The present invention discloses a method for manufacturing an insulated spherical weld gold wire for integrated circuit double-layer stacked package, which relates to the technical field of microelectronic packaging spherical weld gold wires, and specifically comprises the following steps: alloy sheet preparation; alloy rod preparation; stretching; annealing treatment; activation treatment; sputtered insulating coating; multi-winding and sub-packaging, since the polyaryletherketone insulating coating is provided on the surface of the spherical weld gold wire in a scaled integrated circuit and the double-layer stacked package of the present invention, the spherical weld gold wire is allowed to contact and cross during packaging, without affecting the product performance, cost and quality; two high-hardness and high-conductivity materials of cobalt and germanium are added, which greatly enhances the tensile strength of the material.

In order to produce a wall profile on an inside of a plastically deformable hollow body wall of a hollow body, a forming mandrel is arranged in the interior of a cavity of the hollow body so that the forming mandrel extends at the level of a first longitudinal portion of the hollow body wall with a mandrel portion having an enlarged cross-section, which has a forming mandrel profile portion and a cross-sectional oversize compared to a mandrel portion having a reduced cross-section, which extends at the level of a second longitudinal portion of the hollow body wall and has a further forming mandrel profile portion. A forming die is moved with a forming movement relative to the hollow body wall and relative to the mandrel portion with an enlarged cross-section and relative to the mandrel portion with a reduced cross-section of the forming mandrel.

In order to produce a wall profile on an inside of a plastically deformable hollow body wall of a hollow body, a forming mandrel is arranged in the interior of a cavity of the hollow body so that the forming mandrel extends at the level of a first longitudinal portion of the hollow body wall with a mandrel portion having an enlarged cross-section, which has a forming mandrel profile portion and a cross-sectional oversize compared to a mandrel portion having a reduced cross-section, which extends at the level of a second longitudinal portion of the hollow body wall and has a further forming mandrel profile portion. A forming die is moved with a forming movement relative to the hollow body wall and relative to the mandrel portion with an enlarged cross-section and relative to the mandrel portion with a reduced cross-section of the forming mandrel.