B22F2301/10

BONDING MATERIAL, METHOD FOR PRODUCING BONDING MATERIAL, AND BONDED BODY
20230037164 · 2023-02-02 ·

One object of the present invention is to provide a bonding material capable of forming a highly reliable bond, the present invention provides a bonding material having a plate shape or a sheet shape, wherein the bonding material includes: fine copper particles having an average particle diameter of 300 nm or less; coarse copper particles having an average particle diameter of 3 .Math.m or more and 11 .Math.m or less; and a reducing agent which reduces the fine copper particles and the coarse copper particles.

Cu-Based Alloy Powder
20220349029 · 2022-11-03 ·

Provided is a Cu-based alloy powder that is suitable for a process involving rapid melting and rapid solidification and that can provide a shaped object superior in characteristics. The powder is composed of a Cu-based alloy, which contains an element M being one or more elements selected from Cr, Fe, Ni, Zr, and Nb: 0.1% by mass or more and 10.0% by mass or less, Si: more than 0% by mass and 0.20% by mass or less, P: more than 0% by mass and 0.10% by mass or less, and S: more than 0% by mass and 0.10% by mass or less, the balance being Cu and inevitable impurities. This powder has a ratio (D50/TD) of the average particle diameter D50 (μm) thereof to the tap density TD (Mg/m.sup.3) is 0.2×10.sup.−5.Math.m.sup.4/Mg or more and 20×10.sup.−5.Math.m.sup.4/Mg or less, and has a sphericity of 0.80 or more and 0.95 or less.

JOINING MATERIAL, PRODUCTION METHOD FOR JOINING MATERIAL, AND JOINED BODY
20220347745 · 2022-11-03 ·

In the joined body (10) in which the conductor (12) and the substrate (14) are joined by the joining material (13), the joining material (13) includes a sintered body formed by sintering silver powder. A sintered body having a porosity of 8% to 30% and a surface roughness Ra of a joining surface of 500 nm or more and 3.3 μm or less is adopted.

METHOD OF PRODUCING COMPOSITE MATERIAL
20230086662 · 2023-03-23 · ·

A method of producing a composite material, the method including: preparing a mixed powder of diamond particles and copper powder particles; and generating a composite material containing diamond and copper from the mixed powder by pulsed electric current sintering with a pressure of 5 MPa or greater and 100 MPa or less applied to the mixed powder, and the mixed powder maintained at a temperature equal to or higher than 500° C. and lower than 800° C.

Sintered Valve Seat Insert and Method of Manufacture Thereof
20220349487 · 2022-11-03 · ·

A powder admixture useful for making a sintered valve seat insert includes a first iron-base powder and second iron-base powder wherein the first iron-base powder has a higher hardness than the second iron-base powder, the first iron-base powder including, in weight percent, 1-2% C, 10-25% Cr, 5-20% Mo, 15-25% Co, and 30-60 wt. % Fe, and the second iron-base powder including, in weight %, 1-1.5% C, 3-15% Cr, 5-7% Mo, 3-6% W, 1-1.7% V, and 60-85% Fe. The powder admixture can be sintered to form a sintered valve seat insert optionally infiltrated with copper.

NANOCOMPOSITE METAL MATERIAL AND METHOD FOR MANUFACTURING NANOCOMPOSITE METAL MATERIAL
20220339698 · 2022-10-27 · ·

A nanocomposite metal material includes a carrier formed of Zr and two-element metal particles supported on the carrier. The two-element metal is formed of Cu and Ni, and a degree of oxidation of the carrier is more than 31% and 100% or less. In a case where the nanocomposite metal material is disposed in a reaction furnace of a thermal reactor, the inside of the reaction furnace is brought into a vacuum state, and the inside of the reaction furnace is heated to a temperature range of 250° C. or higher and 350° C. or lower with a heating mechanism included in the thermal reactor while supplying at least one of hydrogen gas and deuterium gas into the reaction furnace, excessive heat of the nanocomposite metal material is 100 W/kg or more.

Conductive supporting member and method for producing the same

A conductive supporting member includes an outer portion that includes a Cu matrix phase and a second phase dispersed in the Cu matrix phase and containing a Cu—Zr compound and that has an alloy composition represented by Cu-xZr (x is atomic % of Zr and 0.5≤x≤16.7 is satisfied) and an inner portion that is present on an inner side of the outer portion, is formed of a metal containing Cu, and has higher conductivity than the outer portion.

High melting point metal or alloy powders atomization manufacturing processes
11607732 · 2023-03-21 · ·

There are provided high melting point metal or alloy powder atomization manufacturing processes comprising providing a melt of the high melting point metal or alloy through a feed tube; diverting the melt at a diverting angle with respect to a central axis of the feed tube to obtain a diverted melt; directing the diverted melt to an atomization area; and providing at least one atomization gas stream to the atomization area. The atomization process can be carried out in the presence of water within an atomization chamber used for the atomization process.

METHODS FOR TREATING METAL NANOCRYSTALS AND FOR FORMING BULK NANOSTRUCTURED METAL ALLOYS

Methods of treating metal nanocrystals are provided. In embodiments, such a method comprises exposing metal nanocrystals comprising a metal and characterized by at least one twinning boundary therein, to a plating solution comprising a reducing agent and coating metal cations comprising a different metal, under conditions to form a coating of the different metal on surfaces of the metal nanocrystals via electroless deposition by chemical reduction of the coating metal cations, thereby providing coated metal nanocrystals. Methods of forming bulk nanostructured metal alloys from the coated metal nanocrystals are also provided.

THREE-DIMENSIONAL (3D) PRINTING

The present disclosure relates to a kit for 3D printing a 3D printed metal object. The kit comprises build material comprising metal particles; and a binding agent. The binding agent comprises a hydrated metal salt having a dehydration temperature of from 100 to about 250° C., and water. The binding agent may be either free from organic solvent and surfactant, or the binding agent comprises organic solvent and/or surfactant and the total amount of organic solvent and/or surfactant is less than 3 weight % based on the total weight of the binding agent.