Patent classifications
B22F9/002
PROCESS FOR PRODUCING NICKEL POWDER
A process for producing nickel powder capable of obtaining inexpensive, and also, high-performance nickel powder, even when using wet process. A process for producing nickel powder, including a crystallization step for obtaining nickel crystal powder by reductive reaction in reaction solution in which at least water-soluble nickel salt, metal salt of metal more noble than nickel, reducing agent, alkali hydroxide, amine compound, and water are mixed, wherein the reducing agent to be mixed in the crystallization step is hydrazine, the amine compound is autolysis inhibitor of hydrazine, and contains two or more primary amino groups in molecule, or contains one primary amino group and one or more secondary amino groups in molecule, and ratio of molar number of the amine compound with respect to molar number of nickel in the reaction solution is in a range of 0.01 mol % to 5 mol %.
PROCESS FOR PRODUCING NICKEL POWDER
A process for producing nickel powder capable of obtaining inexpensive, and also, high-performance nickel powder, even when using wet process. A process for producing nickel powder, including a crystallization step for obtaining nickel crystal powder by reductive reaction in reaction solution in which at least water-soluble nickel salt, metal salt of metal more noble than nickel, reducing agent, alkali hydroxide, amine compound, and water are mixed, wherein the reducing agent to be mixed in the crystallization step is hydrazine, the amine compound is autolysis inhibitor of hydrazine, and contains two or more primary amino groups in molecule, or contains one primary amino group and one or more secondary amino groups in molecule, and ratio of molar number of the amine compound with respect to molar number of nickel in the reaction solution is in a range of 0.01 mol % to 5 mol %.
COIL COMPONENT
A coil component includes a magnetic portion that includes metal particles and a resin material, a coil conductor embedded in the magnetic portion and having a core portion, and outer electrodes electrically connected to the coil conductor. The magnetic portion includes a magnetic outer coating and a magnetic base having a protrusion portion. The coil conductor is disposed on the magnetic base such that the protrusion portion is located in the core portion. The magnetic outer coating is disposed so as to cover the coil conductor, and the bottom surface of the magnetic base includes a recessed portion in an area opposite to the protrusion portion.
COIL COMPONENT
A coil component includes a magnetic portion that includes metal particles and a resin material, a coil conductor embedded in the magnetic portion and having a core portion, and outer electrodes electrically connected to the coil conductor. The magnetic portion includes a magnetic outer coating and a magnetic base having a protrusion portion. The coil conductor is disposed on the magnetic base such that the protrusion portion is located in the core portion. The magnetic outer coating is disposed so as to cover the coil conductor, and the bottom surface of the magnetic base includes a recessed portion in an area opposite to the protrusion portion.
Soft Magnetic Powder, Powder Magnetic Core, Magnetic Element, And Electronic Device
A soft magnetic powder has a composition represented by Fe.sub.100-a-b-c-d-e-fCu.sub.aSi.sub.bB.sub.cM.sub.dM.sub.eX.sub.f (at %) (wherein M is at least one element selected from the group consisting of Nb and the like, M is at least one element selected from the group consisting of V and the like, X is at least one element selected from the group consisting of C and the like, and 0.1a3, 0<b30, 0<c25, 5b+c30, 0.1d30, 0e10, and 0f10). The powder contains a crystalline structure having a particle diameter of 1 nm or more and 30 nm or less in an amount of 40 vol % or more. When the apparent density is assumed to be 100, the tap density is 103 or more and 130 or less.
Soft Magnetic Powder, Powder Magnetic Core, Magnetic Element, And Electronic Device
A soft magnetic powder has a composition represented by Fe.sub.100-a-b-c-d-e-fCu.sub.aSi.sub.bB.sub.cM.sub.dM.sub.eX.sub.f (at %) (wherein M is at least one element selected from the group consisting of Nb and the like, M is at least one element selected from the group consisting of V and the like, X is at least one element selected from the group consisting of C and the like, and 0.1a3, 0<b30, 0<c25, 5b+c30, 0.1d30, 0e10, and 0f10). The powder contains a crystalline structure having a particle diameter of 1 nm or more and 30 nm or less in an amount of 40 vol % or more. When the apparent density is assumed to be 100, the tap density is 103 or more and 130 or less.
Biocompatible Ti-based metallic glass for additive manufacturing
A biocompatible Ti-based alloy having a formula of Ti.sub.aZr.sub.wTa.sub.bSi.sub.xSn.sub.yCo.sub.z is disclosed, wherein a is 40-44, b is 1-5 and the sum of w, x, y, z is 55. The alloy is amorphous. The alloy is applicable to manufacturing ultrafine powder which is used for additive manufacturing. The alloy is characterized in high glass forming ability, low toxicity, and high strength, and the powder thereof has low roughness and high circularity, and is suitable for implantable medical device.
Biocompatible Ti-based metallic glass for additive manufacturing
A biocompatible Ti-based alloy having a formula of Ti.sub.aZr.sub.wTa.sub.bSi.sub.xSn.sub.yCo.sub.z is disclosed, wherein a is 40-44, b is 1-5 and the sum of w, x, y, z is 55. The alloy is amorphous. The alloy is applicable to manufacturing ultrafine powder which is used for additive manufacturing. The alloy is characterized in high glass forming ability, low toxicity, and high strength, and the powder thereof has low roughness and high circularity, and is suitable for implantable medical device.
Nanocomposite metal material and method for manufacturing nanocomposite metal material
A nanocomposite metal material includes a carrier formed of Zr and two-element metal particles supported on the carrier. The two-element metal is formed of Cu and Ni, and a degree of oxidation of the carrier is more than 31% and 100% or less. In a case where the nanocomposite metal material is disposed in a reaction furnace of a thermal reactor, the inside of the reaction furnace is brought into a vacuum state, and the inside of the reaction furnace is heated to a temperature range of 250? C. or higher and 350? C. or lower with a heating mechanism included in the thermal reactor while supplying at least one of hydrogen gas and deuterium gas into the reaction furnace, excessive heat of the nanocomposite metal material is 100 W/kg or more.
Methods for Fabricating Strain Wave Gear Flexsplines Using Metal Additive Manufacturing
Methods for the fabrication of metal strain wave gear flexsplines using a specialized metal additive manufacturing technique are provided. The method allows the entire flexspline to be metal printed, including all the components: the output surface with mating features, the thin wall of the cup, and the teeth integral to the flexspline. The flexspline may be used directly upon removal from the building tray.