A layered modeling method for laser metal deposition (LIVID) 3D printing. The layered modeling method includes: obtaining estimated printing parameters of each layer in an entire digital model based on a process database; obtaining estimated feature points of each layer through the estimated parameters; comparing estimated feature points of each layer with feature points of a corresponding actual shape to obtain a difference in each layer; and accumulating to obtain a difference in the entire digital model to obtain corresponding printing parameters. The layered modeling method has the advantages of effectively reducing the calculation amount during data comparison and greatly saving time.

A cermet, as a base, containing a plurality of hard particles and a bonded phase between the plurality of hard particles. Each of the plurality of hard particles, when viewed in cross section, includes a first region containing Ti, N, and C, and contains a titanium carbonitride phase as a main constituent. Each of the plurality of hard particles, when viewed in cross-section, includes a second region containing one or more metal elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Co, and Ni in a larger amount than the first region. The content of the one or more metal elements in the second region is 9.5 mass % or more in a total amount. A cutting tool has a length extending from a first end to a second end, and includes a holder and the insert described above.

A cermet, as a base, containing a plurality of hard particles and a bonded phase between the plurality of hard particles. Each of the plurality of hard particles, when viewed in cross section, includes a first region containing Ti, N, and C, and contains a titanium carbonitride phase as a main constituent. Each of the plurality of hard particles, when viewed in cross-section, includes a second region containing one or more metal elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Co, and Ni in a larger amount than the first region. The content of the one or more metal elements in the second region is 9.5 mass % or more in a total amount. A cutting tool has a length extending from a first end to a second end, and includes a holder and the insert described above.

The present invention relates to a low-temperature sinterable copper particle material prepared using an electride and an organic copper compound and a preparation method therefor and, more particularly, to a copper nanoparticle which can be useful as a conductive copper ink material thanks to its small size and high dispersibility, and a method for preparing the copper nanoparticle by reducing an organic copper compound with an electride as a reducing agent. The present invention provides copper nanoparticles which can be suitably used as a conductive copper nanoink material because the copper nanoparticles show the restrained oxidation of the copper, have an average particle diameter of around 5 nm to cause the depression of melting point, are of high dispersibility, and allow the removal of the electride in a simple ultrasonication process. The prepared copper nanoparticles can be useful as an oxidation preventing protector or conductive copper ink material which is small in particle size and high in dispersibility.

Disclosed is a method for preparing silver-copper mixed powder having a core-shell structure. The method includes: dissolving silver (Ag) and copper (Cu) in an aqueous nitric acid solution; adding a reducing agent to the solution; and preparing silver-copper mixed powder having a core-shell structure by performing plasma post-treatment, after performing the adding the reducing agent to the solution.

A sintered Nd—Fe—B magnet comprising at least one light rare earth element having a weight content between 31 wt. % and 35 wt. %, at least one heavy rare earth element having a weight content of no more than 0.2 wt. %, B having a weight content between 0.95 wt. % and 1.2 wt. %, at least one additive including Ti and having a weight content between 1.31 wt. % and 7.2 wt. %, Fe as a balance, and impurities including C, O, and N. Ti has a weight content between 0.3 wt. % and 1 wt. % and forms a Titanium-Iron-Boron phase with Fe and Boron B and being present in the sintered Nd—Fe—B magnet between 0.86 vol. % and 2.85 vol. %. The C, O, and N satisfy 630 ppm≦1.2C+0.6O+N≦3680 ppm. The sintered Nd—Fe—B magnet has a squareness factor of at least 0.95.

Described herein are methods of forming a neutron shielding material. Such material may comprise a powder blend comprising a first component comprising a blend of a first metal particle and a first ceramic particle; and a second component comprising a reinforcing chip, the reinforcing chip comprising a second ceramic particle dispersed within a chip metal matrix.

Described herein are methods of forming a neutron shielding material. Such material may comprise a powder blend comprising a first component comprising a blend of a first metal particle and a first ceramic particle; and a second component comprising a reinforcing chip, the reinforcing chip comprising a second ceramic particle dispersed within a chip metal matrix.

A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.

A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.