A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.

The present application provides a method for manufacturing a metal foam. The present application can provide a method for manufacturing a metal foam, which is capable of forming a metal foam comprising uniformly formed pores and having excellent mechanical properties as well as the desired porosity, and a metal foam having the above characteristics. In addition, the present application can provide a method capable of forming a metal foam in which the above-mentioned physical properties are ensured, while being in the form of a thin film or sheet, within a fast process time, and such a metal foam.

Methods for fabricating an interconnect for a fuel cell stack that include providing a protective layer over at least one surface of an interconnect formed by powder pressing pre-alloyed particles containing two or more metal elements and annealing the interconnect and the protective layer at elevated temperature to bond the protective layer to the at least one surface of the interconnect.

Methods for fabricating an interconnect for a fuel cell stack that include providing a protective layer over at least one surface of an interconnect formed by powder pressing pre-alloyed particles containing two or more metal elements and annealing the interconnect and the protective layer at elevated temperature to bond the protective layer to the at least one surface of the interconnect.

A method for producing three-dimensional magnetic shields with a sufficient permeability from unannealed, soft-annealed, or magnetization annealed magnetically soft metal sheets, wherein the metal sheet is either cold formed into the three-dimensional component in a one-step or multi-step process, then is subjected to a (magnetization) annealing to increase the permeability, and is then transferred to a forming tool, in which it is held and/or pressed in a tool, which has the desired contour of the component, and is optionally shape-corrected or calibrated by the tool, and allowed to cool in the tool, or a sheet is heated and then formed to the desired geometry in a hot-forming tool and held in it, and is allowed to cool in the tool, or the three-dimensional component is generated by additive production and then is subjected to a (magnetization) annealing to increase the permeability; the invention also relates to a shielding device.

A susceptor for use in a heat-not-burn device, and a method of manufacturing thereof, using metal pieces incorporated together into a single unitary piece using a variety of techniques, such as compacting, heat and pressure, sintering, weaving, extruding, and the like, such that the susceptor is susceptible to degradation after use.

Laser additive manufacturing and a method for preparing thin-walled preforms by laser metal deposition and follow-up rolling. This can solve the problems that when the existing laser metal deposition technology prepares the thin-walled preforms, the limit width size of a molten pool at high power affects the forming wall thickness of the preforms so that it is difficult to prepare preforms with wall thickness less than 2 mm, and the problems of poor surface quality and low accuracy of preforms due to convex and concave peaks caused by the interlayer overlapping, but also can solve the problems that a laser beam with a preset trajectory cannot act on the end surfaces of the preforms due to preform deformation caused by residual stress in a printing process so that the preforms cannot be continuously formed.

This application provides a battery current collector and a preparation method thereof, a secondary battery, a battery module, a battery pack, and an electric apparatus. The battery current collector includes a foam metal layer (1) and a strength enhancement layer (2), where the strength enhancement layer (2) is a sheet-shaped metal layer, and the strength enhancement layer (2) and the foam metal layer (1) are stacked and metallurgically bonded, alleviating a problem of poor mechanical performance of current collectors in the related art. The strength enhancement layer (2) and the foam metal layer (1) are connected by metallurgical bonding, which helps ensure not only structural strength of the strength enhancement layer (2) and the foam metal layer (1), but also good conductivity between the strength enhancement layer (2) and the foam metal layer (1). Further, the manner of metallurgical bonding helps reduce production costs.

A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.

A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.