A sewer cleaning machine includes a frame and a drum rotatably supported by the frame. The drum includes a cable that is selectively extendable out of the drum. The sewer cleaning machine also includes a motor supported by the frame and coupled to the drum. The motor is operable to rotate the drum. The drum is configured to engage a surface to facilitate moving the sewer cleaning machine along the surface.

A sewer cleaning machine includes a frame and a drum rotatably supported by the frame. The drum includes a cable that is selectively extendable out of the drum. The sewer cleaning machine also includes a motor supported by the frame and coupled to the drum. The motor is operable to rotate the drum. The drum is configured to engage a surface to facilitate moving the sewer cleaning machine along the surface.

A lubrication device, a lubrication system and a method are for applying a lubricant from a lubricating-fluid reservoir to an internal threaded portion of a pipe body. The lubrication device includes: a rotary device having: first and second coupling parts, and fluid passage for carrying the lubricant from the first coupling part to the second coupling part. The first and the second coupling parts are arranged to rotate relative to each other around an axis that coincides in the main with the longitudinal axis of the pipe body. An applicator body is connected to the second coupling part to allow rotation around the rotational axis of the rotary device. The applicator body has a fluid passage with an outlet for carrying the fluid to the applicator surface as the fluid passage in the applicator body is in fluid communication with a corresponding fluid passage in the rotary device.

Drain cleaning machines having various fluid management provisions are described. The various fluid management provisions serve to direct and collect fluid and debris carried with a drain cleaning cable undergoing retraction into the machine.

Drain cleaning machines having various fluid management provisions are described. The various fluid management provisions serve to direct and collect fluid and debris carried with a drain cleaning cable undergoing retraction into the machine.

An oxy-acetylene cutting torch tip cleaner includes an elongated body portion with at least one actuator and at least one associated housing bore for storing a cleaning pin. Each cleaning pin is coupled to an actuator movable from a first position with the cleaning pin contained in the housing bore to a second position with the cleaning pin extending from the housing bore, for abrading and cleaning the cutting torch tip. Each actuator, coupled to its cleaning pin with a slider, is biased to the first position and a lock engages each actuator in the second position such that when the lock is disengaged from the actuator at the second position with the cleaning tip extended from the body, the actuator automatically returns to the first position thereby retracting the cleaning pin back into the housing bore.

The present invention provides a method for manufacturing a resist composition which is used in a manufacturing process of a semiconductor apparatus, comprising the steps of: cleaning a manufacturing apparatus for the resist composition with a cleaning solution; analyzing the cleaning solution taken out from the manufacturing apparatus; repeating the step of cleaning and the step of analyzing until a concentration of a nonvolatile component(s) contained in the cleaning solution became 10 ppm or less; and manufacturing the resist composition by using the manufacturing apparatus after the step of repeating. There can be provided a method for manufacturing a resist composition which can manufacture a resist composition lowered in coating defects.

The present invention provides a method for manufacturing a resist composition which is used in a manufacturing process of a semiconductor apparatus, comprising the steps of: cleaning a manufacturing apparatus for the resist composition with a cleaning solution; analyzing the cleaning solution taken out from the manufacturing apparatus; repeating the step of cleaning and the step of analyzing until a concentration of a nonvolatile component(s) contained in the cleaning solution became 10 ppm or less; and manufacturing the resist composition by using the manufacturing apparatus after the step of repeating. There can be provided a method for manufacturing a resist composition which can manufacture a resist composition lowered in coating defects.

This is to provide a process for manufacturing a resist composition which can prepare a resist composition lowered in coating defects, and the manufacturing process is a process for manufacturing a resist composition to be used in a process for manufacturing a semiconductor apparatus, the process comprising the steps of: cleaning a manufacturing apparatus for a resist composition with a cleaning solution; analyzing the cleaning solution taken out from the manufacturing apparatus; repeating the step of cleaning and the step of analyzing until a concentration of metal components contained in the cleaning solution becomes 5 ppb or less; and manufacturing the resist composition by using the manufacturing apparatus after the step of repeating.

This is to provide a process for manufacturing a resist composition which can prepare a resist composition lowered in coating defects, and the manufacturing process is a process for manufacturing a resist composition to be used in a process for manufacturing a semiconductor apparatus, the process comprising the steps of: cleaning a manufacturing apparatus for a resist composition with a cleaning solution; analyzing the cleaning solution taken out from the manufacturing apparatus; repeating the step of cleaning and the step of analyzing until a concentration of metal components contained in the cleaning solution becomes 5 ppb or less; and manufacturing the resist composition by using the manufacturing apparatus after the step of repeating.