A method for printing a semiconductor material includes depositing a molten metal onto a substrate in an enclosed chamber to form a trace having a maximum height of 15 micrometers and/or a maximum width of 25 micrometers to 10 millimeters and/or a thin film having a maximum height of 15 micrometers. The method further includes reacting the molten metal with a gas phase species in the enclosed chamber to form the semiconductor material. The depositing the molten metal includes depositing a metal composition including the molten metal and an etchant or depositing the etchant separate from the molten metal in the enclosed chamber.

A method for printing a semiconductor material includes depositing a molten metal onto a substrate in an enclosed chamber to form a trace having a maximum height of 15 micrometers and/or a maximum width of 25 micrometers to 10 millimeters and/or a thin film having a maximum height of 15 micrometers. The method further includes reacting the molten metal with a gas phase species in the enclosed chamber to form the semiconductor material. The depositing the molten metal includes depositing a metal composition including the molten metal and an etchant or depositing the etchant separate from the molten metal in the enclosed chamber.

A three-dimensional shaping apparatus includes a plasticizing section that forms a plasticized material, a flow channel for the plasticized material, a nozzle having an ejection port, from which the plasticized material is ejected to a shaping region, a position changing mechanism that changes a relative position of the nozzle to the table, a pressure measurement section that measures a pressure in the flow channel, and a cleaning mechanism that is provided in a cleaning region different from the shaping region and cleans the ejection port, wherein a cleaning process for causing the cleaning mechanism to perform cleaning by suspending a shaping process in the middle of the shaping process, and moving the nozzle to the cleaning region is executed, and the shaping process is resumed when the pressure is measured to be a reference value or less by the pressure measurement section after executing the cleaning process.

A three-dimensional shaping apparatus includes a plasticizing section that forms a plasticized material, a flow channel for the plasticized material, a nozzle having an ejection port, from which the plasticized material is ejected to a shaping region, a position changing mechanism that changes a relative position of the nozzle to the table, a pressure measurement section that measures a pressure in the flow channel, and a cleaning mechanism that is provided in a cleaning region different from the shaping region and cleans the ejection port, wherein a cleaning process for causing the cleaning mechanism to perform cleaning by suspending a shaping process in the middle of the shaping process, and moving the nozzle to the cleaning region is executed, and the shaping process is resumed when the pressure is measured to be a reference value or less by the pressure measurement section after executing the cleaning process.

Provided is a method for controlling generation of scaling in a reaction vessel to reduce time and cost required for removal of the scaling in the process of producing nickel powder from a solution containing a nickel ammine sulfate complex. This is a method for producing nickel powder, including: adding, to the solution containing the nickel ammine sulfate complex, seed crystals in an amount of 0.3 times or more and 3 times or less the weight of nickel in the solution to form a slurry; and blowing hydrogen gas into the slurry to reduce a nickel complex ion and to thereby form a nickel precipitate.

Provided is a method for controlling generation of scaling in a reaction vessel to reduce time and cost required for removal of the scaling in the process of producing nickel powder from a solution containing a nickel ammine sulfate complex. This is a method for producing nickel powder, including: adding, to the solution containing the nickel ammine sulfate complex, seed crystals in an amount of 0.3 times or more and 3 times or less the weight of nickel in the solution to form a slurry; and blowing hydrogen gas into the slurry to reduce a nickel complex ion and to thereby form a nickel precipitate.

The present disclosure relates to the field of additive manufacturing and superalloys, particularly to a method for eliminating cracks in René 104 nickel-based superalloy prepared by laser additive manufacturing. For solving the problem that cracks are easily generated during laser additive manufacturing of René 104 nickel-based superalloy with high content of Al and Ti (Al+Ti>5 wt. %), generation of large-size cracks inside a fabricated part is suppressed by means of designing laser forming parameters and a partition scanning strategy; then stress relief annealing is performed to completely eliminate residual stress inside the fabricated part; and a spark plasma sintering process is performed to eliminate cracks inside the fabricated part and suppress the growth of grains during the sintering process.

The present disclosure relates to the field of additive manufacturing and superalloys, particularly to a method for eliminating cracks in René 104 nickel-based superalloy prepared by laser additive manufacturing. For solving the problem that cracks are easily generated during laser additive manufacturing of René 104 nickel-based superalloy with high content of Al and Ti (Al+Ti>5 wt. %), generation of large-size cracks inside a fabricated part is suppressed by means of designing laser forming parameters and a partition scanning strategy; then stress relief annealing is performed to completely eliminate residual stress inside the fabricated part; and a spark plasma sintering process is performed to eliminate cracks inside the fabricated part and suppress the growth of grains during the sintering process.

Various examples of the present disclosure provide a manufacturing system and method for providing a variable pressure environment, which are applied to additive manufacturing and subtractive manufacturing, such as metal-based additive and subtractive manufacturing, hybrid additive and subtractive manufacturing, or ultrasonic hybrid additive manufacturing, etc. According to the examples of the present disclosure, a variable pressure environment is provided within the seal pressure vessel so as to implement the manufacturing process in the hyperbaric pressure environment. Thus, for a manufacturing process using metals as raw materials, various issues caused by metallurgical defects of the metals can be effectively suppressed. The storage vessel of the inert gas is safe and stable to the hyperbaric pressure environment, so that a manufacturing process applying a continuous and uniform hyperbaric pressure is achieved. In addition, the examples of the present disclosure perform temperature control on the hyperbaric pressure environment to ensure temperature stability of the hyperbaric pressure environment. Moreover, a solid self-lubrication mode is used in the manufacturing system, so as to avoid oil and grease lubrication from splashing in the vacuum environment to pollute the manufacturing environment, and thus the manufacturing system can work normally in the hyperbaric pressure environment.

Various examples of the present disclosure provide a manufacturing system and method for providing a variable pressure environment, which are applied to additive manufacturing and subtractive manufacturing, such as metal-based additive and subtractive manufacturing, hybrid additive and subtractive manufacturing, or ultrasonic hybrid additive manufacturing, etc. According to the examples of the present disclosure, a variable pressure environment is provided within the seal pressure vessel so as to implement the manufacturing process in the hyperbaric pressure environment. Thus, for a manufacturing process using metals as raw materials, various issues caused by metallurgical defects of the metals can be effectively suppressed. The storage vessel of the inert gas is safe and stable to the hyperbaric pressure environment, so that a manufacturing process applying a continuous and uniform hyperbaric pressure is achieved. In addition, the examples of the present disclosure perform temperature control on the hyperbaric pressure environment to ensure temperature stability of the hyperbaric pressure environment. Moreover, a solid self-lubrication mode is used in the manufacturing system, so as to avoid oil and grease lubrication from splashing in the vacuum environment to pollute the manufacturing environment, and thus the manufacturing system can work normally in the hyperbaric pressure environment.