The invention relates to a coating line (1) cleaning apparatus (20) and a method for cleaning at least a selected part of a coating line. The coating line cleaning apparatus comprising a conveyed entity having first and second mutually opposed major faces and at least one flexible cleaning element (12) having first and second mutually opposed major faces, said cleaning element being characterised in that each one of said first (15) and second (11) major faces is tacky, the first of said tacky faces of said cleaning element being releasably adhered to one of the major faces (8) of the conveyed entity (4), and the second tacky major face of said cleaning element being temporarily contactable with the selected part (14) of the coating line to bring said second tacky major face (11) of the cleaning element into temporary contact with said selected part of a coating line to cause any contaminants present on said selected part (14) of a coating line (1) to adhere to said second tacky major face (11) of said cleaning element thereby causing any contaminants to be removed from said selected part of a coating line (1).

A cleaning device is provided for removing debris from an end surface of a fiber optic connector. The fiber optic connectors may be a Multi Push On (MPO) or Mechanical Transfer (MT). The end surface may have a one or more ferrules with a fiber optic glass cable. The cleaning device includes a housing with a first end open to a gel that adheres to debris. A second end of the housing may be releasably attached to a protrusion or handle to insert and remove the device from an adapter receptacle. The handle may be replaced with a plug frame and protrusion so the device may be inserted into the receptacle of the adapter. The device may be placed over the end surface of the fiber optic connector that is not inserted into an adapter receptacle.

To provide a cleaner capable of easily cleaning the side surface of a pin of an optical connector.

There is provided an optical connector end surface cleaner 10A, including: a cleaning tape 11 to be contacted with the end surface of an optical connector 20; and a receiving part 14A in which at least one pin insertion recess 15A into which at least one pin 22 of the optical connector 20 is capably inserted is formed, wherein a part of the cleaning tape 11 is inserted into the at least one pin insertion recess 15A together with the at least one pin 22 by being pressed by the at least one pin 22 to be inserted into the at least one pin insertion recess 15A of the receiving part 14A, and is interposed between an inner wall surface of the at least one pin insertion recess 15A and a side surface of the at least one pin 22.

In a cleaning device, a signal processing circuit determines that a foreign substance has adhered to a surface of a protection cover based on at least two pieces of information among a change amount of a resonant frequency when a vibration portion is driven at a first voltage, a change amount of a current value relating to an impedance detected by an impedance detector, and a temporal change of an image captured by an imaging portion, and cleans the surface of the protection cover by controlling the vibration portion in accordance with the determination.

A testing system for testing a device under test including a plurality of circuits under test includes a probe card, testing apparatus, and a controller. The probe card includes a plurality of probes temporarily coupled to the circuits under test. The testing apparatus holds the probe card and tests the circuits under test through tine probe card. The controller controls the testing apparatus and executes a testing procedure that includes: measuring the contact resistance values between the probe card and each of the circuits under test; determining a statistical value of the contact resistance values; determining whether the statistical value exceeds a first threshold; when the statistical value does not exceed the first threshold, setting a clean flag to be in a first state; otherwise, setting the clean flag to be in a second state; and performing a clean operation on the probes according to the clean flag.

A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.

A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.

A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.

Debris is removed from a collector of an extreme ultraviolet light source vessel by applying a suction force through a vacuum opening of a cable. The method for removing debris also includes weakening debris attachment by using a sticky surface or by spreading a solution through a nozzle, wherein the sticky surface and the nozzle are arranged on the cable proximal to the vacuum opening. A borescope system and interchangeable rigid portions of the cable assists in targeting a target area of the collector where the debris is.

A mask for cleaning a lithography apparatus includes a mask substrate and a coating provided on a surface of the mask substrate. The coating is configured to trap particulate contaminant matter from the lithography apparatus. A method of cleaning a lithography tool is also provided preparing a cleaning mask including a particle trapping layer formed on a substrate. The method includes transferring the cleaning mask through a mask transferring route of the lithography tool. Subsequently, the method includes analyzing a particle trapped by the particle trapping layer.