member, an actuator coupled to the extended member and configured to control the extended member, and a controller in electronic communication with the actuator and configured to communicate an actuator control signal to the actuator. The nozzle generates an air stream directed at the sensor lens surface.

A sensor lens cleaning system for a cylindrical sensor having a sensor lens surface includes an extended member having a first end coupled to the cylindrical sensor and a second end opposite the first end, a nozzle coupled to the second end of the extended member, an actuator coupled to the extended member and configured to control the extended member, and a controller in electronic communication with the actuator and configured to communicate an actuator control signal to the actuator. The nozzle generates an air stream directed at the sensor lens surface.

A substrate processing system for selectively etching a substrate includes a first chamber and a second chamber. A first gas delivery system supplies an inert gas species to the first chamber. A plasma generating system generates plasma including ions and metastable species in the first chamber. A gas distribution device removes the ions from the plasma, blocks ultraviolet (UV) light generated by the plasma and delivers the metastable species to the second chamber. A substrate support is arranged below the gas distribution device to support the substrate. A second gas delivery system delivers a reactive gas species to one of the gas distribution device or a volume located below the gas distribution device. The metastable species transfer energy to the reactive gas species to selectively etch one exposed material of the substrate more than at least one other exposed material of the substrate.

Valve and related assemblies, systems, and methods may include a self-cleaning feature that may be configured to at least partially displace material from a portion of the valve. Such valves may be utilized in a pressure exchanger.