To dry a substrate formed with a pattern on a front surface satisfactorily and with excellent drying performance, a substrate processing method comprises: a liquid film formation step of forming a liquid film of a processing liquid, in which cyclohexanone oxime is dissolved in a solvent, on a front surface of a substrate formed with a pattern by supplying the processing liquid to the front surface of the substrate; a solidified film formation step of forming a solidified film of the cyclohexanone oxime by solidifying the liquid film of the processing liquid; and a sublimation step of removing the solidified film from the front surface of the substrate by sublimating the solidified film.

The invention relates to a treatment system for treating workpieces, in particular for cleaning and/or deburring, comprising at least one treatment device that has at least one treatment unit, which is configured to perform at least one treatment operation on the workpiece, as well as at least one receiving unit for accommodating the workpiece on or in the treatment device, a transport device that comprises at least one transport unit, with which the workpiece is transferable into a transfer position, from which the workpiece is transferable by means of the at least one receiving unit into a treatment position, as well as a control device for controlling the at least one treatment unit, the at least one receiving unit, and the at least one transport unit, wherein the at least one treatment device comprises two or more receiving units for accommodating a respective workpiece for transferring independently of one another into the treatment position, and wherein the control device controls the at least one treatment unit such that the workpieces are treated by said treatment unit in a time-offset manner according to a treatment operation of the same kind. The invention also relates to a method.

Lipophilic super-absorbent swelling gels have been developed that will not only absorb the oil and grease from these machine parts, but will also act as an automated sweeper due to the self-generating mechanical force of the gel. An octadecylacrylate-co-ethylene glycol dimethacrylate (ODA-co-EGDMA) tetraalkylammonium tetraphenylborate lipophilic polyelectrolyte gel (EG-18) and poly(stearylacrylate-co-ethylene glycol dimethacrylate) (SA-co-EGDMA) neutral gel (NG-18) were evaluated for swelling and oil sorption capacity. NG-18 and EG-18 gels removed particulate contaminants and absorbed oils and grease on metal and non-metal surfaces without causing abrasion. The gels are also recyclable. The cleaning ability of the gels was compared with the standard solvent cleaner trichloroethylene (TCE) following ASTM G122-96(2008) test methods and MIL-PRF-680B procedure with MIL-PRF-10924 test grease. Polymer gel cleaners exhibited analogous extent and rate of cleaning as the TCE. These recyclable superabsorbent polymer cleaners will allow drastic reduction in the use of VOC containing solvents and HAP release.

A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.

A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.

A substrate processing apparatus comprises: a liquid film former which forms a liquid film by supplying a liquid on an upper surface of the substrate W held horizontally; a cooling gas discharge nozzle which discharges cooling gas of a temperature lower than a freezing point of the liquid forming the liquid film to the liquid film; a thawing liquid discharge nozzle which discharges a thawing liquid to a frozen film formed by freezing the liquid film; a thawing liquid supplier which supplies the heated thawing liquid to the thawing liquid discharge nozzle via a pipe; and a receiver which receives the cooling gas and the thawing liquid respectively discharged from the cooling gas discharge nozzle and the thawing liquid discharge nozzle at the respective retracted position and guides the cooling gas and the thawing liquid to a common flow passage.

This application relates to a semiconductor structure processing method, including: providing a semiconductor layer including a pattern, where a trench is located amongst the pattern; cleaning the pattern using a rinse liquid, where the rinse liquid fills the trench after the cleaning; forming a flexible layer, where the flexible layer displaces the rinse liquid and fills the trench, and covers a surface of the semiconductor layer; and hardening the flexible layer and subsequently removing the flexible layer.

A cleaning composition for a semiconductor substrate contains a solvent, and a polymer that includes a fluorine atom, a silicon atom or a combination thereof. The content of water in the solvent is preferably no greater than 20% by mass. The cleaning composition preferably further contains an organic acid which is a non-polymeric acid. The organic acid is preferably a polyhydric carboxylic acid. The acid dissociation constant of the polymer is preferably less than that of the organic acid. The solubility of the organic acid in water at 25° C. is preferably no less than 5% by mass. The organic acid is preferably a solid at 25° C.

A substrate cleaning method includes: steps (a) to (d). In step (a), a liquid is supplied onto a nanoimprint template substrate that has a patterned surface with foreign particles to form a liquid film on the patterned surface. In step (b), the liquid film is solidified to form a solidified film including the foreign particles. In step (c), the substrate is reversed. In step (d), the solidified film is melted to remove the foreign particles.

There is provided a reticle chuck cleaner A for cleaning a reticle chuck of an apparatus, as a reticle chuck cleaner that allows easy cleaning of a reticle chuck in a vacuum chamber of an apparatus without exposing the chamber to the atmosphere and contributes to improvement of the operating ratio of the apparatus, including: an adhesive layer 1 to be adhered to a chuck region of the reticle chuck; a support layer 2 laminated on the adhesive layer 1; and a substrate 3 having a shape capable of being carried to the reticle chuck, the support layer 2 and the substrate 3 being partially bonded together in an adhesive region 41 of a partial adhesive layer 4.