The invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, characterized in that the remover composition contains a solvent but no salt; the solvent includes one or more species selected from among an aliphatic hydrocarbon compound, an aromatic hydrocarbon compound, an ether compound, a thioether compound, an ester compound, and an amine compound, each having a molecular weight less than 160; and the remover composition exhibits a contact angle smaller than 31.5° with respect to the adhesive layer.

A debris collection and metrology system for collecting and analyzing debris from a tip used in nanomachining processes, the system including an irradiation source, an irradiation detector, an actuator, and a controller. The irradiation source is operable to direct incident irradiation onto the tip, and the irradiation detector is operable to receive a sample irradiation from the tip, the sample irradiation being generated as a result of the direct incident irradiation being applied onto the tip. The controller is operatively coupled to an actuator system and the irradiation detector, and the controller is operable to receive a first signal based on a first response of the irradiation detector to the sample irradiation, and the controller is operable to effect relative motion between the tip and at least one of the irradiation source and the irradiation detector based on the first signal.

A tonneau system for use with a pickup truck. The tonneau system includes a frame and a tonneau cover having a plurality of tonneau sections moveable between a folded position and an unfolded position. The tonneau cover includes solar energy-receiving material secured to a top exposed surface of at least two of the tonneau sections. The solar energy-receiving material moves with their corresponding tonneau sections between the unfolded and folded positions. A battery, transformer, and/or electrical cabling system may be included within the circuit for power storage and conversion.

Provided is an optical connector cleaning tool with a simple structure that can sufficiently transmit transmission force. The optical connector cleaning tool includes a supply reel on which a cleaning material is wound so that it can be fed out, a winding reel that winds the cleaning material that has passed through a cleaning head, an operating body that can be pivoted by operation by an operator, and a rotary engaging body that engages with the operating body to transmit the movement of the operating body to rotate the winding reel, in which the arc caused by the pivoting of the operating body is inscribed in the arc caused by the rotation of the rotary engaging body, and the operating body and the rotary engaging body are engaged.

A curable composition on a substrate is cured in a state where a member is in contact with the curable composition. Thereafter, the member having adhered to the curable composition is separated from the substrate, whereby the curable composition and a particle are removed from the substrate.

Provided is a structure for attaching an object to be attached capable of maintaining an appropriate attachment state of an object to be attached by attaching the object to be attached to an attachment portion with distortion being less likely to be accumulated. The structure for attaching an object to be attached, includes an object to be attached including a first surface having an adhesive layer and a second surface which is a surface on a side opposite to the first surface and has no adhesive layer, and an attachment portion to which the object to be attached is attached to face the second surface of the object to be attached, and at least a part of the object to be attached is deformable in a state where the object to be attached is attached.

A pellicle cleaning apparatus includes a stage to support a pellicle, a particle remover above the stage, the particle remover being configured to remove a particle from a first surface of a pellicle, and the particle remover including a cantilever, and an adhesive material on a bottom surface of the cantilever, and a pressure controller adjacent to the stage, the pressure controller being configured to control a pressure of a fluid on a second surface of the pellicle.

There is provided a contact cleaning surface (10), for a contact cleaning roller, configured to collect and/or remove contaminating particles from a contaminated substrate, including a frame defining a plurality of recessed cells (14), the frame having at least one wall defining the perimeter of each cell, the at least one wall having a pair of parallel opposing surfaces upstanding substantially perpendicularly from a base and terminating in a contact surface configured to contact the contaminated substrate, the at least one wall having a cross-sectional area that is substantially the same between said base and said contact surface. There is also provided a contact cleaning and an apparatus, each configured to collect and/or remove contaminating particles from a contaminated substrate, and method of collecting and/or removing contaminating particles from a contaminated substrate.

Provided are a modified polybenzoxazole and a modified polybenzoxazole sheet each having small temperature dependence of its modulus of elasticity, each of which may be suitably used for forming a cleaning sheet that may be suitably used for a transfer member to be transferred in a substrate processing apparatus. Also provided is a cleaning sheet having small temperature dependence of its modulus of elasticity, including such modified polybenzoxazole sheet as a cleaning layer. Also provided is a transfer member provided with a cleaning function, including such cleaning sheet and a transfer member. The modified polybenzoxazole is a modified polybenzoxazole, including a benzoxazole ring structure and two or more amide groups, the modified polybenzoxazole having a storage modulus of elasticity at 1 Hz in a range of 0° C. to 100° C. of 200 MPa to 2,000 MPa.

A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.