A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100° C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.

A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100° C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.

Embodiments are directed to the field of ceramics and relate to electron-emitting ceramics such as those which can be used as cathode material for electron emissions in space flight systems, for example. Embodiments specify an electron-emitting ceramic which has an improved temperature conductivity with a simultaneously continuous electron emission. The electron-emitting ceramic contains at least>70 vol. % C12A7 electride and a proportion of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, In, Sn, Sb, Te, Tl, Pb, or Bi as metal and/or with Ti, wherein the proportion of the metals lies between>0 and<30 vol. %, and the ceramic has a density of at least 85% of the theoretical density of the ceramic and the ceramic contains 0 to maximally 10 vol. % production-specific impurities.

Embodiments are directed to the field of ceramics and relate to electron-emitting ceramics such as those which can be used as cathode material for electron emissions in space flight systems, for example. Embodiments specify an electron-emitting ceramic which has an improved temperature conductivity with a simultaneously continuous electron emission. The electron-emitting ceramic contains at least>70 vol. % C12A7 electride and a proportion of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, In, Sn, Sb, Te, Tl, Pb, or Bi as metal and/or with Ti, wherein the proportion of the metals lies between>0 and<30 vol. %, and the ceramic has a density of at least 85% of the theoretical density of the ceramic and the ceramic contains 0 to maximally 10 vol. % production-specific impurities.

A sintered Nd—Fe—B magnet comprising at least one light rare earth element having a weight content between 31 wt. % and 35 wt. %, at least one heavy rare earth element having a weight content of no more than 0.2 wt. %, B having a weight content between 0.95 wt. % and 1.2 wt. %, at least one additive including Ti and having a weight content between 1.31 wt. % and 7.2 wt. %, Fe as a balance, and impurities including C, O, and N. Ti has a weight content between 0.3 wt. % and 1 wt. % and forms a Titanium-Iron-Boron phase with Fe and Boron B and being present in the sintered Nd—Fe—B magnet between 0.86 vol. % and 2.85 vol. %. The C, O, and N satisfy 630 ppm≦1.2C+0.6O+N≦3680 ppm. The sintered Nd—Fe—B magnet has a squareness factor of at least 0.95.

A sintered Nd—Fe—B magnet comprising at least one light rare earth element having a weight content between 31 wt. % and 35 wt. %, at least one heavy rare earth element having a weight content of no more than 0.2 wt. %, B having a weight content between 0.95 wt. % and 1.2 wt. %, at least one additive including Ti and having a weight content between 1.31 wt. % and 7.2 wt. %, Fe as a balance, and impurities including C, O, and N. Ti has a weight content between 0.3 wt. % and 1 wt. % and forms a Titanium-Iron-Boron phase with Fe and Boron B and being present in the sintered Nd—Fe—B magnet between 0.86 vol. % and 2.85 vol. %. The C, O, and N satisfy 630 ppm≦1.2C+0.6O+N≦3680 ppm. The sintered Nd—Fe—B magnet has a squareness factor of at least 0.95.

A method includes additively manufacturing an article in an inert environment, removing the article from the inert environment and placing the article in a non-inert environment, allowing at least a portion the article to oxidize in the non-inert environment to form an oxidized layer on a surface of the article, and removing the oxidized layer (e.g., to smooth the surface of the article). The method can further include relieving stress in the article (e.g., via heating the article after additive manufacturing).

A method includes additively manufacturing an article in an inert environment, removing the article from the inert environment and placing the article in a non-inert environment, allowing at least a portion the article to oxidize in the non-inert environment to form an oxidized layer on a surface of the article, and removing the oxidized layer (e.g., to smooth the surface of the article). The method can further include relieving stress in the article (e.g., via heating the article after additive manufacturing).

Disclosed is a nano dispersion copper alloy with high air-tightness and low free oxygen content and a brief manufacturing process thereof, wherein alloy comprises the following components: Al.sub.2O.sub.3, Ca and La. The manufacturing process comprises the following steps of: preparing Cu—Al.sub.2O.sub.3 alloy powder by an internal oxidation method; mixing the Cu—Al.sub.2O.sub.3 alloy powder with Cu—Ca—La alloy powder; sheathing the mixed powder under protection of argon; performing hot extrusion and then rotary forging; vacuumizing the sheath after the rotary forging; and sealing and placing the sheath in a nitrogen atmosphere with a temperature of 450° C. to 550° C. and a pressure intensity of 40 Mpa to 60 Mpa for 3 hours to 5 hours. The dispersion copper prepared by the present disclosure has the advantages of low free oxygen content (≤15 ppm), high dimensional stability, good air-tightness and an air leakage rate≤1.0×10.sup.−10 Pa m.sup.3/s after hydrogen annealing.

Disclosed is a nano dispersion copper alloy with high air-tightness and low free oxygen content and a brief manufacturing process thereof, wherein alloy comprises the following components: Al.sub.2O.sub.3, Ca and La. The manufacturing process comprises the following steps of: preparing Cu—Al.sub.2O.sub.3 alloy powder by an internal oxidation method; mixing the Cu—Al.sub.2O.sub.3 alloy powder with Cu—Ca—La alloy powder; sheathing the mixed powder under protection of argon; performing hot extrusion and then rotary forging; vacuumizing the sheath after the rotary forging; and sealing and placing the sheath in a nitrogen atmosphere with a temperature of 450° C. to 550° C. and a pressure intensity of 40 Mpa to 60 Mpa for 3 hours to 5 hours. The dispersion copper prepared by the present disclosure has the advantages of low free oxygen content (≤15 ppm), high dimensional stability, good air-tightness and an air leakage rate≤1.0×10.sup.−10 Pa m.sup.3/s after hydrogen annealing.