A device for the additive manufacturing of a shaped body comprising: a process chamber for a material for making the shaped body; a plurality of bar elements defining at least a partial region of the process chamber, wherein each of the plurality of bar elements is movable in relation to one another; and a sensor associated with at least one of the plurality of bar elements detecting forces and/or torques acting on the at least one bar element.

A spray forming method for producing a metallic ingot and metallic powder from a metallic source of metal or metal alloy includes: forming one or more streams of metal or alloy from the source, gas atomizing one or more streams of metal or alloy to form one or more sprays of atomized droplets, directing the spray(s) of droplets through a spray nozzle to a rotatable hot body, depositing the droplets to the hot body to form the ingot, controlling the process parameters 1) temperature of metal or alloy, 2) inlet and outlet pressure of the spray nozzle, 3) rotation speed of the hot body, and/or 4) distance between the hot body and the spray(s) of droplets, and collecting the metallic powder having a predefined size distribution. The process parameters are controlled such that the ingot yield is 60-80% and the metallic powder yield is 40-20%, relative to the metallic source.

A method for printing a semiconductor material includes depositing a molten metal onto a substrate in an enclosed chamber to form a trace having a maximum height of 15 micrometers and/or a maximum width of 25 micrometers to 10 millimeters and/or a thin film having a maximum height of 15 micrometers. The method further includes reacting the molten metal with a gas phase species in the enclosed chamber to form the semiconductor material. The depositing the molten metal includes depositing a metal composition including the molten metal and an etchant or depositing the etchant separate from the molten metal in the enclosed chamber.

A method for printing a semiconductor material includes depositing a molten metal onto a substrate in an enclosed chamber to form a trace having a maximum height of 15 micrometers and/or a maximum width of 25 micrometers to 10 millimeters and/or a thin film having a maximum height of 15 micrometers. The method further includes reacting the molten metal with a gas phase species in the enclosed chamber to form the semiconductor material. The depositing the molten metal includes depositing a metal composition including the molten metal and an etchant or depositing the etchant separate from the molten metal in the enclosed chamber.

A tool and die set and related method of use of the tool and die set in a press for the compaction of a powder metal into a preform involves an uneven amount of positional deflection of at least two lower or upper tool members. This asymmetrical elastic response under load may help to eliminate cracking of the part after the compressive load is removed.

A tool and die set and related method of use of the tool and die set in a press for the compaction of a powder metal into a preform involves an uneven amount of positional deflection of at least two lower or upper tool members. This asymmetrical elastic response under load may help to eliminate cracking of the part after the compressive load is removed.

A method in a pressing arrangement is disclosed. The pressing arrangement comprises a pressure vessel arranged to hold pressure medium therein during use of the pressing arrangement, the pressure vessel including a treatment region therein, wherein the treatment region is arranged to accommodate at least one article. The pressing arrangement is arranged so that pressure medium can enter and exit the treatment region. The pressing arrangement comprises at least one controllable pressure medium supplying device configured to transport pressure medium during a cooling phase from another region in the pressing arrangement to the treatment region, wherein the temperature of the pressure medium in the other region is lower than the temperature of the pressure medium in the treatment region during at least part of the cooling phase. At least one value indicative of at least one temperature in the pressure vessel is obtained. Based on the at least one value indicative of at least one temperature in the pressure vessel, at least one operational parameter of the at least one controllable pressure medium supplying device is adjusted, whereby the pressure medium supplying rate of the at least one pressure medium supplying device is adjusted. A pressing arrangement in which the method may be carried out is also disclosed.

A pressing arrangement for treatment of articles by hot pressing includes a pressure vessel including a furnace chamber and a furnace to hold the articles. A fan circulates a pressure medium within the furnace chamber, and enhances an inner convection loop at a load compartment. The inner convection loop pressure medium has an upward flow through the load compartment, and a downward flow along a peripheral portion of the furnace chamber. A flow generator generates a flow of pressure medium into the load compartment downstream the fan to enhance the inner convection loop. The flow is generated by transporting the pressure medium upwards from a space below a bottom insulating portion and above a bottom end portion, and by injecting the pressure medium into the load compartment downstream the fan to enhance the inner convection loop.

A pressing arrangement for treatment of articles by hot pressing includes a pressure vessel including a furnace chamber and a furnace to hold the articles. A fan circulates a pressure medium within the furnace chamber, and enhances an inner convection loop at a load compartment. The inner convection loop pressure medium has an upward flow through the load compartment, and a downward flow along a peripheral portion of the furnace chamber. A flow generator generates a flow of pressure medium into the load compartment downstream the fan to enhance the inner convection loop. The flow is generated by transporting the pressure medium upwards from a space below a bottom insulating portion and above a bottom end portion, and by injecting the pressure medium into the load compartment downstream the fan to enhance the inner convection loop.

The purpose of the present invention is to obtain an additive manufacturing device capable of manufacturing while reducing the flow rate of Ar gas. This additive manufacturing device is characterized in that a reduced-pressure atmosphere is maintained in a manufacturing area, an inert gas is supplied to the manufacturing area, the proportion of gaseous impurities in the manufacturing area is detected, and in case where the proportion of gaseous impurities exceeds a threshold value, the supply of inert gas is reduced.