A manufacturing method of an embedded metal mesh flexible transparent electrode and application thereof; the method includes: directly printing a metal mesh transparent electrode on a rigid substrate by using an electric-field-driven jet deposition micro-nano 3D printing technology; performing conductive treatment on a printed metal mesh structure through a sintering process to realize conductivity of the metal mesh; respectively heating a flexible transparent substrate and the rigid substrate to set temperatures; completely embedding the metal mesh structure on the rigid substrate into the flexible transparent substrate through a thermal imprinting process; and separating the metal mesh completely embedded into the flexible transparent substrate from the rigid substrate to obtain the embedded metal mesh flexible transparent electrode. The mass production of the large-size embedded metal mesh flexible transparent electrode with low cost and high throughput by combining the electric-field-driven jet deposition micro-nano 3D printing technology with the roll-to-plane thermal imprinting technology.

A manufacturing method of an embedded metal mesh flexible transparent electrode and application thereof; the method includes: directly printing a metal mesh transparent electrode on a rigid substrate by using an electric-field-driven jet deposition micro-nano 3D printing technology; performing conductive treatment on a printed metal mesh structure through a sintering process to realize conductivity of the metal mesh; respectively heating a flexible transparent substrate and the rigid substrate to set temperatures; completely embedding the metal mesh structure on the rigid substrate into the flexible transparent substrate through a thermal imprinting process; and separating the metal mesh completely embedded into the flexible transparent substrate from the rigid substrate to obtain the embedded metal mesh flexible transparent electrode. The mass production of the large-size embedded metal mesh flexible transparent electrode with low cost and high throughput by combining the electric-field-driven jet deposition micro-nano 3D printing technology with the roll-to-plane thermal imprinting technology.

A manipulator device such as a robot arm that is capable of increasing manufacturing throughput for additively manufactured parts, and allows for the manipulation of parts that would be difficult or impossible for a human to move is described. The manipulator can grasp various permanent or temporary additively manufactured manipulation points on a part to enable repositioning or maneuvering of the part.

A system for building a three dimensional green compact comprising a printing station configured to print a mask pattern on a building surface, wherein the mask pattern is formed of solidifiable material; a powder delivery station configured to apply a layer of powder material on the mask pattern; a die compaction station for compacting the layer formed by the powder material and the mask pattern; and a stage configured to repeatedly advance a building tray to each of the printing station, the powder delivery station and the die compaction station to build a plurality of layers that together form the three dimensional green compact.

A system for building a three dimensional green compact comprising a printing station configured to print a mask pattern on a building surface, wherein the mask pattern is formed of solidifiable material; a powder delivery station configured to apply a layer of powder material on the mask pattern; a die compaction station for compacting the layer formed by the powder material and the mask pattern; and a stage configured to repeatedly advance a building tray to each of the printing station, the powder delivery station and the die compaction station to build a plurality of layers that together form the three dimensional green compact.

Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.

Techniques regarding forming flip chip interconnects are provided. For example, one or more embodiments described herein can comprise a three-dimensionally printed flip chip interconnect that includes an electrically conductive ink material that is compatible with a three-dimensional printing technology. The three-dimensionally printed flip chip interconnect can be located on a metal surface of a semiconductor chip.

Techniques regarding forming flip chip interconnects are provided. For example, one or more embodiments described herein can comprise a three-dimensionally printed flip chip interconnect that includes an electrically conductive ink material that is compatible with a three-dimensional printing technology. The three-dimensionally printed flip chip interconnect can be located on a metal surface of a semiconductor chip.

This invention concerns a module for insertion into an additive manufacturing apparatus. The module comprising a frame mountable in a fixed position in the additive manufacturing apparatus, the frame defining a build chamber and a dosing chamber. A build platform is movable in the build chamber for supporting a powder bed during additive manufacturing of a part. A dosing piston is movable in the dosing chamber to push powder from the dosing chamber. A mechanism mechanically links the build platform to the dosing piston such that downward movement of the build platform in the build chamber results in upward movement of the dosing piston in the dosing chamber.

Devices, systems, and methods for monitoring a powder layer in additive manufacturing are disclosed. A method of monitoring a powder layer includes receiving image data corresponding the powder layer supported by a powder bed within a build chamber from imaging devices, determining leading and trailing regions of interest located adjacent to a leading end and a trailing end of the moving powder distributor, respectively, the leading and trailing regions of interest moving according to movement of the moving powder distributor, selecting at least one point located in the leading region of interest from the image data, determining first characteristics of the point, when the point is located within the trailing region of interest, determining second characteristics of the point, and comparing the first characteristics to the second characteristics.