B22F5/12

Valve Trim

A fluid flow control device include a valve body including an inlet, an outlet, and a passageway extending between the inlet and the outlet. A valve trim is at least partially disposed in the passageway of the valve body. The valve trim includes a restrictor having a wall and a plurality of passages extending through the wall. A diffuser is coupled to the restrictor and including a porous body. The porous body is adjacent to the plurality of passages of the restrictor.

ALUMINUM BORON NITRIDE NANOTUBE COMPOSITES AND METHODS OF MANUFACTURING THE SAME

Methods for fabricating high-strength aluminum-boron nitride nanotube (Al—BNNT) wires or wire feedstock from Al—BNNT composite raw materials by mechanical deformation using wire drawing and extrusion are provided, as well as large-scale, high-strength Al—BNNT composite components (e.g., with a length on the order of meters (m) and/or a mass on the order of hundreds of kilograms (kg)). The large-scale, high-strength Al—BNNT composite components can be made via wire-based additive manufacturing.

ALUMINUM BORON NITRIDE NANOTUBE COMPOSITES AND METHODS OF MANUFACTURING THE SAME

Methods for fabricating high-strength aluminum-boron nitride nanotube (Al—BNNT) wires or wire feedstock from Al—BNNT composite raw materials by mechanical deformation using wire drawing and extrusion are provided, as well as large-scale, high-strength Al—BNNT composite components (e.g., with a length on the order of meters (m) and/or a mass on the order of hundreds of kilograms (kg)). The large-scale, high-strength Al—BNNT composite components can be made via wire-based additive manufacturing.

METHOD FOR PRODUCING HIGH-ENTROPY ALLOY SUPERCONDUCTOR BULK MATERIALS AND WIRE MATERIALS, BULK HIGH-ENTROPY ALLOY SUPERCONDUCTOR PRODUCED USING THE METHOD, AND METHOD FOR PRODUCING THIN-FILM HIGH-ENTROPY ALLOY SUPERCONDUCTOR USING THE SAME

Disclosed is a method for producing a high-entropy alloy superconductor bulk materials and wire materials, the method including a first step of mixing 4 to 10 types of metals selected from a group consisting of niobium (Nb), tantalum (Ta), titanium (Ti), hafnium (Hf), zirconium (Zr), tungsten (W), molybdenum (Mo), chromium (Cr), vanadium (V), and rhenium (Re) with each other to prepare a mixture and then milling the mixture to prepare mixed metal powders; and a second step of sintering the mixed metal powders prepared in the first step.

METHOD FOR PRODUCING HIGH-ENTROPY ALLOY SUPERCONDUCTOR BULK MATERIALS AND WIRE MATERIALS, BULK HIGH-ENTROPY ALLOY SUPERCONDUCTOR PRODUCED USING THE METHOD, AND METHOD FOR PRODUCING THIN-FILM HIGH-ENTROPY ALLOY SUPERCONDUCTOR USING THE SAME

Disclosed is a method for producing a high-entropy alloy superconductor bulk materials and wire materials, the method including a first step of mixing 4 to 10 types of metals selected from a group consisting of niobium (Nb), tantalum (Ta), titanium (Ti), hafnium (Hf), zirconium (Zr), tungsten (W), molybdenum (Mo), chromium (Cr), vanadium (V), and rhenium (Re) with each other to prepare a mixture and then milling the mixture to prepare mixed metal powders; and a second step of sintering the mixed metal powders prepared in the first step.

Heat-resistant Ir alloy wire

Provided is an Ir alloy wire, which is further improved in oxidation wear resistance while ensuring a Vickers hardness. The Ir alloy wire includes: 5 mass % to 30 mass % of Rh; and 0.5 mass % to 5 mass % of Ta, wherein an average value A for an aspect ratio (crystal grain length/crystal grain width) of a structure of the alloy wire in a range of a depth of 0.05 mm or less from a surface of the alloy wire satisfies 1≤A<6.

Heat-resistant Ir alloy wire

Provided is an Ir alloy wire, which is further improved in oxidation wear resistance while ensuring a Vickers hardness. The Ir alloy wire includes: 5 mass % to 30 mass % of Rh; and 0.5 mass % to 5 mass % of Ta, wherein an average value A for an aspect ratio (crystal grain length/crystal grain width) of a structure of the alloy wire in a range of a depth of 0.05 mm or less from a surface of the alloy wire satisfies 1≤A<6.

IMPROVED METHODS AND COMPOSITIONS FOR FABRICATION OF SUPERCONDUCTING WIRE
20170287583 · 2017-10-05 ·

The present disclosure relates generally to wires and more particularly to textured powder wires containing nanoscale metallic silver powder. The invention presents an improvement of the process of making compressed cores of textured-powder high-temperature superconductor previously using the micaceous high-temperature superconductor Bi-2212. Embodiments of the claimed methods are useful with the micaceous high-temperature superconductors, notably Bi2Sr2CaCu208+x (Bi-2212) and Bi2S-r2Ca2Cu3O10+x (Bi-2223) and rare earth barium copper oxide (REBCO).

IMPROVED METHODS AND COMPOSITIONS FOR FABRICATION OF SUPERCONDUCTING WIRE
20170287583 · 2017-10-05 ·

The present disclosure relates generally to wires and more particularly to textured powder wires containing nanoscale metallic silver powder. The invention presents an improvement of the process of making compressed cores of textured-powder high-temperature superconductor previously using the micaceous high-temperature superconductor Bi-2212. Embodiments of the claimed methods are useful with the micaceous high-temperature superconductors, notably Bi2Sr2CaCu208+x (Bi-2212) and Bi2S-r2Ca2Cu3O10+x (Bi-2223) and rare earth barium copper oxide (REBCO).

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.