In various embodiments, wire composed at least partially of arc-melted refractory metal material is utilized to fabricate three-dimensional parts by additive manufacturing.

In various embodiments, wire composed at least partially of arc-melted refractory metal material is utilized to fabricate three-dimensional parts by additive manufacturing.

A tungsten wire according to an embodiment is a tungsten wire made of a W alloy containing rhenium, and includes a mixture on at least a part of a surface thereof, the mixture contains W, C, and O as constituent elements, and taking a radial cross-sectional thickness of the mixture as A mm and a diameter of the tungsten wire as B mm, an average value of a ratio A/B of A to B is 0.3% to 0.8%.

A tungsten wire according to an embodiment is a tungsten wire made of a W alloy containing rhenium, and includes a mixture on at least a part of a surface thereof, the mixture contains W, C, and O as constituent elements, and taking a radial cross-sectional thickness of the mixture as A mm and a diameter of the tungsten wire as B mm, an average value of a ratio A/B of A to B is 0.3% to 0.8%.

In various embodiments, three-dimensional layered metallic parts are substantially free of gaps between successive layers, are substantially free of cracks, and have densities no less than 97% of the theoretical density of the metallic material.

In various embodiments, three-dimensional layered metallic parts are substantially free of gaps between successive layers, are substantially free of cracks, and have densities no less than 97% of the theoretical density of the metallic material.

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E−9 Ω*m to about 742.5×E−9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

A scandium-containing aluminium powder alloy, wires and materials including said alloy, and a method for producing the scandium-containing aluminium powder alloy, the wires and materials, the proportion of scandium in the scandium-containing aluminium powder alloy being elevated, are disclosed. At least one element is selected from the group consisting of the lanthanum group except for Ce, Y, Ga, Nb, Ta, W, V, Ni, Co, Mo, Li, Th, Ag.

A scandium-containing aluminium powder alloy, wires and materials including said alloy, and a method for producing the scandium-containing aluminium powder alloy, the wires and materials, the proportion of scandium in the scandium-containing aluminium powder alloy being elevated, are disclosed. At least one element is selected from the group consisting of the lanthanum group except for Ce, Y, Ga, Nb, Ta, W, V, Ni, Co, Mo, Li, Th, Ag.

A scandium-containing aluminium powder alloy, wires and materials including said alloy, and a method for producing the scandium-containing aluminium powder alloy, the wires and materials, the proportion of scandium in the scandium-containing aluminium powder alloy being elevated, are disclosed. At least one element is selected from the group consisting of the lanthanum group except for Ce, Y, Ga, Nb, Ta, W, V, Ni, Co, Mo, Li, Th, Ag.