Patent classifications
B22F3/22
Surface Modified Metallic Particulate In Sintered Products
Disclosed are interfacially modified metal particulate composite materials for use in powder metallurgy sintered products and processes.
Sintered body, method of manufacturing sintered body, combustor panel, and method of manufacturing combustor panel
By melting a shaping material in which a metal powder and a binder are mixed and by carrying out injection molding (primary shaping) in an injection mold, an injection molded body, or an intermediate shaped body are produced. The injection molded body or the intermediate shaped body is placed by a transfer mold and is subjected to a gravity shaping (secondary shaping) with a transformation. A sintered body is manufactured by carrying out debindering and sintering to the injection molded body.
Process For Producing Gripping Elements For Sealing and Restraint Systems For Fluid Pipelines and Pipe Joints Produced Thereby
A method is shown for manufacturing a hardened gripping element for a sealing and restraint system used for forming a pipe joint in a fluid pipeline. Instead of machining the gripping elements used in the system from a metal stock, a special series of metal injection molding steps are utilized. A metal polymer composite mix is first formed having a metal particulate phase and a polymer phase. A green metal composite article is formed by either extruding the composite mix or molding the composite mix into a metal polymer composite article having at least one gripping surface having a plurality of gripping teeth. The composite article is subjected to thermal debinding and sintering to produce a finished or near finished hardened gripping element.
IN-SITU MEASUREMENT AND FEEDBACK CONTROL OF ADDITIVELY MANUFACTURED ELECTRICAL PASSIVE COMPONENTS
Systems and methods of additively manufacturing passive electronic components are provided. An additive manufacturing device may deposit a material to create a passive electronic component. A sensor may continuously measure an electrical property of the passive electronic component across two electrical contacts as the material is deposited during manufacturing. The sensor may transmit the measured electrical property to a processor whereby the processor may adjust a material deposition rate of the additive manufacturing device. The continuous measurement of the electrical property and adjustment of the material deposition rate as the passive electronic component is produced allows for passive electronic components to be manufactured to a high degree of accuracy of the electrical property.
IN-SITU MEASUREMENT AND FEEDBACK CONTROL OF ADDITIVELY MANUFACTURED ELECTRICAL PASSIVE COMPONENTS
Systems and methods of additively manufacturing passive electronic components are provided. An additive manufacturing device may deposit a material to create a passive electronic component. A sensor may continuously measure an electrical property of the passive electronic component across two electrical contacts as the material is deposited during manufacturing. The sensor may transmit the measured electrical property to a processor whereby the processor may adjust a material deposition rate of the additive manufacturing device. The continuous measurement of the electrical property and adjustment of the material deposition rate as the passive electronic component is produced allows for passive electronic components to be manufactured to a high degree of accuracy of the electrical property.
Method for manufacturing powder magnetic core
The invention provides a method for manufacturing a powder magnetic core through simple compression molding and capable of manufacturing a complicatedly shaped powder magnetic core with reliable high strength and insulating properties. The invention is directed to a method for manufacturing a powder magnetic core with a metallic soft magnetic material powder, the method including: a first step including mixing a soft magnetic material powder and a binder; a second step including compression molding the mixture obtained after the first step; a third step including performing at least one of grinding and cutting on the compact obtained after the second step; and a fourth step including heat-treating the compact after the third step, wherein in the fourth step, the compact is heat-treated so that an oxide layer containing an element constituting the soft magnetic material powder is formed on the surface of the soft magnetic material powder.
Method for manufacturing powder magnetic core
The invention provides a method for manufacturing a powder magnetic core through simple compression molding and capable of manufacturing a complicatedly shaped powder magnetic core with reliable high strength and insulating properties. The invention is directed to a method for manufacturing a powder magnetic core with a metallic soft magnetic material powder, the method including: a first step including mixing a soft magnetic material powder and a binder; a second step including compression molding the mixture obtained after the first step; a third step including performing at least one of grinding and cutting on the compact obtained after the second step; and a fourth step including heat-treating the compact after the third step, wherein in the fourth step, the compact is heat-treated so that an oxide layer containing an element constituting the soft magnetic material powder is formed on the surface of the soft magnetic material powder.
Thin Sheet-Like Connecting Member and Manufacturing Method therefor, Semiconductor Device and Manufacturing Method therefor, and Power Conversion Device
A method for manufacturing a thin sheet-like bonding member, including applying a paste including first particles including a first metal, second particles including a second metal having a lower melting point than the first metal, and a solvent to a surface of a base material made of a substance that does not react with the second metal; heating the paste at a temperature lower than a melting point of the first metal and higher than the melting point of the second metal to form a thin sheet-like bonding member on the surface of the base material; and peeling the thin sheet-like bonding member from the base material to obtain the thin sheet-like bonding member.
Thin Sheet-Like Connecting Member and Manufacturing Method therefor, Semiconductor Device and Manufacturing Method therefor, and Power Conversion Device
A method for manufacturing a thin sheet-like bonding member, including applying a paste including first particles including a first metal, second particles including a second metal having a lower melting point than the first metal, and a solvent to a surface of a base material made of a substance that does not react with the second metal; heating the paste at a temperature lower than a melting point of the first metal and higher than the melting point of the second metal to form a thin sheet-like bonding member on the surface of the base material; and peeling the thin sheet-like bonding member from the base material to obtain the thin sheet-like bonding member.
SINTERED BODY, METHOD OF MANUFACTURING SINTERED BODY, COMBUSTOR PANEL, AND METHOD OF MANUFACTURING COMBUSTOR PANEL
By melting a shaping material in which a metal powder and a binder are mixed and by carrying out injection molding (primary shaping) in an injection mold, an injection molded body, or an intermediate shaped body are produced. The injection molded body or the intermediate shaped body is placed by a transfer mold and is subjected to a gravity shaping (secondary shaping) with a transformation. A sintered body is manufactured by carrying out debindering and sintering to the injection molded body.