An upper holding device holds a substrate in a horizontal attitude without rotating the substrate. A lower holding device rotates a substrate while holding the substrate by suction. A substrate held by the upper holding device is cleaned with use of a cleaning liquid, and a substrate held by the lower holding device is cleaned with use of a cleaning liquid. Gas in a processing space is exhausted by exhaust equipment of a factory through an exhaust system. When a substrate is held by the upper holding device, gas in the processing space is not exhausted or gas in the processing space is exhausted at a first flow rate. Gas in the processing space is exhausted at a second or third flow rate that is higher than the first flow rate when the substrate is held by the lower holding device.

An upper holding device holds a substrate in a horizontal attitude without rotating the substrate. A lower holding device rotates a substrate while holding the substrate by suction. A substrate held by the upper holding device is cleaned with use of a cleaning liquid, and a substrate held by the lower holding device is cleaned with use of a cleaning liquid. Gas in a processing space is exhausted by exhaust equipment of a factory through an exhaust system. When a substrate is held by the upper holding device, gas in the processing space is not exhausted or gas in the processing space is exhausted at a first flow rate. Gas in the processing space is exhausted at a second or third flow rate that is higher than the first flow rate when the substrate is held by the lower holding device.

The present invention relates to a recycling process for a laminate and a solution used in such a process. The present invention finds particular application in the removal of an adhered overlay from an underlying substrate material such as plastic. The process includes subjecting the laminate to an impact frictional striking force, thereby substantially separating the substrate layer from the one or more surface layers of the overlay and then washing the substrate layer with a washing solution to remove the remaining surface layers of the overlay and glue from the substrate layer. The washing solution may be an aqueous solution including a surfactant, a solvent and a base.

The present invention relates to a recycling process for a laminate and a solution used in such a process. The present invention finds particular application in the removal of an adhered overlay from an underlying substrate material such as plastic. The process includes subjecting the laminate to an impact frictional striking force, thereby substantially separating the substrate layer from the one or more surface layers of the overlay and then washing the substrate layer with a washing solution to remove the remaining surface layers of the overlay and glue from the substrate layer. The washing solution may be an aqueous solution including a surfactant, a solvent and a base.

A molecular adhesive system for reversibly joining two surfaces, comprising: an anionic coating on a first of two surfaces to be joined; a conductive polymer nanotube array on a second of the two surfaces to be joined; wherein said conductive polymer nanotube array is functionalized with metal nanoparticles; and an electric potential applied across said two surfaces.

A molecular adhesive system for reversibly joining two surfaces, comprising: an anionic coating on a first of two surfaces to be joined; a conductive polymer nanotube array on a second of the two surfaces to be joined; wherein said conductive polymer nanotube array is functionalized with metal nanoparticles; and an electric potential applied across said two surfaces.

Embodiments of the present invention are directed to a method for cleaning a wind turbine blade or a solar panel with a wind cinch device. The method includes applying a cleaning solution to a surface of a wind turbine blade or solar panel; affixing a wind cinch device around a high point of the wind turbine blade or solar panel; applying tension to one or more lines attached to the wind cinch device to control the pressure the wind cinch device applies to the surface of the wind turbine blade or solar panel; and applying tension to the one or more lines attached to the wind cinch device to pull the wind cinch device from the high point on the wind turbine blade or solar panel to a low point on the wind turbine blade or solar panel. Other embodiments of the present invention are directed to a Wind Cinch device. The Wind Cinch device includes a main body, the main body being an elongated member having a cleaning surface sufficient in length to form a loop around a wind turbine blade when wrapped around a wind turbine blade. The Wind Cinch device also includes a plurality of rigging points, each rigging point adapted to receive a line. Applying tension to one or more of the lines attached to the rigging points changes the circumference of the loop formed by wrapping the wind cinch device around the wind turbine blade.

Embodiments of the present invention are directed to a method for cleaning a wind turbine blade or a solar panel with a wind cinch device. The method includes applying a cleaning solution to a surface of a wind turbine blade or solar panel; affixing a wind cinch device around a high point of the wind turbine blade or solar panel; applying tension to one or more lines attached to the wind cinch device to control the pressure the wind cinch device applies to the surface of the wind turbine blade or solar panel; and applying tension to the one or more lines attached to the wind cinch device to pull the wind cinch device from the high point on the wind turbine blade or solar panel to a low point on the wind turbine blade or solar panel. Other embodiments of the present invention are directed to a Wind Cinch device. The Wind Cinch device includes a main body, the main body being an elongated member having a cleaning surface sufficient in length to form a loop around a wind turbine blade when wrapped around a wind turbine blade. The Wind Cinch device also includes a plurality of rigging points, each rigging point adapted to receive a line. Applying tension to one or more of the lines attached to the rigging points changes the circumference of the loop formed by wrapping the wind cinch device around the wind turbine blade.

An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.