Patent classifications
B22F2301/10
FIBER WITH METAL IONS EXCITED BY LUMINOUS ENERGY AND MANUFACTURING METHOD THEREOF
A fiber with metal ions excited by luminous energy and a manufacturing method thereof are provided. The method includes: adding dry copper nanopowder with a particle size not more than 48 nm after mixing to a fiber slurry, to form a first mixed liquid; mixing and stirring the first mixed liquid and an additive, and performing an electrochemical reaction, to form a second mixed liquid, where the additive contains at least one of graphene, Ge ions, and Zr ions; performing energy exciting on the second mixed liquid, to form a mixed material; drying the mixed material, to remove moisture contained in the mixed material; extruding at least one fibril from the mixed material by using a spinning device; passing the at least one fibril through a plurality of rollers and performing stretching; and performing cooling and shaping on at least one stretched fibril, to form a final fiber product.
Method for manufacturing sintered component and sintered component
A method for manufacturing a sintered component includes a step of making a green compact having a relative density of at least 88% by compression-molding a base powder containing a metal powder into a metallic die, a step of machining a groove part having a groove width of 1.0 mm or less in the green compact by processing groove with a cutting tool, and a step of sintering the green compact in which the groove part is formed after the step of forming the groove part.
Process and device for low-temperature pressure sintering
Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.
COPPER OXIDE PASTE AND METHOD FOR PRODUCING ELECTRONIC PARTS
Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.
ALLOYED STEEL POWDER FOR POWDER METALLURGY, IRON-BASED MIXED POWDER FOR POWDER METALLURGY, AND SINTERED BODY
Provided is an alloyed steel powder for powder metallurgy which has excellent compressibility and can be used to produce a sintered body that obtains improved strength simply by sintering. The alloyed steel powder for powder metallurgy contains Cu: 1.0 mass % or more and 8.0 mass % or less, Mo: more than 0.50 mass % and 2.00 mass % or less, and at least one selected from the group consisting of V: 0.05 mass % or more and 0.50 mass % or less, Nb: 0.02 mass % or more and 0.40 mass % or less, and Ti: 0.02 mass % or more and 0.40 mass % or less, with the balance consisting of Fe and inevitable impurities.
BONDING SHEET
Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet (1) contains a copper particle (2) and a solvent (3) having a boiling point of 150° C. or higher, in which the copper particle (2) has a surface covered with an organic protective film, the content ratio of the copper particle (2) to the solvent (3) is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle (2) is in the range of 50 nm to 300 nm both inclusive.
COPPER PARTICLES AND METHOD FOR PRODUCING SAME
Copper particles are provided that each include a core particle made of copper and a coating layer that coats the surface of the core particle, wherein the coating layer is made of a copper salt of an aliphatic organic acid. It is also preferable that the copper particles have an infrared absorption peak in a range of 1504 to 1514 cm.sup.−1 and no infrared absorption peak in a range of 1584 to 1596 cm.sup.−1. It is also preferable that, in thermogravimetric analysis of the copper particles, the temperature at which the ratio of the mass loss value to the mass loss value at 500° C. reaches 10% is from 150° C. to 220° C. A method is also provided for producing copper particles, the method including bringing core particles made of copper into contact with a solution containing a copper salt of an aliphatic organic acid to thereby coat the surface of the core particles.
Method for preparing dispersed metal nanoparticles and metal nanoparticles prepared thereby
The present disclosure relates to a dispersed metal nanoparticle synthesis method and metal nanoparticles prepared thereby. Specifically, the present disclosure relates to a method of effectively preparing a dispersed metal nanoparticle using Taylor vortex flow even when using a small amount of stabilizer or using no stabilizer, and well-dispersed nanoparticles obtained thereby.
SILVER SINTERING COMPOSITION CONTAINING COPPER ALLOY FOR METAL BONDING
This invention relates to a silver sintering composition. In particular, the present invention relates to a silver sintering composition containing a copper alloy, which is capable of being stably sintered on various metal substrates such as copper, gold or silver with good adhesion and sintering strength.
SLIDING MEMBER AND METHOD FOR PRODUCING SAME
Provided is a method for producing a sliding member formed by impregnating a porous base member made of a bronze-based alloy with a resin material, the sliding member including a sliding surface where both the porous base member and the resin material are exposed, the method including: a step of preparing a back metal layer; a porous base member formation step of forming the porous base member by depositing particles of the bronze-based alloy on a surface of the back metal layer and sintering the particles; an impregnation step of impregnating the porous base member with the resin material; a deformation step of deforming an end edge of the back metal layer in a direction away from the sliding surface; and a cutting step of cutting the porous base member impregnated with the resin material to form the sliding surface.