B22F1/06

ALLOY STEEL POWDER FOR POWDER METALLURGY, AND SINTERED BODY

An Fe—Mo—Cu—C-based alloy steel powder for powder metallurgy has a chemical composition containing Mo: 0.2 mass % to 1.5 mass %, Cu: 0.5 mass % to 4.0 mass %, and C: 0.1 mass % to 1.0 mass %, with a balance being Fe and incidental impurities, wherein an iron-based powder has a mean particle size of 30 μm to 120 μm, and a Cu powder has a mean particle size of 25 μm or less. Despite the alloy steel powder for powder metallurgy having a chemical composition not containing Ni, a part produced by sintering a press formed part of the powder and further carburizing-quenching-tempering the sintered part has mechanical properties of at least as high tensile strength, toughness, and sintered density as a Ni-added part.

METALLIC COPPER PARTICLES, AND PRODUCTION METHOD THEREFOR
20170252801 · 2017-09-07 ·

Provided are: metallic copper particles exhibiting excellent low-temperature sintering properties at temperatures equal to or lower than 300° C.; and a production method therefor. In these metallic copper particles, metallic copper fine particles are adhered to the surfaces of large-diameter metallic copper particles. With regard to the metallic copper particles to be produced, copper oxide and hypophosphoric acid and/or a salt thereof are mixed and reduced, preferably in the presence of 1-500 mass % of gelatin and/or collagen peptide. The reduction reaction temperature is preferably in the range of 20-100° C. The produced metallic copper particles have a volume resistivity value when heated to a temperature of 300° C. under a nitrogen atmosphere of 1×10-2 Ω.Math.cm or less.

SILVER-COATED COPPER POWDER, AND CONDUCTIVE PASTE, CONDUCTIVE COATING MATERIAL AND CONDUCTIVE SHEET, EACH OF WHICH USES SAID SILVER-COATED COPPER POWDER
20170253750 · 2017-09-07 ·

Provided is a dendritic silver-coated copper powder which is prevented from agglomeration, while ensuring excellent electrical conductivity by increasing contact points in cases where silver-coated dendritic copper powder particles are in contact with each other. This dendritic silver-coated copper powder is suitable for use in conductive pastes, electromagnetic shielding materials and the like. A dendritic silver-coated copper powder 1 according to the present invention has a dendritic form which comprises a linearly grown main trunk 2 and a plurality of branches 3 arising from the main trunk 2. The main trunk 2 and the branches 3 are configured of copper particles which have plate-like shapes having an average cross-sectional thickness of 0.2-1.0 μm, and the surfaces of which are coated with silver. This dendritic silver-coated copper powder 1 has an average particle diameter (D50) of 5.0-30 μm as determined by a laser diffraction/scattering particle size distribution measuring method.

Method for manufacturing powder magnetic core, and method for manufacturing electromagnetic component

A method for manufacturing a powder magnetic core includes: a step of preparing a soft magnetic powder and an oxide powder and preparing, as a raw material powder, a mixed powder of the soft magnetic powder and the oxide powder, the soft magnetic powder containing composite soft magnetic particles containing pure iron and an Fe-α alloy having an element α more oxidizable than Fe, the composite soft magnetic particles each having a core-shell structure where a core is made of one of pure iron and the Fe-α alloy and a shell is made of the other, the oxide powder containing oxide particles containing at least one selected from Fe and an element β that forms an oxide having higher electrical resistance than Fe.sub.3O.sub.4; a step of compacting the mixed powder into a green compact; and a step o sintering the green compact at 900° C. or more and 1300° C. or less.

Systems and methods for additive manufacturing using aluminum metal-cored wire

A method of forming an additively manufactured aluminum part includes establishing an arc between a metal-cored aluminum wire and the additively manufactured aluminum part, wherein the metal-cored aluminum wire includes a metallic sheath and a granular core disposed within the metallic sheath. The granular core comprises aluminum metal matrix nano-composites (Al-MMNCs) that comprise an aluminum metal matrix and ceramic nanoparticles. The method includes melting a portion of the metal-cored aluminum wire using the heat of the arc to form molten droplets. The method includes transferring the molten droplets to the additively manufactured aluminum part under an inert gas flow, and solidifying the molten droplets under the inert gas flow to form deposits of the additively manufactured aluminum part.

METHODS FOR MANUFACTURING A WROUGHT METALLIC ARTICLE FROM A METALLIC-POWDER COMPOSITION
20220193766 · 2022-06-23 · ·

A method for manufacturing a wrought metallic article from metallic-powder compositions comprises steps of (1) compacting the metallic-powder composition to yield a compact, having a surface, a cross-sectional area, and a relative density of less than 100 percent, (2) reducing the cross-sectional area of the compact via an initial forming pass of a rotary incremental forming process so that the compact has a decreased cross-sectional area, and (3) reducing the decreased cross-sectional area of the compact via a subsequent forming pass of the rotary incremental forming process by a greater percentage than that, by which the cross-sectional area of the compact was reduced during the initial forming pass.

FORMING THREE-DIMENSIONAL (3D) PRINTED ELECTRONICS

In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.

FORMING THREE-DIMENSIONAL (3D) PRINTED ELECTRONICS

In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.

IRON BASED POWDER

A diffusion-bonded powder having an iron powder having 1-5%, preferably 1.5-4% and most preferably 1.5-3.5% by weight of copper particles diffusion bonded to the surfaces of the iron powder particles. The diffusion bonded powder is suitable for producing components having high sintered density and minimum variation in copper content. The iron powder may be produced by providing an atomized iron powder with an oxygen content of 0.3-1.2% by weight and with a carbon content of 0.1-0.5% by weight, and subjecting the atomized iron powder and a copper containing powder to a reduction annealing process in a reducing atmosphere to obtain the iron based powder.

IRON BASED POWDER

A diffusion-bonded powder having an iron powder having 1-5%, preferably 1.5-4% and most preferably 1.5-3.5% by weight of copper particles diffusion bonded to the surfaces of the iron powder particles. The diffusion bonded powder is suitable for producing components having high sintered density and minimum variation in copper content. The iron powder may be produced by providing an atomized iron powder with an oxygen content of 0.3-1.2% by weight and with a carbon content of 0.1-0.5% by weight, and subjecting the atomized iron powder and a copper containing powder to a reduction annealing process in a reducing atmosphere to obtain the iron based powder.