A polycrystalline diamond construction has a body of polycrystalline diamond (PCD) material; and a cemented carbide substrate bonded to the body of polycrystalline material along an interface. The cemented carbide substrate has tungsten carbide particles bonded together by a binder material, the binder material comprising Co; and the tungsten carbide particles form at least around 70 weight percent and at most around 95 weight percent of the substrate. The cemented carbide substrate has a bulk volume, the bulk volume of the cemented carbide substrate having at least around 0.1 vol. % of inclusions of free carbon having a largest average size in any one or more dimensions of less than around 40 microns.

Some variations provide a composition for additive manufacturing (3D printing) of metals, comprising: from 10 vol % to 70 vol % of a photocurable liquid resin; from 10 vol % to 70 vol % of metal or metal alloy particles, optionally configured with a photoreflective surface; and from 0.01 vol % to 10 vol % of a photoinitiator. Other variations provide a composition for additive manufacturing of metals, comprising: from 1 vol % to 70 vol % of a photocurable liquid resin; from 0.1 vol % to 98 vol % of an organometallic compound containing a first metal; from 1 vol % to 70 vol % of metal or metal alloy particles containing a second metal (which may be the same as or different than the first metal); and from 0.01 vol % to 10 vol % of a photoinitiator. Many examples of metals, photocurable resins, organometallic compounds, photoinitiators, and optional additives are disclosed, and methods of making and using the composition are described.

This application relates to a method of preparing a composite material for a semiconductor test socket, and a composite material prepared through the method. In one embodiment, the method includes preparing a powder mixture including (i) a metal powder comprising aluminum or aluminum alloy particles and magnesium particles and (ii) a polymer powder. The method may also include sintering the powder mixture to produce the composite material using a spark plasma sintering (SPS) process. This application also relates to a method of manufacturing a semiconductor test socket, the method including forming an insulating portion of the semiconductor test socket with the composite material. This application further relates to a semiconductor test socket produced through the method.

This application relates to a method of preparing a composite material for a semiconductor test socket, and a composite material prepared through the method. In one embodiment, the method includes preparing a powder mixture including (i) a metal powder comprising aluminum or aluminum alloy particles and magnesium particles and (ii) a polymer powder. The method may also include sintering the powder mixture to produce the composite material using a spark plasma sintering (SPS) process. This application also relates to a method of manufacturing a semiconductor test socket, the method including forming an insulating portion of the semiconductor test socket with the composite material. This application further relates to a semiconductor test socket produced through the method.

A heat conductive paste including silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5, an aliphatic primary amine and a compound having at least one phosphoric acid group. The heat conductive paste includes 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group based on 100 parts by mass of the silver fine particles. The heat conductive paste has a high conductivity.

Zinc is added to a metal magnetic alloy powder including iron and silicon. An element is formed using this magnetic material, and a coil is formed inside or on the surface of the element.

Zinc is added to a metal magnetic alloy powder including iron and silicon. An element is formed using this magnetic material, and a coil is formed inside or on the surface of the element.

A double-layer sliding bearing comprises an inner layer and an outer layer. An inner periphery of the outer layer is integrated with an outer periphery of the inner layer through moulds for molding processes. A circular bearing surface is formed on either an inner periphery of the inner layer or an outer periphery of the outer layer. A layer having the bearing surface is arranged by a porous thin-wall layer with high forming density. The other layer not having the bearing surface is arranged by a porous thick-wall layer with low forming density.

In some examples, an additive manufacturing technique for forming a vacuum insulator. For example, a method including forming an article including a first layer, a second layer, and at least one support member extending between the first and second layer by depositing a filament via a filament delivery device, wherein the filament includes a sacrificial binder and a powder, and wherein the first layer, second layer, and at least one support member define an open cavity within the article; removing the binder; and sintering the article to form the vacuum insulator, wherein the vacuum insulator defines a vacuum environment in the cavity.

In some examples, an additive manufacturing technique for forming a vacuum insulator. For example, a method including forming an article including a first layer, a second layer, and at least one support member extending between the first and second layer by depositing a filament via a filament delivery device, wherein the filament includes a sacrificial binder and a powder, and wherein the first layer, second layer, and at least one support member define an open cavity within the article; removing the binder; and sintering the article to form the vacuum insulator, wherein the vacuum insulator defines a vacuum environment in the cavity.