Patent classifications
B22F7/02
Composite particles and method for producing composite particles
Composite particles sinterable at a low temperature and allow forming a sintered body that exhibits a large extension are provided. The composite particles include microparticles having an average crystallite diameter of 0.6 to 10 μm and containing a metal, and nanoparticles adhered to a surface of the microparticle, having an average crystallite diameter of 3 to 100 nm, and containing a metal of a same kind as the metal contained in the microparticle.
Composite particles and method for producing composite particles
Composite particles sinterable at a low temperature and allow forming a sintered body that exhibits a large extension are provided. The composite particles include microparticles having an average crystallite diameter of 0.6 to 10 μm and containing a metal, and nanoparticles adhered to a surface of the microparticle, having an average crystallite diameter of 3 to 100 nm, and containing a metal of a same kind as the metal contained in the microparticle.
Processes, systems, and apparatus for cyclotron production of technetium-99m
A system for producing technetium-99m from molybdate-100. The system comprises: a target capsule apparatus for housing a Mo-100-coated target plate; a target capsule pickup apparatus for engaging, and delivering the target cell apparatus into a target station apparatus; target station apparatus for receiving and mounting therein the target capsule apparatus. The target station apparatus is engaged with a cyclotron for irradiating the Mo-100-coated target plate with protons. The irradiated target capsule apparatus is transferred to a receiving cell apparatus comprising a dissolution/purification module for receiving therein a proton-irradiated Mo-100-coated target plate. A conveyance conduit infrastructure interconnects: (i) the target capsule pickup apparatus with the target station apparatus, (ii) the target station apparatus and the receiving cell apparatus; and (iii) the receiving cell apparatus and the dissolution/purification module.
Reducing stresses in metal layers
A system including: a polymer substrate with a thermal conductivity of less than 0.5 W/(m-k); a spreader to form a layer of metal particulate on the polymer substrate; a mask applicator to apply a mask to a portion of the layer of metal particulate; and a pulsed irradiation light source to fuse a portion of the layer of metal particulate not covered by the mask.
Reducing stresses in metal layers
A system including: a polymer substrate with a thermal conductivity of less than 0.5 W/(m-k); a spreader to form a layer of metal particulate on the polymer substrate; a mask applicator to apply a mask to a portion of the layer of metal particulate; and a pulsed irradiation light source to fuse a portion of the layer of metal particulate not covered by the mask.
SOFT MAGNETIC ALLOY POWDER, SOFT MAGNETIC SINTERED BODY, AND COIL-TYPE ELECTRONIC COMPONENT
A soft magnetic metal powder or the like from which a soft magnetic metal fired body can be provided has a high magnetic permeability μ and a specific resistance ρ and is contained in a coil-type electronic component having sufficiently high inductance L and Q value and unlikely to be plating-extended and short-circuited. A soft magnetic metal powder contains soft magnetic metal particles containing at least Fe and Ni. Said soft magnetic metal powder further contains P, Si, Cr and/or M. M is at least one selected from among B, Co, Mn, Ti, Zr, Hf, Nb, Ta, Mo, Mg, Ca, Sr, Ba, Zn, Al, and rare earth elements. The content of each element is within a predetermined range.
GRAIN BOUNDARY DIFFUSION METHOD FOR BULK RARE EARTH PERMANENT MAGNETIC MATERIAL
A grain boundary diffusion method for a bulk rare earth permanent magnetic material includes the following steps: (1) fabricating an initial magnet by a sintering, hot pressing, or hot deformation process; (2) loading a grain boundary diffusion alloy source on a surface of the magnet through electrodeposition, chemical vapor deposition (CVD), physical vapor deposition (PVD), direct physical contact, or adhesive bonding; and (3) placing the initial magnet loaded with the grain boundary diffusion alloy source in a SPS device, and heating to obtain a final magnet. The current, plasma, and pressure in an SPS process can be controlled to significantly improve elemental diffusion coefficient and enhance the diffusion depth. The bulk rare earth permanent magnetic material undergoing grain boundary diffusion fabricated in the present disclosure has a significant increase in magnetic properties that catering to commercial demands for industrial production.
GRAIN BOUNDARY DIFFUSION METHOD FOR BULK RARE EARTH PERMANENT MAGNETIC MATERIAL
A grain boundary diffusion method for a bulk rare earth permanent magnetic material includes the following steps: (1) fabricating an initial magnet by a sintering, hot pressing, or hot deformation process; (2) loading a grain boundary diffusion alloy source on a surface of the magnet through electrodeposition, chemical vapor deposition (CVD), physical vapor deposition (PVD), direct physical contact, or adhesive bonding; and (3) placing the initial magnet loaded with the grain boundary diffusion alloy source in a SPS device, and heating to obtain a final magnet. The current, plasma, and pressure in an SPS process can be controlled to significantly improve elemental diffusion coefficient and enhance the diffusion depth. The bulk rare earth permanent magnetic material undergoing grain boundary diffusion fabricated in the present disclosure has a significant increase in magnetic properties that catering to commercial demands for industrial production.
Molded solder and molded solder production method
Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.
Molded solder and molded solder production method
Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.