Patent classifications
B22F9/16
Apparatus and method for the production of quantum particles
Systems, methods, and devices are disclosed for producing quantum particles (e.g., quantum dots) having a uniform size by vaporization of molten precursor droplets. More particularly, the present technology produces quantum dots by melting or liquefying solid and substantially pure precursor materials followed by production of uniformly sized droplets of molten precursor by use of a droplet maker into a microwave generated plasma torch.
Method for fabrication of copper-silver and copper-gold porous microsheets
A method for preparing copper-solver and copper-gold porous microsheets with specific pore sizes, the method including the steps of providing a solution of copper microsheets and adding a silver or gold solution under controlled temperature, the reaction conditions can be changed to determine pore sizes.
Method for fabrication of copper-silver and copper-gold porous microsheets
A method for preparing copper-solver and copper-gold porous microsheets with specific pore sizes, the method including the steps of providing a solution of copper microsheets and adding a silver or gold solution under controlled temperature, the reaction conditions can be changed to determine pore sizes.
POWDERS BASED ON NIOBIUM-TIN COMPOUNDS FOR MANUFACTURING SUPERCONDUCTING COMPONENTS
A powder for producing a superconducting component. The powder includes Nb.sub.xSn.sub.y, where 1≤x≤6 and 1≤y≤5. The powder does not have any separate NbO phases and/or SnO phases.
POWDERS BASED ON NIOBIUM-TIN COMPOUNDS FOR MANUFACTURING SUPERCONDUCTING COMPONENTS
A powder for producing a superconducting component. The powder includes Nb.sub.xSn.sub.y, where 1≤x≤6 and 1≤y≤5. The powder does not have any separate NbO phases and/or SnO phases.
NANO DISPERSION COPPER ALLOY WITH HIGH AIR-TIGHTNESS AND LOW FREE OXYGEN CONTENT AND BRIEF MANUFACTURING PROCESS THEREOF
Disclosed is a nano dispersion copper alloy with high air-tightness and low free oxygen content and a brief manufacturing process thereof, wherein alloy comprises the following components: Al.sub.2O.sub.3, Ca and La. The manufacturing process comprises the following steps of: preparing Cu—Al.sub.2O.sub.3 alloy powder by an internal oxidation method; mixing the Cu—Al.sub.2O.sub.3 alloy powder with Cu—Ca—La alloy powder; sheathing the mixed powder under protection of argon; performing hot extrusion and then rotary forging; vacuumizing the sheath after the rotary forging; and sealing and placing the sheath in a nitrogen atmosphere with a temperature of 450° C. to 550° C. and a pressure intensity of 40 Mpa to 60 Mpa for 3 hours to 5 hours. The dispersion copper prepared by the present disclosure has the advantages of low free oxygen content (≤15 ppm), high dimensional stability, good air-tightness and an air leakage rate≤1.0×10.sup.−10 Pa m.sup.3/s after hydrogen annealing.
NANO DISPERSION COPPER ALLOY WITH HIGH AIR-TIGHTNESS AND LOW FREE OXYGEN CONTENT AND BRIEF MANUFACTURING PROCESS THEREOF
Disclosed is a nano dispersion copper alloy with high air-tightness and low free oxygen content and a brief manufacturing process thereof, wherein alloy comprises the following components: Al.sub.2O.sub.3, Ca and La. The manufacturing process comprises the following steps of: preparing Cu—Al.sub.2O.sub.3 alloy powder by an internal oxidation method; mixing the Cu—Al.sub.2O.sub.3 alloy powder with Cu—Ca—La alloy powder; sheathing the mixed powder under protection of argon; performing hot extrusion and then rotary forging; vacuumizing the sheath after the rotary forging; and sealing and placing the sheath in a nitrogen atmosphere with a temperature of 450° C. to 550° C. and a pressure intensity of 40 Mpa to 60 Mpa for 3 hours to 5 hours. The dispersion copper prepared by the present disclosure has the advantages of low free oxygen content (≤15 ppm), high dimensional stability, good air-tightness and an air leakage rate≤1.0×10.sup.−10 Pa m.sup.3/s after hydrogen annealing.
BULK GRAIN BOUNDARY MATERIALS
The present invention provides a process for making nanoparticle based bulk materials. Also provided is a single component metal nanoparticle based bulk glass material comprising less than about 1% by weight of ligand capped nanocrystals; and wherein the metal is palladium.
BULK GRAIN BOUNDARY MATERIALS
The present invention provides a process for making nanoparticle based bulk materials. Also provided is a single component metal nanoparticle based bulk glass material comprising less than about 1% by weight of ligand capped nanocrystals; and wherein the metal is palladium.
BULK GRAIN BOUNDARY MATERIALS
The present invention provides a process for making nanoparticle based bulk materials. Also provided is a single component metal nanoparticle based bulk glass material comprising less than about 1% by weight of ligand capped nanocrystals; and wherein the metal is palladium.