B21D53/02

Configurable cold-plates of datacenter cooling systems
11343940 · 2022-05-24 · ·

A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.

CURVED HEAT EXCHANGER AND METHOD OF MANUFACTURING
20220155015 · 2022-05-19 ·

A heat exchanger has an upper manifold with a first curved section; a lower manifold spaced from and extending parallel to the upper manifold and having a second curved section; a plurality of refrigerant tubes, and a plurality of corrugated fins. Each corrugated fin is formed by a strip having radiused portions alternating with planar portions, and the radiused portions are in contact with the respective adjacent refrigerant tubes. Each of the fins has a curve-inner edge and a curve outer edge and at least one edge of the curve-inner edge and the curve outer edge of at least one fin has a recessed portion in the planar portions that is recessed inward toward a center of the core.

Method of producing heat-dissipating unit
11335623 · 2022-05-17 · ·

[Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost. [Solution] The method of producing a heat-dissipating unit 12 includes: inserting pins 17 punched out of a second plate member 22 for pins into a plurality of through-holes 16 formed in a first plate member 20 for a substrate. In the first plate member 20, a plurality of substrate forming portions 25 is provided side by side in the longitudinal direction of the first plate member 20. In the second plate member 22, a plurality of pin punch-out portions 26 is provided side by side in the longitudinal direction of the second plate member 22. The method includes: a step A of forming the through-holes 16 in the substrate forming portion 25 of the first plate member 20; a step B of subjecting the pin punch-out portion 26 of the second plate member 22 to a half-punch out process to form half-punched-out pin forming portions 27 protruding from one surface side of the second plate member 22; a step C of forming the pins 17 by punching out the pin forming portions 27 from the second plate member 22 and simultaneously inserting the pins 17 into the through-holes 16 in the first plate member 20; and a step D of forming a substrate by cutting the substrate forming portion 25 with the pins 17 inserted in the through-holes 16 from the first plate member 20.

Method of producing heat-dissipating unit
11335623 · 2022-05-17 · ·

[Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost. [Solution] The method of producing a heat-dissipating unit 12 includes: inserting pins 17 punched out of a second plate member 22 for pins into a plurality of through-holes 16 formed in a first plate member 20 for a substrate. In the first plate member 20, a plurality of substrate forming portions 25 is provided side by side in the longitudinal direction of the first plate member 20. In the second plate member 22, a plurality of pin punch-out portions 26 is provided side by side in the longitudinal direction of the second plate member 22. The method includes: a step A of forming the through-holes 16 in the substrate forming portion 25 of the first plate member 20; a step B of subjecting the pin punch-out portion 26 of the second plate member 22 to a half-punch out process to form half-punched-out pin forming portions 27 protruding from one surface side of the second plate member 22; a step C of forming the pins 17 by punching out the pin forming portions 27 from the second plate member 22 and simultaneously inserting the pins 17 into the through-holes 16 in the first plate member 20; and a step D of forming a substrate by cutting the substrate forming portion 25 with the pins 17 inserted in the through-holes 16 from the first plate member 20.

Heat exchanger fin and manufacturing method of the same
11725885 · 2023-08-15 · ·

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

Method for producing a heat exchanger

A method for producing a heat exchanger having tubes that are each received at a longitudinal end side in an associated header, the tubes and the headers are formed out of aluminium. The method may include soldering the tubes and the headers to one another to form a coolant-conducting channel structure, and cold-forming the heat exchanger following the soldering of the tubes to the headers such that strength is thereby increased.

CONFORMAL HEAT EXCHANGER
20230251040 · 2023-08-10 ·

A heat exchanger is provided and includes parting sheets flat along a first axis and curved along a second axis perpendicular to the first axis, a fin sheet interposed between the parting sheets and corrugated along the first axis to form fins that are curved along the second axis and diffusion bonds formed along an entire length of a fin to diffusion bond the entire length of the fin to the parting sheets.

Plate fin crossflow heat exchanger
11187470 · 2021-11-30 · ·

A heat exchanger includes a body that includes an at least two opposing surfaces and the at least two opposing surfaces are a trapezoidal. The body of the heat exchanger also includes, an area of cross sectional flow channels through the body. The area of cross-sectional flow channels in a direction perpendicular to the bases of the trapezoid increase or decrease between the two bases.

Plate fin crossflow heat exchanger
11187470 · 2021-11-30 · ·

A heat exchanger includes a body that includes an at least two opposing surfaces and the at least two opposing surfaces are a trapezoidal. The body of the heat exchanger also includes, an area of cross sectional flow channels through the body. The area of cross-sectional flow channels in a direction perpendicular to the bases of the trapezoid increase or decrease between the two bases.

Heat exchange system and method of assembly

A method of constructing a coil wound heat exchange module and transporting and installing the coil wound heat exchange module at a plant site, such as an natural gas liquefaction plant. A module frame is constructed and attached to a heat exchanger shell prior to telescoping of a coil wound mandrel into the shell. The module frame includes a lug and two saddles that remain attached to the shell throughout the process and when the heat exchanger is operated. The lug and saddles are constructed and located to stabilize the shell during construction, telescoping and transport (when in a horizontal orientation), and when the shell is installed at the plant site (in a vertical orientation). The lugs and saddles are adapted to allow for thermal expansion and contraction of the shell when it is transitioned from ambient to operating temperature and vice versa.