Provided is a cleaning apparatus that cleans a cleaning target portion of a workpiece by a downward nozzle or a lance. The cleaning apparatus includes: a support table rotatable about a first axis that extends horizontally and having a first through hole that passes through the support table in a direction of a second axis perpendicular to the first axis; a cleaning table on which the workpiece is to be installed and rotatable about the second axis, the cleaning table having a second through hole that passes through the cleaning table in a direction of the second axis to expose substantially entire surface of an installation surface of the workpiece; a nozzle base movable in a lateral direction, a front-rear direction, and a vertical direction relative to the support table; and a nozzle disposed on the nozzle base in a rotatable manner about a nozzle rotational axis extending in the vertical direction.

Systems and methods for cleaning a heat recovery steam generator system including tubes and fins associated therewith using deep cleaning alignment equipment are described. The deep cleaning alignment equipment primarily includes at least one wedge and at least one wand. The wedge may be an elongate wedge configured to maximize the surface area that contacts the tubes and fins, which in turn minimizes the amount of stress about any specific point of the tubes or the fins. Additionally, the wedge may be made of a soft, composite material, such as a high strength carbon fiber nylon. The composite material is softer than the material that makes the tubes and fins. As a result, when the wedge contacts the tubes and fins, the tubes and fins will not sustain damage. Instead, any damage that may occur would be to the wedge.

A cleaning method includes controlling an unmanned aerial vehicle (UAV) to fly to a region of a wall body according to a path to be cleaned, determining a distance between the UAV and a wall surface of the region of the wall body based on a cleaning mode, and controlling the UAV to clean the wall surface via the cleaning mode and at the determined distance away from the wall surface.

A flowback tank cleaning system and method is described. A flowback tank includes a self-cleaning system. A flowback tank cleaning method may include moving solid debris collected at a bottom of a collection section of a flowback tank towards a lift auger using a cleaning auger or a conveyer belt extending along a length of the collection section, the bottom of the collection section including an angled trough, funneling solid debris towards the cleaning auger or conveyor belt by placing the cleaning auger or conveyor belt at a base of the angled trough, spraying fluid downward through a series of fluid outlets, removing the sand so moved by the cleaning auger or conveyer belt from the flowback tank using the lift auger, and removing the fluid from the flowback tank using a drain manifold below the cleaning auger or conveyer belt.

A mask glue removing apparatus includes a first plate including a plurality of nozzles to be adjusted at independent dispensing angles of each other and a head in which the plurality of nozzles are installed and configured to move the head close to a position corresponding to a region of a mask in which glue is present, adjust the dispensing angles of the plurality of nozzles to face the region in which the glue is present, and dispense a chemical liquid, rinse, or air through the plurality of nozzles to remove the glue, and a second plate on which the mask is placed and configured to adjust a position of a main body according to a removal process for the glue.

A polishing device has a substrate stage which holds a substrate Wf, a processing head which processes a surface of the substrate Wf, an indentation detecting system which detects a position of an indentation in the substrate Wf, a movement mechanism which moves the processing head in a radial direction of the substrate stage, and a rotation mechanism which rotates the substrate stage, and the indentation detecting system has a fluid injection nozzle configured to inject a fluid to a circumferential edge portion of the substrate Wf when the substrate Wf is held on the substrate stage, a fluid measuring device which measures a physical quantity which is pressure or a flow rate of the fluid, and a position detector which detects the position of the indentation formed in the circumferential edge portion of the substrate Wf based on a change in physical quantity.

A flowback tank cleaning system and method is described. A flowback tank includes a self-cleaning system. A flowback tank cleaning method may include moving solid debris collected at a bottom of a collection section of a flowback tank towards a lift auger using a cleaning auger or a conveyer belt extending along a length of the collection section, the bottom of the collection section including an angled trough, funneling solid debris towards the cleaning auger or conveyor belt by placing the cleaning auger or conveyor belt at a base of the angled trough, spraying fluid downward through a series of fluid outlets, removing the sand so moved by the cleaning auger or conveyer belt from the flowback tank using the lift auger, and removing the fluid from the flowback tank using a drain manifold below the cleaning auger or conveyer belt.

A mask glue removing apparatus includes a first plate including a plurality of nozzles to be adjusted at independent dispensing angles of each other and a head in which the plurality of nozzles are installed and configured to move the head close to a position corresponding to a region of a mask in which glue is present, adjust the dispensing angles of the plurality of nozzles to face the region in which the glue is present, and dispense a chemical liquid, rinse, or air through the plurality of nozzles to remove the glue, and a second plate on which the mask is placed and configured to adjust a position of a main body according to a removal process for the glue.

A method for cleaning a first electrospray emitter of a mass spectrometer comprises: changing an operating mode of the first electrospray emitter from a stable jet mode of operation to a dripping or pulsating mode of operation by lowering a magnitude of a voltage applied between a counter electrode and the first electrospray emitter, |V.sub.1|; moving the first electrospray emitter from a first emitter position from which electrospray ions are delivered to a mass spectrometer inlet to a second emitter position and, simultaneously, moving a second electrospray emitter from a third emitter position to a fourth emitter position; causing a cleaning solvent to flow through the first electrospray emitter at least until a droplet of the cleaning solvent forms on an exterior surface of the first electrospray emitter while operating the electrospray emitter in the dripping mode of operation; and causing the droplet to dislodge from the emitter exterior.

A method for cleaning an electrospray emitter of a mass spectrometer comprises the steps of: (a) changing a mode of operation of the electrospray emitter from a stable jet mode of operation to a dripping mode or a pulsating mode of operation by lowering a magnitude, |V|, of a voltage applied between a counter electrode and the electrospray emitter; and (b) changing the mode of operation of the electrospray emitter from the dripping mode or the pulsating mode of operation to the stable jet mode of operation by increasing the magnitude, |V|, of the applied voltage; wherein the repetitions are performed at a predetermined frequency that depends on one or more of liquid flow rate, an emitter internal diameter, and liquid properties.