An outer peripheral end of the substrate is held with a plurality of chuck pins provided at a spin plate abutting against a plurality of portions of the outer peripheral end of the substrate, and the spin plate is rotated about a rotation axis. A cleaning head is moved by a head moving mechanism while being pressed against a back surface of the substrate held by the plurality of chuck pins by the head moving mechanism, and foreign matter on the back surface of the substrate is removed by polishing with the cleaning head. A reaction force against a load applied to the back surface of the substrate by the cleaning head is generated in the substrate by auxiliary pins. Alternatively, the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning head, is further cleaned by a cleaning brush.

A device configured for cleaning bag filters with compressed air comprises a frame having a hollow interior defining a wall of the frame and openings formed through a thickness of the wall so that the hollow interior is in open communication with an environment external to the frame. A mounting member is configured to be releaseably or permanently attached to one end of the frame and is further configured to be releaseably or permanently attached to a member configured to pass air flow therethrough.

A device configured for cleaning bag filters with compressed air comprises a frame having a hollow interior defining a wall of the frame and openings formed through a thickness of the wall so that the hollow interior is in open communication with an environment external to the frame. A mounting member is configured to be releaseably or permanently attached to one end of the frame and is further configured to be releaseably or permanently attached to a member configured to pass air flow therethrough.

An apparatus for cleaning false lashes for includes a body having upper and lower supports, each including a plurality of apertures, that are movable relative to one another between open and closed positions, the open position providing access to an inner surface of the lower support, and the closed position substantially abuts the upper and lower supports against one other, and an arcuate locator on an inner surface of the lower support that positions a strip of a false lash such that strands of the false lash extend across at least one aperture. The false lash is secured between the upper and lower supports in the closed position. Running fluid through the apertures of the upper and lower supports allows the fluid to run through the strands of the false lash. A system and methods of cleaning false lashes is also disclosed.

An apparatus for cleaning false lashes for includes a body having upper and lower supports, each including a plurality of apertures, that are movable relative to one another between open and closed positions, the open position providing access to an inner surface of the lower support, and the closed position substantially abuts the upper and lower supports against one other, and an arcuate locator on an inner surface of the lower support that positions a strip of a false lash such that strands of the false lash extend across at least one aperture. The false lash is secured between the upper and lower supports in the closed position. Running fluid through the apertures of the upper and lower supports allows the fluid to run through the strands of the false lash. A system and methods of cleaning false lashes is also disclosed.

In a substrate cleaning device, with a polishing head in contact with one surface of a substrate rotated by a spin chuck, the polishing head is moved at least between a center and an outer periphery of the substrate. Thus, the one surface of the substrate is polished by the polishing head, and contaminants present on the one surface of the substrate are removed. At this time, capacity for removing contaminants by the polishing head is changed according to a position in a radial direction of the substrate. The capacity for removing contaminants refers to capacity for scraping contaminants adhering to the one surface of the substrate, and suction marks, contact marks and the like remaining on the one surface of the substrate by polishing. It is possible to change the capacity for removing contaminants by adjusting a pushing force exerted on the one surface of the substrate from the polishing head, for example.

In a substrate cleaning device, with a polishing head in contact with one surface of a substrate rotated by a spin chuck, the polishing head is moved at least between a center and an outer periphery of the substrate. Thus, the one surface of the substrate is polished by the polishing head, and contaminants present on the one surface of the substrate are removed. At this time, capacity for removing contaminants by the polishing head is changed according to a position in a radial direction of the substrate. The capacity for removing contaminants refers to capacity for scraping contaminants adhering to the one surface of the substrate, and suction marks, contact marks and the like remaining on the one surface of the substrate by polishing. It is possible to change the capacity for removing contaminants by adjusting a pushing force exerted on the one surface of the substrate from the polishing head, for example.

A system for cleaning a surface of a substrate includes a cleaning element including a resilient compressible material. A liquid source provides liquid directly to the cleaning element, and a squeezing roller engages the cleaning element and applies pressure thereto, to squeeze out excess liquid from said resilient compressible material. A counter element opposes said cleaning element such that the substrate is disposed between the counter element and the cleaning element. The substrate moves between the counter element and the cleaning element such that a surface of the cleaning element, having a suitable amount of liquid absorbed therein, engages and cleans the surface of the substrate without damaging the substrate.

A system for cleaning a surface of a substrate includes a cleaning element including a resilient compressible material. A liquid source provides liquid directly to the cleaning element, and a squeezing roller engages the cleaning element and applies pressure thereto, to squeeze out excess liquid from said resilient compressible material. A counter element opposes said cleaning element such that the substrate is disposed between the counter element and the cleaning element. The substrate moves between the counter element and the cleaning element such that a surface of the cleaning element, having a suitable amount of liquid absorbed therein, engages and cleans the surface of the substrate without damaging the substrate.

Embodiments of the present disclosure relate to a carrier mechanism for retaining optical devices. The carrier mechanism includes adjacent tray assemblies stacked such that a plurality of optical device lenses are retained therebetween. The carrier mechanism retains the plurality of optical device lenses without damaging the plurality of optical device lenses by contacting corners of the optical device lenses. The plurality of optical device lenses are retained with a plurality of support pins and a plurality of capture pins disposed in the tray assemblies. Each tray includes a plurality of openings corresponding to the plurality of optical device lenses such that fluids may contact the plurality of optical device lenses. The carrier mechanism may be utilized in multiple processing methods of the plurality of optical device lenses.