A method for treating additive manufacturing powder particles is provided. The method includes exposing the additive manufacturing powder particles to plasma radiation, where the plasma radiation forms functional groups, on surfaces of the additive manufacturing powder particles, having molecular bonds that vibrate in response to irradiation by laser energy of an additive manufacturing process, and moving the additive manufacturing powder particles to expose the additive manufacturing powder particles to the plasma radiation.

A method for treating additive manufacturing powder particles is provided. The method includes exposing the additive manufacturing powder particles to plasma radiation, where the plasma radiation forms functional groups, on surfaces of the additive manufacturing powder particles, having molecular bonds that vibrate in response to irradiation by laser energy of an additive manufacturing process, and moving the additive manufacturing powder particles to expose the additive manufacturing powder particles to the plasma radiation.

Disclosed is a trolley sealing device for a flue gas circulation system of a sintering machine, including a cover body covering a top surface of a sintering machine trolley. A top end of the cover body is provided with communication assemblies, and the communication assemblies communicate an inner cavity of the cover body with an outside environment; two ends of the inner cavity of the cover body are fixedly connected with vertical adjusting sections respectively, and a sealing device is arranged between the vertical adjusting sections and two ends of the top surface of the sintering machine trolley; and the cover body includes a plurality of frameworks; the plurality of frameworks are arranged above the sintering machine trolley, the communication assemblies are arranged on the frameworks, and skins are fixedly connected with the frameworks; and thermal insulation layers are arranged outside the skins.

An additive manufacturing powder particle including a surface and at least one functional group formed on the surface, wherein the at least one functional group increases laser energy absorption of the additive manufacturing powder particle. The additive manufacturing particle is treated with plasma radiation to form hydroxyl functional groups on a surface of the additive manufacturing powder particle, where the hydroxyl functional groups have a molecular vibrational frequency corresponding to a laser wavenumber range of laser energy of an additive manufacturing process, and where the plasma radiation treating the additive manufacturing powder particles depends on the laser energy of the additive manufacturing process. Treating the additive manufacturing powder particle with the plasma radiation increases laser energy absorption of the additive manufacturing powder particle when the additive manufacturing particle is exposed to the laser energy, produced by a carbon dioxide laser, of the additive manufacturing process.

An additive manufacturing powder particle including a surface and at least one functional group formed on the surface, wherein the at least one functional group increases laser energy absorption of the additive manufacturing powder particle. The additive manufacturing particle is treated with plasma radiation to form hydroxyl functional groups on a surface of the additive manufacturing powder particle, where the hydroxyl functional groups have a molecular vibrational frequency corresponding to a laser wavenumber range of laser energy of an additive manufacturing process, and where the plasma radiation treating the additive manufacturing powder particles depends on the laser energy of the additive manufacturing process. Treating the additive manufacturing powder particle with the plasma radiation increases laser energy absorption of the additive manufacturing powder particle when the additive manufacturing particle is exposed to the laser energy, produced by a carbon dioxide laser, of the additive manufacturing process.

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

Disclosed is a conductive paste composition, including 100 parts by weight of copper powder, 40 to 150 parts by weight of silver powder, 0.1 to 3 parts by weight of carbon powder, 1 to 5 parts by weight of glass powder, and 5 to 15 parts by weight of binder. The conductive paste composition can be applied on a substrate, and then sintered under atmosphere at a high temperature to form an electrode on the substrate.

Disclosed is a conductive paste composition, including 100 parts by weight of copper powder, 40 to 150 parts by weight of silver powder, 0.1 to 3 parts by weight of carbon powder, 1 to 5 parts by weight of glass powder, and 5 to 15 parts by weight of binder. The conductive paste composition can be applied on a substrate, and then sintered under atmosphere at a high temperature to form an electrode on the substrate.

A porous copper sintered material (10) includes: a plurality of copper fibers (11) sintered each other, wherein the copper fibers (11) are made of copper or copper alloy, a diameter R of the copper fibers (11) is in a range of 0.02 mm or more and 1.0 mm or less, and a ratio L/R of a length L of the copper fibers to the diameter R is in a range of 4 or more and 2500 or less (11), redox layers (12) formed by redox treatment are provided on surfaces of copper fibers (11, 11), and concavities and convexities are formed by the redox layer (12), and each of redox layers (12, 12) formed on each of the copper fibers (11) is integrally bonded in a junction of the copper fibers (11).

A thick-film copper paste is made. A displacement reaction with low cost is used to precipitate nano-silver (Ag) to be grown on copper particles. Thus, the thick-film copper paste is made of the copper powder coated with nano-Ag. The paste can be sintered in the air and is increased in overall electrical conductivity. The copper inside is not oxidized. Its resistance on electromigration is good. Furthermore, the paste can be added with frit as a sintering aid to assist sintering the nano-Ag-coated copper paste. Furthermore, even in a high-temperature heat treatment, the powder of nano-Ag-coated copper is still antioxidant and can replace the silver paste used in the current market.