A substrate cleaning method includes: steps (a) to (d). In step (a), a liquid is supplied onto a nanoimprint template substrate that has a patterned surface with foreign particles to form a liquid film on the patterned surface. In step (b), the liquid film is solidified to form a solidified film including the foreign particles. In step (c), the substrate is reversed. In step (d), the solidified film is melted to remove the foreign particles.

The present disclosure provides laminates, which include adhesive materials and methods that allow for the removal of contaminants, e.g. particulate contaminants, from a substrate surface. In one embodiment, the laminates include (i) a substrate with contaminant disposed on its surface, (ii) a liquid, adhesive precursor and (iii) a film layer. The liquid, adhesive precursor is disposed between the substrate and the film layer. In another embodiment, the laminates include (i) a substrate with contaminant disposed on its surface, (ii) a cured adhesive layer and (iii) a film layer. The cured adhesive layer is disposed between the substrate and the film layer. The laminates may be used to remove contaminant from the substrate surface by removal of the film layer and the cured adhesive layer, which entraps the contaminant therein.

A substrate treating method and a substrate treating apparatus which can reduce the collapse of a pattern on a substrate. The substrate treating method includes a supply step of supplying a process liquid including a sublimable substance in a molten state to a pattern-formed surface of a substrate; a solidification step of solidifying the process liquid on the pattern-formed surface so as to form a solidified body; a sublimation step of subliming the solidified body so as to remove the solidified body from the pattern-formed surface; and an organic substance removal step of removing, when the solidified body is sublimed, an organic substance precipitated on a sublimation interface, and the organic substance removal step is performed so as to overlap at least part of the sublimation step.

A method includes forming a film of a compound on an inner wall of a gas supply line by polymerization of a first compound and a second compound by controlling a temperature of the gas supply line to a first temperature at which the first compound and the second compound are polymerized in a state where a first gas containing the first compound and a second gas containing the second compound are supplied to the gas supply line, and removing the film by controlling the temperature of the gas supply line to a second temperature at which the film is depolymerized after predetermined processing is performed on a target object in a processing chamber by a processing gas supplied into the processing chamber through the gas supply line having the film. The first compound is isocyanate. The second compound is amine or a compound having a hydroxyl group.

Electronic devices that include fabric surfaces can periodically require cleaning. Methods and tools for safely and reliably cleaning such surfaces are disclosed. The method includes application of a cleaning pad impregnated with a cleaning agent for a predetermined period of time. The cleaning pad is configured to remove stains and contaminants from the surface through a measured approach.

An embodiment of the present invention provides a substrate cleaning method including: supplying of a liquid cleaning solution containing a thermoreactive polymer resin in a solvent to a substrate; trapping of particles by gelling the liquid cleaning solution by phase transition through first heat treatment; liquefying of the gel-state cleaning solution with the particle trapped therein by phase transition through second heat treatment; and removing of the liquefied cleaning solution by supplying a rinse solution.

A method for cleaning a surface of a component includes placing a volume of a cleaning agent onto the surface of the component. The method further includes performing a repair operation of the component either before or after placing the volume of the cleaning agent. The repair operation results in a generation of contaminant particles. Upon contact of the cleaning agent with the contaminant particles, the cleaning agent absorbs the contaminant particles by adhesion. The method further includes removing the cleaning agent from the surface of the component after the contaminant particles are absorbed by the cleaning agent.

A substrate processing method in accordance with the present invention includes forming a liquid film on an upper surface of a substrate by a wet processing apparatus; carrying the substrate having the liquid film formed thereon into a chamber of a supercritical processing apparatus by a conveyor device; and processing a substrate by a processing fluid in a supercritical state in the chamber by the supercritical processing apparatus. The method further includes blowing a gas toward a lower surface of the substrate supported in a horizontal posture by a gas discharger for at least a part of a period after the formation of the liquid film on the substrate during which the substrate is outside the chamber.

Provided is a method for removing a coating film from a coated film including a coating film containing a water-soluble resin on at least one side of a base film. The method includes: supplying a cleaning liquid in a form of droplets to a surface of the coating film, and retaining the cleaning liquid in the form of droplets on the surface of the coating film; and subsequently removing the coating film containing the cleaning liquid from the coated film.

A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.