B22F2201/20

Tuned intricate internal distributions of material and geometry using, in whole or in part, additive manufacturing technologies and applications thereof to methods, systems, apparatuses for attenuation solidification time of encapsulated phase change materials
11241733 · 2022-02-08 ·

Phase change materials (PCM) that are used for temporary thermal energy storage (TES), and, more particularly, encapsulated PCM (ePCM) where the encapsulated material can include one or more different materials, each with melting points that are significantly higher than the PCM and which is created in whole or in part using a variety of different additive manufacturing technologies.

Tuned intricate internal distributions of material and geometry using, in whole or in part, additive manufacturing technologies and applications thereof to methods, systems, apparatuses for attenuation solidification time of encapsulated phase change materials
11241733 · 2022-02-08 ·

Phase change materials (PCM) that are used for temporary thermal energy storage (TES), and, more particularly, encapsulated PCM (ePCM) where the encapsulated material can include one or more different materials, each with melting points that are significantly higher than the PCM and which is created in whole or in part using a variety of different additive manufacturing technologies.

PROCESS FOR PRODUCING ELECTRODE MATERIAL, AND ELECTRODE MATERIAL

A process for producing an electrode material by infiltrating a highly conductive metal such as Cu into a porous object containing heat-resistant elements. Before an infiltration step in which the highly conductive metal is infiltrated, a HIP treatment is given to a powder containing the heat-resistant elements (or to a molded object obtained by molding a powder containing the heat-resistant elements). The composition is controlled so that the HIP treatment yields a porous object which has a degree of filling of 70% or higher, more preferably 75% or higher. The highly conductive metal is infiltrated into the porous object having the controlled composition.

PROCESS FOR PRODUCING ELECTRODE MATERIAL, AND ELECTRODE MATERIAL

A process for producing an electrode material by infiltrating a highly conductive metal such as Cu into a porous object containing heat-resistant elements. Before an infiltration step in which the highly conductive metal is infiltrated, a HIP treatment is given to a powder containing the heat-resistant elements (or to a molded object obtained by molding a powder containing the heat-resistant elements). The composition is controlled so that the HIP treatment yields a porous object which has a degree of filling of 70% or higher, more preferably 75% or higher. The highly conductive metal is infiltrated into the porous object having the controlled composition.

Soft magnetic flaky powder

In order to provide a soft magnetic flaky powder having high electrical resistance and high corrosion resistance, and a magnetic sheet including the same, the present invention provides a soft magnetic flaky powder, including a plurality of soft magnetic flaky particles. Each of the plurality of soft magnetic flaky particles contains an Fe-based alloy flaky particle and a coating layer formed on a surface of the Fe-based alloy flaky particle. The coating layer contains one or two or more components selected from chromic acid and a hydrate thereof, and a metal salt of an inorganic acid and a hydrate thereof. The inorganic acid is selected from sulfuric acid, nitric acid, chromic acid, phosphoric acid, hydrofluoric acid and acetic acid. The metal salt is selected from a Na salt, an Al salt, a Ti salt, a Cr salt, a Ni salt, a Ga salt and a Zr salt. The coating layer has a thickness of 10 nm or more.

METHOD AND SUPPORTS WITH POWDER REMOVAL PORTS FOR ADDITIVE MANUFACTURING
20170232670 · 2017-08-17 ·

The present disclosure generally relates to methods for additive manufacturing (AM) that utilize powder removal ports in the process of building objects, as well as novel support structures including powder removal ports to be used within these AM processes. The objects include walls defining regions of unfused powder. The powder removal ports include at least one tube aligned with an opening in the walls to allow removal of the powder. The methods include removing unfused powder from the enclosed space via the at least one tube.

METHOD AND SUPPORTS WITH POWDER REMOVAL PORTS FOR ADDITIVE MANUFACTURING
20170232670 · 2017-08-17 ·

The present disclosure generally relates to methods for additive manufacturing (AM) that utilize powder removal ports in the process of building objects, as well as novel support structures including powder removal ports to be used within these AM processes. The objects include walls defining regions of unfused powder. The powder removal ports include at least one tube aligned with an opening in the walls to allow removal of the powder. The methods include removing unfused powder from the enclosed space via the at least one tube.

3D printed end cauls for composite part fabrication

Systems and methods are provided for composite part fabrication. One embodiment is a method for fabricating a composite part. The method includes selecting an end caul comprising a structure of sintered material surrounding volumes of unsintered particles, creating a laminate comprising fibers within a resin matrix, placing the end caul in contact with an end of the laminate, and processing the laminate.

3D printed end cauls for composite part fabrication

Systems and methods are provided for composite part fabrication. One embodiment is a method for fabricating a composite part. The method includes selecting an end caul comprising a structure of sintered material surrounding volumes of unsintered particles, creating a laminate comprising fibers within a resin matrix, placing the end caul in contact with an end of the laminate, and processing the laminate.

Co—Cr—Pt-based sputtering target and method for producing same

A sputtering target containing, as metal components, 0.5 to 45 mol % of Cr and remainder being Co, and containing, as non-metal components, two or more types of oxides including Ti oxide, wherein a structure of the sputtering target is configured from regions where oxides including at least Ti oxide are dispersed in Co (non-Cr-based regions), and a region where oxides other than Ti oxide are dispersed in Cr or Co—Cr (Cr-based region), and the non-Cr-based regions are scattered in the Cr-based region. An object of this invention is to provide a sputtering target for forming a granular film which suppresses the formation of coarse complex oxide grains and generates fewer particles during sputtering.