A workpiece manufacturing apparatus includes a punch, which is provided in a lower die assembly and punches out a workpiece from an unprocessed material, and an ejector, which is provided in an upper die assembly so as to be capable of approaching and moving away from the lower die assembly. The manufacturing apparatus further includes a spring, which is provided in the upper die assembly and urges the ejector toward the lower die assembly, and a locking device, which locks the ejector with respect to the upper die assembly at a position at which the punch punches out the workpiece and releases the ejector when the die assemblies are opened. The locking device includes an actuator, which is provided in the upper die assembly and slides a slider between a locking position, at which the ejector is locked, and a releasing position, at which the ejector is released.