Patent classifications
B22F2201/04
SPUTTERING TARGET AND METHOD FOR MANUFACTURING SAME
A sputtering target, which has a component composition including: 30.0-67.0 atomic % of Ga; and the Cu balance containing inevitable impurities, wherein the sputtering target is a sintered material having a structure in which θ phases made of Cu—Ga alloy are dispersed in a matrix of the γ phases made of Cu—Ga alloy, is provided.
METHOD AND SYSTEM FOR PRODUCING FUNCTIONALLY GRADED STRUCTURES IN POWDER BED FUSION PROCESSING
Methods and systems comprise new design procedures that can be implemented for additive manufacturing technologies that involve evaluation of stress concentration sites using finite element analysis and implementation of scanning strategies during fabrication that improve performance by spatially adjusting thermal energy at potential failure sites or high stress regions of a part.
METHOD AND SYSTEM FOR PRODUCING FUNCTIONALLY GRADED STRUCTURES IN POWDER BED FUSION PROCESSING
Methods and systems comprise new design procedures that can be implemented for additive manufacturing technologies that involve evaluation of stress concentration sites using finite element analysis and implementation of scanning strategies during fabrication that improve performance by spatially adjusting thermal energy at potential failure sites or high stress regions of a part.
Reactive metal powders in-flight heat treatment processes
There are provided reactive metal powder in-flight heat treatment processes. For example, such processes comprise providing a reactive metal powder; and contacting the reactive metal powder with at least one additive gas while carrying out said in-flight heat treatment process, thereby obtaining a raw reactive metal powder.
Reactive metal powders in-flight heat treatment processes
There are provided reactive metal powder in-flight heat treatment processes. For example, such processes comprise providing a reactive metal powder; and contacting the reactive metal powder with at least one additive gas while carrying out said in-flight heat treatment process, thereby obtaining a raw reactive metal powder.
THREE-DIMENSIONAL PRINTING
Described herein are kits, methods, and systems for printing metal three-dimensional objects. In an example, described is a multi-fluid kit for three-dimensional printing comprising: a first fluid comprising a first liquid vehicle comprising metal or metal precursor particles; and a second fluid comprising a second liquid vehicle comprising latex polymer particles dispersed therein, wherein the latex polymer particles have an average particle size of from about 10 nm to about 300 nm, and wherein the metal or metal precursor particles comprise metal nanoparticles, metal oxide nanoparticles, metal oxide nanoparticles and a reducing agent, or combinations thereof.
THREE-DIMENSIONAL PRINTING
Described herein are kits, methods, and systems for printing metal three-dimensional objects. In an example, described is a multi-fluid kit for three-dimensional printing comprising: a first fluid comprising a first liquid vehicle comprising metal or metal precursor particles; and a second fluid comprising a second liquid vehicle comprising latex polymer particles dispersed therein, wherein the latex polymer particles have an average particle size of from about 10 nm to about 300 nm, and wherein the metal or metal precursor particles comprise metal nanoparticles, metal oxide nanoparticles, metal oxide nanoparticles and a reducing agent, or combinations thereof.
JOINING MATERIAL FOR BONDING OVERLAPPING COMPONENTS OF POWER ELECTRONIC DEVICES
A joining material for bonding overlapping components of a power electronic device together via a liquid phase sintering process. The joining material includes a mixture of composite particles. Each of the composite particles exhibits a core-shell structure having a core made of a copper-based material and a shell surrounding the core that is made of a low melting point material having a melting temperature or a solidus temperature less than that of the copper-based material of the core. The mixture of composite particles includes a first particulate fraction having a first median particle size and a second particulate fraction having a second median particle size. The first median particle size is at least one order of magnitude larger than the second median particle size.
JOINING MATERIAL FOR BONDING OVERLAPPING COMPONENTS OF POWER ELECTRONIC DEVICES
A joining material for bonding overlapping components of a power electronic device together via a liquid phase sintering process. The joining material includes a mixture of composite particles. Each of the composite particles exhibits a core-shell structure having a core made of a copper-based material and a shell surrounding the core that is made of a low melting point material having a melting temperature or a solidus temperature less than that of the copper-based material of the core. The mixture of composite particles includes a first particulate fraction having a first median particle size and a second particulate fraction having a second median particle size. The first median particle size is at least one order of magnitude larger than the second median particle size.
BUILDING AN OBJECT WITH A THREE-DIMENSIONAL PRINTER USING BURST MODE JETTING
A three-dimensional (3D) printer includes an ejector and a coil wrapped at least partially around the ejector. The 3D printer also includes a power source configured to transmit voltage pulses to the coil. The 3D printer also includes a computing system configured to cause the power source to transmit the voltage pulses to the coil in intermittent bursts. The voltage pulses in each burst occur at a burst frequency from about 60 Hz to about 2000 Hz. The coil causes a drop of printing material to be jetted through a nozzle of the ejector in response to each voltage pulse. The drops generated in response to the voltage pulses in each burst land at substantially a same location in a horizontal plane.