A lamination molding apparatus including a chamber covering a molding region; a laser beam source to emit a laser beam for sintering a material powder supplied on the molding region to form a sintered layer; and a scan unit to scan the laser beam. The laser beam has one or more spot shapes including at least an elongated shape, and the scan unit is configured to scan the laser beam, of which the spot shape is an elongated shape, in a lateral direction of the elongated shape, is provided.

A lamination molding apparatus including a chamber covering a molding region; a laser beam source to emit a laser beam for sintering a material powder supplied on the molding region to form a sintered layer; and a scan unit to scan the laser beam. The laser beam has one or more spot shapes including at least an elongated shape, and the scan unit is configured to scan the laser beam, of which the spot shape is an elongated shape, in a lateral direction of the elongated shape, is provided.

Provided are a compound, including metal atoms for forming metal nano particles through a simple process within a short time at a low production cost for commercial purposes, and a solution including the compound.

Provided are a compound, including metal atoms for forming metal nano particles through a simple process within a short time at a low production cost for commercial purposes, and a solution including the compound.

The additive fabrication processing method includes: a setting step of setting a speed command value indicating the speed of a processing head, and a metal powder supply amount command value indicating a supply amount of the metal powder corresponding to the speed command value; an acquisition step of acquiring both a speed indicating the speed of the processing head at which actually moving and an actual distance indicating a distance actually between the processing head and a surface on which spraying metal powder; and a supply amount calculation step of calculating a metal powder supply amount by correcting the metal powder supply amount command value based on the speed and the actual distance, so that a program command route and a processed surface match.

The additive fabrication processing method includes: a setting step of setting a speed command value indicating the speed of a processing head, and a metal powder supply amount command value indicating a supply amount of the metal powder corresponding to the speed command value; an acquisition step of acquiring both a speed indicating the speed of the processing head at which actually moving and an actual distance indicating a distance actually between the processing head and a surface on which spraying metal powder; and a supply amount calculation step of calculating a metal powder supply amount by correcting the metal powder supply amount command value based on the speed and the actual distance, so that a program command route and a processed surface match.

A method of preparing shape-controlled alloy particles includes dissolving a solvent in a surfactant selected to inhibit particle growth; adding a noble metal precursor and a transition metal precursor to form a mixture; irradiating the mixture with a microwave under reflux for about thirty minutes or less at an irradiation temperature of between 185° C. and 195° C.; cooling the mixture; and drying the mixture at a temperature of between 55° C. and 65° C. to obtain shape-controlled alloy particles having a uniform shape, the shape dependent upon the surfactant used.

A method of preparing shape-controlled alloy particles includes dissolving a solvent in a surfactant selected to inhibit particle growth; adding a noble metal precursor and a transition metal precursor to form a mixture; irradiating the mixture with a microwave under reflux for about thirty minutes or less at an irradiation temperature of between 185° C. and 195° C.; cooling the mixture; and drying the mixture at a temperature of between 55° C. and 65° C. to obtain shape-controlled alloy particles having a uniform shape, the shape dependent upon the surfactant used.

The present disclosure is directed to processes comprising irradiating an aggregate of chemically bonded or otherwise associated nanoparticles with a light source capable of providing multiphoton excitation, the light source directed at a focal point volume including the aggregate and having sufficient energy to disrupt or fuse the aggregate within the focal point volume to form nanoscale deposits of the nanoparticles.

The present disclosure is directed to processes comprising irradiating an aggregate of chemically bonded or otherwise associated nanoparticles with a light source capable of providing multiphoton excitation, the light source directed at a focal point volume including the aggregate and having sufficient energy to disrupt or fuse the aggregate within the focal point volume to form nanoscale deposits of the nanoparticles.