A method for fabricating a double layer cup-shaped part may include shaping a first material into a hollow cylinder, mounting the hollow cylinder on a draw punch, where the draw punch may include an upper punch portion with a first diameter and a lower punch portion with a second smaller diameter. Mounting the hollow cylinder on the draw punch may include tightly fitting the hollow cylinder around the lower punch portion. The method may further include forming the double layer cup-shaped part by drawing a blank material through a draw die by placing the blank material over an upper opening of the draw die, and pressing the draw punch over the blank material. The first material may form an inner layer of the double layer cup-shaped part and the blank material may form an outer cup-shaped layer of the double layer cup-shaped part.

A forming tool includes at least one first die half where the first die half has an insert part which is designed to move a finished component out of the first die half along a direction of motion where a displacement direction of the insert part is inclined relative to the direction of motion.

A forming tool includes at least one first die half where the first die half has an insert part which is designed to move a finished component out of the first die half along a direction of motion where a displacement direction of the insert part is inclined relative to the direction of motion.

A laminated hard film is obtained by laminating a layer A and a layer B. The layer A has a composition different from that of the layer B. The layer A is formed of (Ti.sub.aCr.sub.bAl.sub.cSi.sub.d)(C.sub.xN.sub.1-x) and satisifies the relationship of 0≦a≦0.10, 0.10≦b≦0.50, 0.50≦c≦0.90, 0≦d≦0.05, a+b+c+d=1 and 0≦x≦0.5. The layer B is formed of (Cr.sub.eSi.sub.1-e)(C.sub.yN.sub.1-y) and satisfies the relationship of 0.90≦e≦1.0 and 0≦y≦0.5, or is formed of (Al.sub.fSi.sub.1-f)(C.sub.2N.sub.1-z) and satisfies the relationship of 0.90≦f≦1.0 and 0≦x≦0.5. Each of the layer A and the layer B has a thickness of 2 to 100 nm, and the layer A and the layer B are each alternately laminated.

A laminated hard film is obtained by laminating a layer A and a layer B. The layer A has a composition different from that of the layer B. The layer A is formed of (Ti.sub.aCr.sub.bAl.sub.cSi.sub.d)(C.sub.xN.sub.1-x) and satisifies the relationship of 0≦a≦0.10, 0.10≦b≦0.50, 0.50≦c≦0.90, 0≦d≦0.05, a+b+c+d=1 and 0≦x≦0.5. The layer B is formed of (Cr.sub.eSi.sub.1-e)(C.sub.yN.sub.1-y) and satisfies the relationship of 0.90≦e≦1.0 and 0≦y≦0.5, or is formed of (Al.sub.fSi.sub.1-f)(C.sub.2N.sub.1-z) and satisfies the relationship of 0.90≦f≦1.0 and 0≦x≦0.5. Each of the layer A and the layer B has a thickness of 2 to 100 nm, and the layer A and the layer B are each alternately laminated.

A guide pin assembly for metal forming dies includes a cylindrical guide pin body with an external retainer groove adjacent one end thereof in which a retainer ring is received. An annular guide pin ring with an outside diameter greater than the pin body, has a counterbore adjacent the outside end thereof and a retainer groove in a medial portion thereof which receives the outer portion of the retainer ring to securely interconnect the pin body and the ring and thereby form an enlarged head at one end of the pin body which positively limits reciprocal motion between two associated die members. A circular guide pin head cap covers the outer end of the head ring, and includes a support collar that is closely received in the counterbore of the ring, and engages the retainer ring to securely hold the same in place.

A guide pin assembly for metal forming dies includes a cylindrical guide pin body with an external retainer groove adjacent one end thereof in which a retainer ring is received. An annular guide pin ring with an outside diameter greater than the pin body, has a counterbore adjacent the outside end thereof and a retainer groove in a medial portion thereof which receives the outer portion of the retainer ring to securely interconnect the pin body and the ring and thereby form an enlarged head at one end of the pin body which positively limits reciprocal motion between two associated die members. A circular guide pin head cap covers the outer end of the head ring, and includes a support collar that is closely received in the counterbore of the ring, and engages the retainer ring to securely hold the same in place.

An energy-dissipating cover for covering a component sensitive to mechanical impulse includes a sheet of selected ferrous or aluminum alloy, the sheet having a top surface, a bottom surface, an outer perimeter, an overall area within the outer perimeter and a nominal thickness of no more than 2.5 mm. The sheet is configured for connection with one or more external structures at a plurality of connection points within the outer perimeter, wherein the overall area comprises a plurality of supported areas and at least one unsupported area. Embossments are formed within the at least one unsupported area and extend outward from the bottom surface. The embossments are shaped, sized and arranged so as to limit orthogonal deflection of the sheet from a mechanical impulse directed normal to the bottom surface of the sheet at the plurality of embossments.

An energy-dissipating cover for covering a component sensitive to mechanical impulse includes a sheet of selected ferrous or aluminum alloy, the sheet having a top surface, a bottom surface, an outer perimeter, an overall area within the outer perimeter and a nominal thickness of no more than 2.5 mm. The sheet is configured for connection with one or more external structures at a plurality of connection points within the outer perimeter, wherein the overall area comprises a plurality of supported areas and at least one unsupported area. Embossments are formed within the at least one unsupported area and extend outward from the bottom surface. The embossments are shaped, sized and arranged so as to limit orthogonal deflection of the sheet from a mechanical impulse directed normal to the bottom surface of the sheet at the plurality of embossments.

The present invention discloses a device for assembling products in a die. The device comprises a pushing portion and an assembling portion. The pushing portion comprises a pushing block (11), a pushing spring (10) and a pushing wedge (9) wherein the pushing block (11) is connected with the pushing spring (10), the pushing wedge (9) is arranged above the pushing block (11) and is in wedge-shaped connection with the pushing block (11). The assembling portion comprises an assembling wedge (6), a transmission wedge (4) and an assembling male die (5), wherein the transmission wedge (4) is arranged above the assembling male die (5) in wedge-shaped connection and both of them are arranged in the lower die base (2), the assembling wedge (6) is arranged above the transmission wedge (4) in wedge-shaped connection while in contact.