A die holder mounts a die to form heads on nails or screws. A top surface of the die includes a groove for longitudinally receiving and holding an elongate body. The die has a recess merging into the groove at one end of the groove to form a nail or screw head. The die is conical for press fit by contact with an inner surface of a bore or hole in the die holder. A top surface of the die is planar to a top surface of the die holder with a bottom surface engaging bottom part of the die holder. The bottom portion of the die has a recess or engaging with a corresponding protrusion die holder fixing an angular orientation of the groove relative to the die holder. Two opposite dies are brought together by two opposite die holders forming the head.

A die holder mounts a die to form heads on nails or screws. A top surface of the die includes a groove for longitudinally receiving and holding an elongate body. The die has a recess merging into the groove at one end of the groove to form a nail or screw head. The die is conical for press fit by contact with an inner surface of a bore or hole in the die holder. A top surface of the die is planar to a top surface of the die holder with a bottom surface engaging bottom part of the die holder. The bottom portion of the die has a recess or engaging with a corresponding protrusion die holder fixing an angular orientation of the groove relative to the die holder. Two opposite dies are brought together by two opposite die holders forming the head.

A die holder mounts a die to form heads on nails or screws. A top surface of the die includes a groove for longitudinally receiving and holding an elongate body. The die has a recess merging into the groove at one end of the groove to form a nail or screw head. The die is conical for press fit by contact with an inner surface of a bore or hole in the die holder. A top surface of the die is planar to a top surface of the die holder with a bottom surface engaging bottom part of the die holder. The bottom portion of the die has a recess or engaging with a corresponding protrusion die holder fixing an angular orientation of the groove relative to the die holder. Two opposite dies are brought together by two opposite die holders forming the head.

Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.

Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.