B22F5/006

Sintering materials and attachment methods using same

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Method for processing and manufacturing a metal structural material by a coiling, sintering and plastic working of a metal screen mesh
11407029 · 2022-08-09 · ·

Provided is a method for processing and manufacturing a metal structural material by knitting metal wires into metal screen mesh strips, tightly coiling the metal screen mesh strips to form a coiled blank body which is coated layer-by-layer and in which an outer-layer material tightly covers an inner-layer material; sintering the coiled blank body; reducing gaps within the coiled blank body material by plastic processing to reach a porosity that fulfills requirements, and manufacturing mechanical structural parts therefrom.

Method of fabricating an interconnect for a fuel cell stack
11417894 · 2022-08-16 · ·

Methods for fabricating an interconnect for a fuel cell stack that include providing a protective layer over at least one surface of an interconnect formed by powder pressing pre-alloyed particles containing two or more metal elements and annealing the interconnect and the protective layer at elevated temperature to bond the protective layer to the at least one surface of the interconnect.

Method of fabricating an interconnect for a fuel cell stack
11417894 · 2022-08-16 · ·

Methods for fabricating an interconnect for a fuel cell stack that include providing a protective layer over at least one surface of an interconnect formed by powder pressing pre-alloyed particles containing two or more metal elements and annealing the interconnect and the protective layer at elevated temperature to bond the protective layer to the at least one surface of the interconnect.

TILED POROUS ARCHITECTED COMPOSITIONS, METHODS OF THEIR MAKING AND METHODS OF THEIR USE

Provided herein are compositions having a porous, architected three-dimensional geometry that are tiled to achieve increased surface area and/or volume. The tiled compositions include a plurality of tiles having seams where one of the plurality of tiles contacts an adjacent tile. Also provided herein are methods and systems for making the compositions.

SYSTEM AND METHOD FOR 3D PRINTING
20220314328 · 2022-10-06 ·

An apparatus and method for fabricating a three-dimensional object from a representation of the object stored in memory. The apparatus includes a build platform having a build gap defined therein. A base plate is initially supported along a lower surface of the build platform such that an edge of the base plate extends along and closes off the build gap. A powder delivery assembly is configured to supply powder to the build gap. At least one directed energy source is configured to apply directed energy to at least a portion of the build gap to form a layer of the three-dimensional structure. An advancement assembly configured to selectively engage with the base plate and/or the three-dimensional structure to hold the base plate and the three-dimensional structure in a fixed position during forming of a layer and to advance the base plate and the three-dimensional structure once the layer is formed.

Film-shaped fired material, and film-shaped fired material with support sheet
11285536 · 2022-03-29 · ·

A film-shaped fired material of the present invention is a film-shaped fired material 1 which contains sinterable metal particles 10 and a binder component 20, in which a time (A1) after the start of a temperature increase, at which a negative gradient is the highest, in a thermogravimetric curve (TG curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere and a maximum peak time (B1) in a time range of 0 seconds to 2160 seconds after the start of a temperature increase in a differential thermal analysis curve (DTA curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere using alumina particles as a reference sample satisfy a relationship of “A1<B1<A1+200 seconds” and a relationship of “A1<2000 seconds”.

Porous metal foil and capacitor anodes made therefrom and methods of making same
11289276 · 2022-03-29 · ·

A porous metal foil and porous metal wire are described. Capacitor anodes made from either or both of the porous metal foil and porous metal wire are further described as well as methods to make same.

Xerographic 3D printing method for forming shaped objects

A shaped ceramic or metallic object is formed by sectioning a model of a shaped body into 2-dimensional slices. For each slice, a toner material is electrostatically printed on a polymer sheet. The toner material includes solid particles. The printed sheets are assembled into a stack and the stack is depolymerized and sintered to form the ceramic object.

Method for manufacturing thin-walled metal component by three- dimensional printing and hot gas bulging

The present invention discloses a method for manufacturing a thin-walled metal component by three-dimensional (3D) printing and hot gas bulging. The present invention uses 3D printing to obtain a complex thin-walled preform, which reduces a deformation during subsequent hot gas bulging. The present invention avoids local bulging thinning and cracking, undercuts at the parting during die closing, and wrinkles due to the uneven distribution of cross-sectional materials, etc. The present invention obtains a high accuracy in the form and dimension through hot gas bulging. After a desired shape is obtained by hot gas bulging, a die is closed to keep the component under high temperature and high pressure for a period of time, so that a grain and a phase of the material are transformed to form a desired microstructure.