A carbide insert for a soil tillage implement for agriculture, which is formed using or from at least one hard material and at least one binding metal. Iron is provided as a binding metal.

A method for manufacturing a material layer includes a first step S101 of arranging first particles P1 in a pattern on a base material 11 and a second step S102 of arranging second particles in regions in which the first particles P1 are not arranged on the base material 11. The second step S102 includes a step of rubbing bearing materials S2 that carry the second particles P2 against the base material 11 on which the first particles P1 are arranged.

A method for manufacturing a material layer includes a first step S101 of arranging first particles P1 in a pattern on a base material 11 and a second step S102 of arranging second particles in regions in which the first particles P1 are not arranged on the base material 11. The second step S102 includes a step of rubbing bearing materials S2 that carry the second particles P2 against the base material 11 on which the first particles P1 are arranged.

A composite material includes: coated particles, each of which includes a carbon-based particle made of a carbon-based substance and a carbide layer that covers at least a part of the surface of the carbon-based particle; and a copper phase that binds the coated particles to each other, wherein the carbide layer is made of a carbide containing at least one element selected from the group consisting of Si, Ti, Zr and Hf, and the average particle size of the carbon-based particles is 1 m or more and 100 m or less.

Described herein is a powder blend comprising a first component comprising a blend of a first metal particle and a first ceramic particle; and a second component comprising a reinforcing chip, the reinforcing chip comprising a second ceramic particle dispersed within a chip metal matrix.

Provided are a metal chalcogenide thin film and a method and device for manufacturing the same. The metal chalcogenide thin film includes a transition metal element and a chalcogen element, and at least one of the transition metal element and the chalcogen element having a composition gradient along the surface of the metal chalcogenide thin film, the composition gradient being an in-plane composition gradient. The metal chalcogenide thin film may be prepared by using a manufacturing method including providing a transition metal precursor and a chalcogen precursor on a substrate by using a confined reaction space in such a manner that at least one of the transition metal precursor and the chalcogen precursor forms a concentration gradient according to a position on the surface of the substrate; and heat-treating the substrate.

Carbon fiber reinforced steel matrix composites have carbon fiber impregnated in the steel matrix and chemically bonded to the steel. Chemical bonding is shown by the presence of a unique amorphous carbon layer at the carbon fiber/steel interface, and by canting of steel crystal edges adjacent to the interface. Methods for forming carbon fiber reinforce steel composites include sintering steel nanoparticles around a reinforcing carbon fiber structure, thereby chemically bonding a sintered steel matrix to the carbon fiber. This unique bonding likely contributes to enhanced strength of the composite, in comparison to metal matrix composites formed by other methods.

There is provided an inexpensive bonding material, which can be easily printed on articles to be bonded to each other and which can suppress the generation of voids in the bonded portions of the articles to be bonded to each other, and a bonding method using the same. In a bonding material of a copper paste which contains a copper powder containing 0.3% by weight or less of carbon and having an average particle diameter of 0.1 to 1 m, and an alcohol solvent, such as a monoalcohol, a diol, a triol or a terpene alcohol, the content of the copper powder is in the range of from 80% by weight to 95% by weight, and the content of the alcohol solvent is in the range of from 5% by weight to 20% by weight.

A manufacturing method of an integrated circuit (IC) packaging structure includes the following steps. One or a plurality of dies is disposed on a packaging substrate. An encapsulation material is formed on the packaging substrate. The encapsulation material is configured to encapsulate the one or the plurality of the dies on the packaging substrate. At least one trench is formed in the encapsulation material. A heat dissipation structure is formed on the encapsulation material, and at least a part of the heat dissipation structure is formed in the at least one trench. The step of forming the heat dissipation structure includes the following steps. A first slurry is formed in the at least one trench, and a first curing process is performed to the first slurry for forming a first portion of the heat dissipation structure.

Disclosed are a method of manufacturing an aluminum-based clad heat sink, and an aluminum-based clad heat sink manufactured by the method. The method includes ball-milling (i) aluminum or aluminum alloy powder and (ii) carbon nanotubes (CNT) to prepare a composite powder, preparing a multi-layered billet using the composite billet, and directly extruding the multi-layered billet using an extrusion die to produce a heat sink. The method has an advantage of producing a light high-strength high-conductivity aluminum-based clad heat sink having an competitive advantage in terms of price by using direct extrusion that is suitable for mass production due to its simplicity in process procedure and equipment required.