According to one embodiment, a processing apparatus for processing substrates having different base shapes includes a stage comprising a first portion having a substrate facing surface and an opening extending therethough connected to a source of a cooling fluid, and a second portion located outwardly of the first portion, a substrate support, having a substrate support surface thereon, extending over the second portion, a process fluid outlet overlying the first portion, and a driving unit coupled to one of the stage and the first portion, wherein the driving unit is configured to move at least one of the substrate support surface and the substrate facing surface such that the relative locations of the substrate support surface and the substrate facing surface of the stage are changeable based on the shape of a substrate to be processed in the apparatus.

A substrate processing method includes a hydrophilic film forming liquid supplying step of supplying, toward a major surface of a substrate, a hydrophilic film forming liquid to form a hydrophilic film on the major surface, a film thickness reducing liquid supplying step of supplying, toward the major surface, a film thickness reducing liquid to reduce a thickness of the hydrophilic film, a processing film forming liquid supplying step of supplying, toward the major after the thickness of the hydrophilic film has been reduced, a processing film forming liquid to form, on a front surface of the hydrophilic film, a processing film that holds a removal object present on the major surface, and a peeling liquid supplying step of supplying, toward the major surface, a peeling liquid to peel off the processing film from the hydrophilic film.

The present disclosure relates to a kit for cleaning biological fluids from a surface. The kit comprises at least one protective article of clothing, absorbent powder, a trash bag, surface sanitizer, an absorbent towel, a scraper, a handle, and a dustpan. The dustpan is configured to be securely coupled to the handle. The dustpan has a lid and a base and can alternate between an open position and a self-sealing closed position. In the closed position the base and lid define an interior volume having a height along a y-axis, a width along an x-axis, and a depth along a z-axis. An adhesive strip is coupled to a lip of the dustpan and is configured to interact with a surface and temporarily engage the dustpan with the surface. The absorbent powder is a mixture of a super absorbent polymer and perlite.

A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.

A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of a substrate, a holding-layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding-layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removal of the particle holding layer from the substrate, a liquid film of a second processing liquid, a gas phase layer forming step of forming a gas phase layer for holding the liquid film between the upper surface of the substrate and the liquid film, and a liquid film removing step of removing the second processing liquid from the upper surface of the substrate by moving the liquid film on the gas phase layer.

According to one embodiment, q substrate treatment device includes a placement stand, a plurality of support portions, a cooling part, a liquid supplier, and at least one protrusion. The placement stand has a plate shape, and is configured to rotate. The support portions are provided on one surface of the placement stand and configured to support a substrate. The cooling part is configured to supply a cooling gas into a space between the placement stand and a back surface of the substrate supported by the support portions. The liquid supplier is configured to supply a liquid onto a surface of the substrate. At least one protrusion is provided on the one surface of the placement stand and extends along a boundary line of a region where the substrate is provided in a plan view.

The present invention provides a method for transport and storage of water-sensitive and/or temperature-sensitive compounds such as isocyanates wherein the compounds can be stored or transported under controlled conditions with ease of removal of the compounds and cleaning afterwards without the risk of damaging the container or pipes. To this end the present invention is directed to a method for handling a water-sensitive and/or temperature-sensitive compound in liquid form wherein the surface of the device that is in contact with the water-sensitive and/or temperature sensitive compound in liquid form is provided with a watersoluble coating, and the coating is solved with water for cleaning the device. The water-soluble coating preferably comprises polyvinyl alcohol.

Methods of removing a film of a biological material from a surface are provided. In embodiments, such a method comprises applying magnetic particles to a surface contaminated with a film of a biological material; and exposing the magnetic particles to a changing magnetic field to move the magnetic particles relative to the contaminated surface, thereby removing the film from the surface.

A method of cleaning an evaporator that includes at least one heat transfer element for the evaporation of water, comprising forming a sacrificial layer of a first material on a surface of the heat transfer element (1); evaporating water that includes a second material to deposit the second material on top of the sacrificial layer (2, 3); and cleaning the evaporator by removing both the sacrificial layer formed on the heat transfer element and the second layer formed on top of the sacrificial layer; wherein the first material is more easily removed from the heat transfer element than the second material (4).

A substrate processing apparatus for processing a substrate to manufacture a semiconductor device, includes: a mounting table on which a substrate is mounted; a first liquid supply part that supplies a first liquid to form a polymer film having a urea bond on the substrate mounted on the mounting table; a second liquid supply part that supplies a second liquid reacting with the first liquid; and a nozzle part provided at an end portion of a liquid flow path where the first liquid supplied from the first liquid supply part and the second liquid supplied from the second liquid supply part are joined with each other to obtain a mixed solution, and configured to supply the mixed solution to the substrate to form the polymer film on a surface of the substrate, wherein the polymer film is temporarily used for manufacturing the semiconductor device and is subsequently removed by depolymerization.